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Job @ NXP: Mechanical Engineer

Status details

Status:Closed
Announced:21 Jul 2020
Closing date:19 Sep 2020

NXP Package Innovation is a global organization responsible for the design of new packaging products and the development of new packaging technologies and assembly processes partnering with all the businesses of NXP Semiconductors to deliver the right package for each market and application.

The semiconductor market is aggressive, growing, and highly competitive. Product development cycle times are reducing, driven by user demand for faster refreshes and continuous feature upgrades. The consequence is less schedule available to support traditional design, prototyping, and qualification methods. At the same time, greater reliability is needed in end applications to keep pace with overall content growth.

Virtual prototyping uses Finite Element Simulation methodologies to shorten development cycles and deliver optimized design solutions for semiconductor packaging. It allows us to make virtual experiments for devices that have never been built before. We can predict safe operating margins and on the other hand identify critical use conditions. Key requirement for virtual prototyping is an efficient and accurate simulation model that does consider multiple physical domains along with complex 3-D structures.

To reinforce our modeling and simulation team, we are looking for a mechanical engineer, located in Nijmegen, The Netherlands. He/she will develop simulation models of semiconductor components and assemblies, predict mechanical reliability, help identify technology limits and optimize packaging solutions aiming a first-time right product qualification.

Requirements

  • MS in Mechanical Engineering or equivalent is required.
  • PhD in Mechanical Engineering is desired.
  • Capability of independently performing mechanical simulations is required.
  • Thermal modeling skills are desired.
  • Experience with FEM software ANSYS, ABACUS or MARC/Mentat is desired.
  • Experience with programing languages like Python and/or FORTRAN is desired.
  • Understanding of semiconductor packaging technologies is preferred.
  • Strong written and verbal presentation skills are required.



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  • For more details or to apply contact Torsten Hauck: torsten.hauck AT nxp.com