prof.dr. Xuejun Fan

1. Coupling Model of Electromigration and Experimental Verification – Part I: Effect of Atomic Concentration Gradient
   Zhen Cui; Xuejun Fan; Yaqian Zhang; Sten Vollebregt; Jiajie Fan; Guoqi Zhang;
   Journal of the Mechanics and Physics of Solids,
   Volume 174, pp. 105257, 2023. DOI: 10.1016/j.jmps.2023.105257

2. Coupling Model of Electromigration and Experimental Verification – Part II: Impact of Thermomigration
   Zhen Cui; Xuejun Fan; Yaqian Zhang; Sten Vollebregt; Jiajie Fan; Guoqi Zhang;
   Journal of the Mechanics and Physics of Solids,
   Volume 174, pp. 105256, 2023. DOI: 10.1016/j.jmps.2023.105256

3. Study on Sintering Mechanism and Mechanical Properties of Nano-Cu based on Molecular Dynamics Simulation
   Cheng Qian; Dong Hu; Xu Liu; Xuejun Fan; Guoqi Zhang; Jiajie Fan;
   In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
   2023. DOI: 10.1109/EuroSimE56861.2023.10100810

4. Effect of Thermomigration on Electromigration in SWEAT Structures
   Zhen Cui; Xuejun Fan; GuoQi Zhang;
   In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
   2023. DOI: 10.1109/EuroSimE56861.2023.10100774

5. Hydrolysis Mechanism Analysis of (Ca, Sr)AlSiN₃:Eu²⁺ Red Phosphor Aged Under Pressure Cooker Test and 85°C&85%RH Test: Kinetics Modeling and First-principles Calculation
   Minzhen Wen; Baotong Guo; Shanghuan Chen; Xiao Hu; Xuejun Fan; Guoqi Zhang; Jiajie Fan;
   In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
   2023. DOI: 10.1109/EuroSimE56861.2023.10100750

6. Effect of Passivation and Mechanical Constraint on Electromigration in Interconnect
   Xuejun Fan; Zhen Cui; GuoQi Zhang;
   In Proc. of Electronic Components and Technology Conference (ECTC),
   2023.

7. Thermal-Mechanical-Electrical Co-Design of Fan-Out Panel-Level SiC MOSFET Packaging with a Multi-Objective Optimization Algorithm
   Wei Chen; Xuyang Yan; Jiajie Fan; Mesfin S. Ibrahim; Jing Jiang; Xuejun Fan; Guoqi Zhang;
   In Proc. of Electronic Components and Technology Conference (ECTC),
   2023.

8. Reliability of Organic Compounds in Microelectronics and Optoelectronics
   Willem Dirk van Driel; Maryam Yazdan Mehr; Xuejun Fan; GuoQi Zhang (Ed.);
   Springer, , 2022. DOI: 10.1007/978-3-030-81576-9

9. Insights into the high-sulphur aging of sintered silver nanoparticles: An experimental and ReaxFF study
   Dong Hu; Tijian Gu; Zhen Cui; Sten Vollebregt; Xuejun Fan; Guoqi Zhang; Jiajie Fan;
   Corrosion Science,
   pp. 109846, 2021. DOI: 10.1016/j.corsci.2021.109846

10. Design of a Fan-Out Panel-Level SiC MOSFET Power Module Using Ant Colony Optimization-Back Propagation Neural Network
    Qian, Yichen; Hou, Fengze; Fan, Jiajie; Lv, Quanya; Fan, Xuejun; Zhang, Guoqi;
    IEEE Transactions on Electron Devices,
    Volume 68, Issue 7, pp. 3460-3467, 2021. DOI: 10.1109/TED.2021.3077209

11. Room temperature ppt-level NO2 gas sensor based on SnOx/SnS nanostructures with rich oxygen vacancies
    Hongyu Tang; Chenshan Gao; Huiru Yang; Leandro Nicolas Sacco; Robert Sokolovskij; Hongze Zheng; Huaiyu Ye; Sten Vollebregt; Hongyu Yu; Xuejun Fan; Guoqi Zhang;
    2D Materials,
    2021. DOI: 10.1088/2053-1583/ac13c1

12. System level reliability assessment for high power light-emitting diode lamp based on a Bayesian network method
    Mesfin Seid Ibrahim; Jiajie Fan; Winco K.C. Yung; Zhou Jing; Xuejun Fan; Willem van Driel; Guoqi Zhang;
    Measurement,
    Volume 176, pp. 109191, 2021. DOI: 10.1016/j.measurement.2021.109191
    document

13. Constitutive Modeling of Sintered Nano-silver Particles: A Variable-order Fractional Model versus an Anand Model
    Fan, Jiajie; Gu, Tijian; Wang, Ping; Cai, Wei; Fan, Xuejun; Zhang, Guoqi;
    In 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    pp. 1-4, 2021. DOI: 10.1109/EuroSimE52062.2021.9410807

14. Microchannel Thermal Management System with Two-Phase Flow for Power Electronics over 500 W/cm2 Heat Dissipation
    Fengze Hou; Hengyun Zhang; Dezhu Huang; Jiajie Fan; Fengman Liu; Tingyu Lin; Liqiang Cao; Xuejun Fan; Braham Ferreira; GuoQi Zhang;
    IEEE Transactions on Power Electronics,
    Volume 35, Issue 10, pp. 10592-10600, 2020. DOI: 10.1109/TPEL.2020.2985117

15. The interface adhesion of CaAlSiN3: Eu2+ phosphor/silicone used in light-emitting diode packaging: a first principles study
    Zhen Cui; Jiajie Fan; Hendrik Joost van Ginkel; Xuejun Fan; GuoQi Zhang;
    Applied Surface Science,
    2020. DOI: 10.1016/j.apsusc.2020.145251

16. Thermal kinetic and mechanical behaviors of pressure-assisted Cu nanoparticles sintering: A molecular dynamics study
    Dong Hu; Zhen Cui; Jiajie Fan; Xuejun Fan; Guoqi Zhang;
    Results in Physics,
    2020.
    document

17. Dynamic prediction of optical and chromatic performances for a light-emitting diode array based on a thermal-electrical-spectral model
    Jiajie Fan; Wei Chen; Weiyi Yuan; Xuejun Fan; Guoqi Zhang;
    Opt. Express,
    Volume 28, Issue 9, pp. 13921--13937, Apr 2020. DOI: 10.1364/OE.387660
    document

18. Effect of porous Cu addition on the microstructure and mechanical properties of SnBi-xAg solder joints
    Yang Liu; Boqiao Ren; Min Zhou; Yuxiong Xue; Xianghua Zeng; Fenglian Sun; Xuejun Fan; GuoQi Zhang;
    Applied Physics A,
    Volume 126, Issue 9, pp. 735, August 2020. DOI: 10.1007/s00339-020-03926-3
    document

19. Machine Learning and Digital Twin Driven Diagnostics and Prognostics of Light‐Emitting Diodes
    Mesfin Seid Ibrahim; Jiajie Fan; Winco K. C. Yung; Alexandru Prisacaru; Willem D. van Driel; Xuejun Fan; GuoQi Zhang;
    Laser and Photonics Reviews,
    Volume 14, Issue 12, Dec 2020. DOI: 10.1002/lpor.202000254
    document

20. Machine-Learning Assisted Prediction of Spectral Power Distribution for Full-Spectrum White Light-Emitting Diode
    Jiajie Fan; Yutong Li; Irena Fryc; Cheng Qian; Xuejun Fan; GuoQi Zhang;
    IEEE Photonics Journal,
    Volume 12, Issue 1, pp. 1-18, Feb 2020. DOI: 10.1109/JPHOT.2019.2962818

21. Lifetime Prediction of Ultraviolet Light-Emitting Diodes Using a Long Short-Term Memory Recurrent Neural Network
    Zhou Jing; Jie Liu; Mesfin Seid Ibrahim; Jiajie Fan; Xuejun Fan; GuoQi Zhang;
    IEEE Electron Device Letters,
    Volume 41, Issue 12, pp. 1817-1820, 2020. DOI: 10.1109/LED.2020.3034567

22. Implementation of General Coupling Model of Electromigration in ANSYS
    Zhen Cui; Xuejun Fan; GuoQi Zhang;
    In IEEE 70th Electronic Components and Technology Conference (ECTC),
    2020.
    document

23. Hydrolysis kinetic study of CaAlSiN3:Eu2+ red phosphor with both water immersion test and first-principles calculation
    Jiajie Fan; Ling Zhou; Zhen Cui; Shanghuan Chen; Xuejun Fan; GuoQi Zhang;
    Journal of Luminescence,
    Volume 219, pp. 116874, 2019. DOI: 10.1016/j.jlumin.2019.116874
    document

24. A Reliability Prediction Methodology for LED Arrays
    Bo Sun; Jiajie Fan; Xuejun Fan; GuoQi Zhang; Guohao Zhang;
    IEEE Access,
    Volume 7, pp. 8127-8134, 2019.

25. Effects of sintering pressure on the densification and mechanical properties of nanosilver double side sintered power module
    Hao Zhang; Yang Liu; Lingen Wang; Fenglian Sun; Jiajie Fan; Mark D. Placette; Xuejun Fan; GuoQi Zhang;
    IEEE Transactions on Components, Packaging and Manufacturing Technology,
    2019. DOI: 10.1109/TCPMT.2018.2884032

26. Tunable electronic and optical properties of the WS2/IGZO heterostructure via an external electric field and strain: A theoretical study
    Hongyu Tang; Chunjian Tan; Huiru Yang; Kai Zheng; Yutao Li; Huaiyu Ye; Xianping Chen; Xuejun Fan; Tianling Ren; Kuochi Zhang;
    Physical Chemistry Chemical Physics,
    pp. 14713-14721, 2019. DOI: 10.1039/c9cp02084e

27. Ultra-High Sensitive NO2 Gas Sensor Based on Tunable Polarity Transport in CVD-WS2/IGZO p-N Heterojunction
    Hongyu Tang; Yutao Li; Robert Sokolovskij; Leandro Sacco; Hongze Zheng; Huaiyu Ye; Hongyu Yu; Xuejun Fan; He Tian; Tian-Ling Ren; GuoQi Zhang;
    ACS Applied Materials and Interfaces,
    pp. 40850-40859, 2019. DOI: 10.1021/acsami.9b13773

28. Stress analysis of pressure-assisted sintering for the double-side assembly of power module
    Yang Liu; Hao Zhang; Lingen Wang; Xuejun Fan; GuoQi Zhang; Fenglian Sun;
    Soldering and Surface Mount Technology,
    2019. DOI: 10.1108/SSMT-01-2018-0005

29. Indentation hardness, plasticity and initial creep properties of nanosilver sintered joint
    Hao Zhang; Yang Liu; Lingen Wang; Fenglian Sun; Xuejun Fan; GuoQi Zhang;
    Results in Physics,
    Volume 12, pp. 712-717, 2019. DOI: 10.1016/j.rinp.2018.12.026

30. High-performance humidity sensor using Schottky-contacted SnS nanoflakes for noncontact healthcare monitoring
    Hongyu Tang; Yutao Li; Huaiyu Ye; Fafei Hu; Chenshan Gao; Luqi Tao; Tao Tu; Guangyang Gou; Xianping Chen; Xuejun Fan; Tianling Ren; GuoQi Zhang;
    Nanotechnology,
    Volume 31, Issue 5, pp. 055501, Nov 2019. DOI: 10.1088/1361-6528/ab414e
    document

31. General coupling model for electromigration and one-dimensional numerical solutions
    Zhen Cui; Xuejun Fan; GuoQi Zhang;
    Journal of Applied Physics,
    Volume 125, pp. 105101-1-9, 2019. DOI: 10.1063/1.5065376

32. Electrical and optical characterization of MoS2 thin film transistors and the effect of strain on their performances
    Zuopeng Qu; Hongyu Tang; Huaiyu Ye; Xuejun Fan; GuoQi Zhang;
    In EurosimE,
    IEEE, IEEE, 2019. DOI: 10.1109/EuroSimE.2019.8724549

33. A design and qualification of LED flip Chip-on-Board module with tunable color temperatures
    Jiajie Fan; Jianwu Cao; Chaohua Yu; Cheng Qian; Xuejun Fan; GuoQi Zhang;
    Microelectronics Reliability,
    Volume 84, pp. 140-148, 2018.

34. A Review on Water Vapor Pressure Model for Moisture Permeable Materials Subjected to Rapid Heating
    Liangbiao Chen; Jiang Zhou; Hsing-Wei Chu; GuoQi Zhang; Xuejun Fan;
    Applied Mechanics Reviews,
    Volume 70, Issue 2, pp. 020803-1-16, 2018.

35. A new hermetic sealing method for ceramic package using nanosilver sintering technology
    Hao Zhang; Yang Liu; Lingen Wang; Jiajie Fan; Xuejun Fan; Fenglian Sun; GuoQi Zhang;
    Microelectronics Reliability,
    Volume 81, pp. 143-149, 2018.

36. Effect of Sintering Pressure on the Porosity and the Shear Strength of the Pressure-Assisted Silver Sintering Bonding
    Yang Liu; Hao Zhang; Lingen Wang; Xuejun Fan; GuoQi Zhang; Fenglian Sun;
    IEEE Transactions on Device and Materials Reliability,
    Volume 18, Issue 2, pp. 240-246, 2018.

37. Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages
    Chengshuo Jiang; Jiajie Fan; Cheng Qian; Hao Zhang; Xuejun Fan; Weiling Guo; GuoQi Zhang;
    IEEE Transactions on Components, Packaging and Manufacturing Technology,
    Volume 8, Issue 7, pp. 1254-1262, 2018.

38. A stochastic process based reliability prediction method for LED driver
    Bo Sun; Xuejun Fan; Willem van Driel; Chengqiang Cui; GuoQi Zhang;
    Reliability Engineering and System Safety,
    Volume 178, pp. 140-146, 2018.

39. Interfacial properties of Cu/SiO2 using a multiscale modelling approach in electronic packages
    Zhen Cui; Xianping Chen; Xuejun Fan; GuoQi Zhang;
    In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2018.

40. A probabilistic physics-of-failure reliability assessment approach for integrated LED lamps
    Bo Sun; Jiajie Fan; Xuejun Fan; GuoQi Zhang;
    In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2018.

41. Color shift acceleration on mid-power LED packages
    Guangjun Lu; Driel, W.D. van; Xuejun Fan; Jiajie Fan; Cheng Qian; GuoQi Zhang;
    Microelectronics Reliability,
    Volume 78, Issue Supplement C, pp. 294 -- 298, 11 2017. DOI: 10.1016/j.microrel.2017.09.014
    
    Keywords: ...

    Color shift, Mid-power LED package, Temperature stress, Current stress, Humidity stress.

42. Thermal conductivity of functionalized graphene-polymer nanocomposite: A non-equilibrium molecular dynamics study
    Hongyu Tang; Huaiyu Ye; Xianping Chen; Xuejun Fan; GuoQi Zhang;
    In EurosimE,
    2017.

43. PoF-Simulation Assisted Reliability Prediction for Electrolytic Capacitor in LED Drivers
    Bo Sun; Xuejun Fan; Cheng Qian; GuoQi Zhang;
    IEEE Transactions on Industrial Electronics,
    pp. 99, 2016.

44. A review of small heat pipes for electronics
    Xianping Chen; Huaiyu Ye; Xuejun Fan; Tianling Ren; GuoQi Zhang;
    Applied Thermal Engineering,
    Volume 96, pp. 1-17, 2016.

45. Colour shift and mechanism investigation on the PMMA diffuser used in LED-based luminaires
    G Lu; van Driel, WD; Xuejun Fan; Yazdan Mehr, M; Jiajie Fan; Cheng Qian; KMB Jansen; GQ Zhang;
    Optical Materials,
    Volume 54, pp. 282--287, 2016. harvest. DOI: 10.1016/j.optmat.2016.02.023
    
    Keywords: ...

    Colour shift, PMMA, Solid state lighting, LED-based luminaire, Infrared absorption spectroscopy.

46. A Systematic Approach for Reliability Assessment of Electrolytic Capacitor-Free LED Drivers
    Bo Sun; Xuejun Fan; van Driel, Willem; GuoQi Zhang;
    United States: IEEE, , pp. 1--5, 4 2016. DOI: 10.1109/EuroSimE.2016.7463387
    
    Keywords: ...

    Reliability, MOSFET, Electrolytic Capacitor-Free LED Driver.

47. Lumen Decay Prediction in LED Lamps
    Bo Sun; Xuejun Fan; van Driel, Willem; Thomas Michel; Jiang Zhou; GuoQi Zhang;
    United States: IEEE, , pp. 1--5, 4 2016. DOI: 10.1109/EuroSimE.2016.7463391
    
    Keywords: ...

    Reliability, LED Lamp, Lumen Decay Prediction.

48. Reliability optimization of gold-tin eutectic die attach layer in HEMT package
    Hao Zhang; Jiajie Fan; Jing Zhang; Cheng Qian; Xuejun Fan; Fenglian Sun; Guoqi Zhang;
    In 13th China International Forum on Solid State Lighting (SSLChina),
    2016.
    document

49. Thermal analysis and optimization of IGBT power electronic module based on layout model
    Hongyu Tang; Huaiyu Ye; Mingming Wang; Xuejun Fan; GuoQi Zhang;
    In ICEPT,
    2016.

50. Optimal Design of Life Testing for High Brightness White LEDs Using the Six Sigma DMAIC Approach
    Chuen Yung; Xuejun Fan; GuoQi Zhang; Michael Pecht;
    IEEE Transactions on Device and Materials Reliability,
    Volume 15, Issue 4, pp. 576-587, 2015.

51. Degradation of Microcellular PET Reflective Materials Used in LED-based Products
    Guangjun Lu; W.D. van Driel; Xuejun Fan; M. Yazdan Mehr; Jiajie Fan; K.M.B. Jansen; GuoQi Zhang;
    Optical Materials,
    Volume 49, pp. 79-84, 2015.

52. Color shift investigations for LED secondary optical designs: Comparison between BPA-PC and PMMA
    Guangjun Lu; M. Yazdan Mehr; W.D. van Driel; Xuejun Fan; Jiajie Fan; K.M.B. Jansen; GuoQi Zhang;
    Optical Materials,
    Volume 45, pp. 37-41, 2015.

53. Tailoring the Mechanical Properties of High-Aspect-Ratio Carbon Nanotube Arrays using Amorphous Silicon Carbide Coatings
    Poelma, RH; Morana, Bruno; Vollebregt, Sten; Schlangen, Erik; van Zeijl, HW; Fan, Xuejun; Zhang, GuoQi;
    Advanced Functional Materials,
    Volume 24, Issue 36, pp. 5737-5744, 2014.
    document

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