dr. C. Yuan

1. Dynamic prediction of optical and chromatic performances for a light-emitting diode array based on a thermal-electrical-spectral model
   Jiajie Fan; Wei Chen; Weiyi Yuan; Xuejun Fan; Guoqi Zhang;
   Opt. Express,
   Volume 28, Issue 9, pp. 13921--13937, Apr 2020. DOI: 10.1364/OE.387660
   document

2. A tunable THz wave modulator based on graphene
   Feng Zhang; Xian-Ping Chen; Qi-qin Wei; Li-Bo Yuan; Miao Cai; Huai-Yu Ye; GuoQi Zhang Jing Xiao;
   In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018,
   2018.

3. 3D system-in-package design using stacked silicon submount technology
   Mingzhi Dong; Fabio Santagata; Robert Sokolovskij; Jia Wei; Cadmus Yuan; GuoQi Zhang;
   Microelectronics International,
   Volume 32, Issue 2, pp. 63-72, 2015.

4. Electrical-thermal-luminous-chromatic model of phosphor-converted white light-emitting diodes
   Huaiyu Ye; Sau Wee Koh; Cadmus Yuan; Henk van Zeijl; Alexander W.J. Gielen; Shi-Wei Ricky Lee; GuoQi Zhang;
   Applied Thermal Engineering,
   Volume 63, Issue 2, pp. 588-597, 2014.

5. Thermal and mechanical effects of voids within flip chip soldering in LED packages
   Yang Liu; Stanley Y.Y. Leung; Jia Zhao; Cell K.Y. Wong; Cadmus A. Yuan; GuoQi Zhang; Fenglian Sun; Liangliang Luo;
   Microelectronics Reliability,
   Volume 54, Issue 9-10, pp. 2028-2033, 2014.

6. Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging
   Yang Liu; Joost Meerwijk; Liangliang Luo; Honglin Zhang; Fenglian Sun; Cadmus A. Yuan; GuoQi Zhang;
   Journal of Materials Science: Materials in Electronics,
   Volume 25, Issue 11, pp. 4954-4959, 2014.

7. Establishment of the Mesoscale Parameters for Separation: A Nonequilibrium Molecular Dynamics Model
   Cell K. Y. Wong; S. Y. Y. Leung; R. H. Poelma; K. M. B. Jansen; C. C. A. Yuan; W. D. van Driel; GuoQi Zhang;
   In Molecular Modeling and Multiscaling Issues for Electronic Material Applications,
   Springer, 2014.

8. Correlation of activation energy between LEDs and luminaires in the lumen depreciation test
   Guangjun Lu; Yuan, C; Fan, X; GuoQi Zhang;
   In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
   pp. 1-3, 2014.

9. A novel design of heatsink-less LED base fluorescent lamp retrofit
   Y. L. Jia Zhao; Hongyu Tang; Stanley Y Y Leung; Cadmus C A Yuan; GuoQi Zhang;
   In ICEPT2014,
   2014.

10. Miniaturized particulate matter sensor for portable air quality monitoring devices
    Xueming Li; E Iervolino; F Santagata; Jia Wei; Cadmus Yuan; PM Sarro; GuoQi Zhang;
    In IEEE Sensors,
    pp. 2151-2154, 2014.

11. Influences of viscoelasticity of polybutylene terephthalate (PBT) on the thermal interface contact of LED spotlight module
    Hongyu Tang; Yu, Y; Jia, M; Leung, SYY; Qian, C; Cadmus Yuan; Zhou, X; GuoQi Zhang;
    In Proceedings of the 15th International Conference on Electronic Packaging Technology,
    pp. 1198-1201, 2014.

12. A lifetime prediction method for Solid State Lighting power converters based on SPICE models and finite element thermal simulations
    Bo Sun; Fan, X; Zhao, L; Yuan, CA; Koh, SW; GuoQi Zhang;
    In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
    pp. 1-4, 2014.

13. Thermal performance of embedded heat pipe in high power density LED streetlight module
    Hongyu Tang; Zhao, J; Li, B; Leung, SYY; Yuan, CCA; GuoQi Zhang;
    In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
    pp. 1-6, 2014.

14. Novel system-in-package design and packaging solution for solid state lighting systems
    Mingzhi Dong; Santagata, F; Jia Wei; Yuan, C; GuoQi Zhang;
    In Proceedings - 64th Electronic Components and Technology Conference,
    pp. 1192-1197, 2014.

15. Thermal Analysis of Remote Phosphor in LED Modules
    Mingzhi Dong; Jia Wei; Huaiyu Ye; Cadmus Yuan; GuoQi Zhang;
    Journal of Semiconductors,
    Volume 34, Issue 5, pp. 053007-1-3, 2013.

16. Thermal Analysis for Silicon-based Integration of LED Systems
    Mingzhi Dong; Fabio Santagata; Jia Wei; Cadmus Yuan; GuoQi Zhang;
    In 10th China International Forum on Solid State Lighting,
    2013.

17. Molecular modeling of protonic acid doping of emeraldine base polyaniline for chemical sensors
    X.P. Chen; C. Yuan; C.K.Y. Wong; H. Ye; S.Y.Y. Leung; GuoQi Zhang;
    Sensors and Actuators B: Chemical,
    Volume 174, pp. 210-216., 2012. DOI 10.1016/j.snb.2012.08.042.

18. Establishment of the coarse grained parameters for epoxy-copper interfacial separation
    C.K.Y. Wong; S.Y.Y. Leung; R.H. Poelma; K.M.B. Jansen; C.C.A. Yuan; W.D. van Driel; GuoQi Zhang;
    Journal of Applied Physics,
    Volume 111, Issue 9, pp. 094906/1-094906, May 2012. DOI 10.1063/1.4712060.

19. The mechanical properties modeling of nano-scale materials by molecular dynamics
    C. Yuan; W.D. Driel; R.H Poelma; GuoQi Zhang;
    In Molecular Modeling and Multiscaling for Electronic Material Applications,
    Springer, 2012. DOI 10.1007/978-1-4614-1728-6_8.

20. Establishment of the mesoscale parameters for epoxy-copper interfacial separation
    C.K.Y. Wong; S.Y.Y. Leung; R.H. Poelma; K.M.B. Jansen; C.C.A. Yuan; W.D. van Driel; GuoQi Zhang;
    In 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
    Lisbon, Portugal, Apr. 2012. DOI 10.1109/ESimE.2012.6191737.

21. Molecular modeling of the conductivity changes of the emeraldine base polyaniline due to protonic acid doping
    X. Chen; C. Yuan; C. Wong; GuoQi Zhang;
    In 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
    Cascais, Portugal, Apr. 2012. ISBN 978-1-4673-1511-1; DOI 10.1109/ESimE.2012.6191741.

22. Validation of forcefields in predicting the physical and thermophysical properties of emeraldine base polyaniline
    X.P. Chen; C.A. Yuan; C.K.Y. Wong; S.W. Koh; GuoQi Zhang;
    Molecular Simulation,
    Volume 37, Issue 12, pp. 990-996, Oct. 2011. DOI 10.1080/08927022.2011.562503.

23. Molecular modeling of temperature dependence of solubility parameters for amorphous polymers
    X.P. Chen; C.A. Yuan; C.K.. Wong; GuoQi Zhang;
    Journal of Molecular Modeling,
    pp. 1-9, Oct. 2011. DOI 10.1007/s00894-011-1249-3.

24. Evaluation and selection of sensing materials for carbon dioxide (CO2) sensor by molecular modeling
    X.P. Chen; C.K.Y. Wong; C.A. Yuan; GuoQi Zhang;
    In C. Tsamis; G. Kaltas (Ed.), Proc. Eurosensors XXV,
    Athens, Greece, Procedia Engineering, pp. 379-382, Sep. 2011. DOI 10.1016/j.proeng.2011.12.094.

25. Molecular Dynamics study of the traction-displacement relations of epoxy-copper interfaces
    C.K.Y. Wong; S.Y.Y. Leung; R.H. Poelma; K.M.B. Jansen; C.A. Yuan; W.D. van Driel; GuoQi Zhang;
    In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
    Linz, Austria, pp. 1-5, Apr. 2011. ISBN 978-1-4577-0106-1; DOI 10.1109/ESIME.2011.5765785.

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