dr. Jiajie Fan

Guest
Electronic Components, Technology and Materials (ECTM), Department of Microelectronics

Themes: Micro/Nano System Integration and Reliability

Biography

Jiajie Fan received the Ph.D. degree in Industrial and Systems Engineering at The Hong Kong Polytechnic University, Hung Hom, Hong Kong, China, in 2014. He is working as a visiting scholar and postdoctoral research scientist at the Electronic Components, Technology and Materials (ECTM) group of Delft University of Technology, the Netherlands. Now he joins the Horizon 2020 program REPAIR project and NWO HTSM project. He is an IEEE Senior Member, Associate Editor of IEEE Access journal. His main research interests include LED packaging and system integration, Prognostics and health management, and Wide bandgap power electronics packaging and reliability modelling, etc.

Publications

  1. Coupling Model of Electromigration and Experimental Verification – Part I: Effect of Atomic Concentration Gradient
    Zhen Cui; Xuejun Fan; Yaqian Zhang; Sten Vollebregt; Jiajie Fan; Guoqi Zhang;
    Journal of the Mechanics and Physics of Solids,
    Volume 174, pp. 105257, 2023. DOI: 10.1016/j.jmps.2023.105257

  2. Coupling Model of Electromigration and Experimental Verification – Part II: Impact of Thermomigration
    Zhen Cui; Xuejun Fan; Yaqian Zhang; Sten Vollebregt; Jiajie Fan; Guoqi Zhang;
    Journal of the Mechanics and Physics of Solids,
    Volume 174, pp. 105256, 2023. DOI: 10.1016/j.jmps.2023.105256

  3. Copper Nanoparticle Sintering Enabled Hermetic Packaging With Fine Sealing Ring for MEMS Application
    Dong Hu; Mustafeez Bashir Shah; Jiajie Fan; Sten Vollebregt; Guoqi Zhang;
    IEEE Transactions on Electron Devices,
    Volume 70, Issue 11, pp. 5818-5823, 2023. DOI: 10.1109/TED.2023.3312066

  4. Study on Sintering Mechanism and Mechanical Properties of Nano-Cu based on Molecular Dynamics Simulation
    Cheng Qian; Dong Hu; Xu Liu; Xuejun Fan; Guoqi Zhang; Jiajie Fan;
    In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2023. DOI: 10.1109/EuroSimE56861.2023.10100810

  5. Temperature Field Simulation and optimization for Horizontal 6-inch 4H-SiC Epitaxial CVD Reactor by Induction Heating
    Zhuorui Tang; Jing Tian; Chaobin Mao; Nan Zhang; Jiyu Huang; Jiajie Fan; Guoqi Zhang;
    In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2023. DOI: 10.1109/EuroSimE56861.2023.10100813

  6. Hydrolysis Mechanism Analysis of (Ca, Sr)AlSiN₃:Eu²⁺ Red Phosphor Aged Under Pressure Cooker Test and 85°C&85%RH Test: Kinetics Modeling and First-principles Calculation
    Minzhen Wen; Baotong Guo; Shanghuan Chen; Xiao Hu; Xuejun Fan; Guoqi Zhang; Jiajie Fan;
    In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2023. DOI: 10.1109/EuroSimE56861.2023.10100750

  7. Reliability Analysis on Ag and Cu Nanoparticles Sintered Discrete Power Devices with Various Frontside and Backside Interconnects
    Dong Hu; Xu Liu; Sten Vollebregt; Jiajie Fan; Guoqi Zhang; Ali Roshanghias; Xing Liu; Thomas Basler; Emiel De Bruin;
    In Proc. of Electronic Components and Technology Conference (ECTC),
    2023.

  8. Thermal-Mechanical-Electrical Co-Design of Fan-Out Panel-Level SiC MOSFET Packaging with a Multi-Objective Optimization Algorithm
    Wei Chen; Xuyang Yan; Jiajie Fan; Mesfin S. Ibrahim; Jing Jiang; Xuejun Fan; Guoqi Zhang;
    In Proc. of Electronic Components and Technology Conference (ECTC),
    2023.

  9. Effects of Temperature and Grain Size on Diffusivity of Aluminium: Electromigration Experiment and Molecular Dynamic Simulation
    Zhen Cui; Yaqian Zhang; Dong Hu; Sten Vollebregt; Jiajie Fan, Xuejun Fan; Guoqi Zhang;
    Journal of Physics: Condensed Matter,
    Volume 34, pp. 175401, 2022. DOI: 10.1088/1361-648X/ac4b7f

  10. Insights into the high-sulphur aging of sintered silver nanoparticles: An experimental and ReaxFF study
    Dong Hu; Tijian Gu; Zhen Cui; Sten Vollebregt; Xuejun Fan; Guoqi Zhang; Jiajie Fan;
    Corrosion Science,
    pp. 109846, 2021. DOI: 10.1016/j.corsci.2021.109846

  11. Design of a Fan-Out Panel-Level SiC MOSFET Power Module Using Ant Colony Optimization-Back Propagation Neural Network
    Qian, Yichen; Hou, Fengze; Fan, Jiajie; Lv, Quanya; Fan, Xuejun; Zhang, Guoqi;
    IEEE Transactions on Electron Devices,
    Volume 68, Issue 7, pp. 3460-3467, 2021. DOI: 10.1109/TED.2021.3077209

  12. System level reliability assessment for high power light-emitting diode lamp based on a Bayesian network method
    Mesfin Seid Ibrahim; Jiajie Fan; Winco K.C. Yung; Zhou Jing; Xuejun Fan; Willem van Driel; Guoqi Zhang;
    Measurement,
    Volume 176, pp. 109191, 2021. DOI: 10.1016/j.measurement.2021.109191
    document

  13. Constitutive Modeling of Sintered Nano-silver Particles: A Variable-order Fractional Model versus an Anand Model
    Fan, Jiajie; Gu, Tijian; Wang, Ping; Cai, Wei; Fan, Xuejun; Zhang, Guoqi;
    In 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    pp. 1-4, 2021. DOI: 10.1109/EuroSimE52062.2021.9410807

  14. Microchannel Thermal Management System with Two-Phase Flow for Power Electronics over 500 W/cm2 Heat Dissipation
    Fengze Hou; Hengyun Zhang; Dezhu Huang; Jiajie Fan; Fengman Liu; Tingyu Lin; Liqiang Cao; Xuejun Fan; Braham Ferreira; GuoQi Zhang;
    IEEE Transactions on Power Electronics,
    Volume 35, Issue 10, pp. 10592-10600, 2020. DOI: 10.1109/TPEL.2020.2985117

  15. The interface adhesion of CaAlSiN3: Eu2+ phosphor/silicone used in light-emitting diode packaging: a first principles study
    Zhen Cui; Jiajie Fan; Hendrik Joost van Ginkel; Xuejun Fan; GuoQi Zhang;
    Applied Surface Science,
    2020. DOI: 10.1016/j.apsusc.2020.145251

  16. Thermal kinetic and mechanical behaviors of pressure-assisted Cu nanoparticles sintering: A molecular dynamics study
    Dong Hu; Zhen Cui; Jiajie Fan; Xuejun Fan; Guoqi Zhang;
    Results in Physics,
    2020.
    document

  17. Dynamic prediction of optical and chromatic performances for a light-emitting diode array based on a thermal-electrical-spectral model
    Jiajie Fan; Wei Chen; Weiyi Yuan; Xuejun Fan; Guoqi Zhang;
    Opt. Express,
    Volume 28, Issue 9, pp. 13921--13937, Apr 2020. DOI: 10.1364/OE.387660
    document

  18. Experimental Investigation on the Sintering Kinetics of Nanosilver Particles Used in High-Power Electronic Packaging
    Jiajie Fan; D. Xu; H. Zhang; C. Qian; X. Fan; GuoQi Zhang;
    IEEE Transactions on Components, Packaging and Manufacturing Technology,
    Volume 10, Issue 7, pp. 1101-1109, July 2020. DOI: 10.1109/TCPMT.2020.2995634

  19. Machine Learning and Digital Twin Driven Diagnostics and Prognostics of Light‐Emitting Diodes
    Mesfin Seid Ibrahim; Jiajie Fan; Winco K. C. Yung; Alexandru Prisacaru; Willem D. van Driel; Xuejun Fan; GuoQi Zhang;
    Laser and Photonics Reviews,
    Volume 14, Issue 12, Dec 2020. DOI: 10.1002/lpor.202000254
    document

  20. Machine-Learning Assisted Prediction of Spectral Power Distribution for Full-Spectrum White Light-Emitting Diode
    Jiajie Fan; Yutong Li; Irena Fryc; Cheng Qian; Xuejun Fan; GuoQi Zhang;
    IEEE Photonics Journal,
    Volume 12, Issue 1, pp. 1-18, Feb 2020. DOI: 10.1109/JPHOT.2019.2962818

  21. Lifetime Prediction of Ultraviolet Light-Emitting Diodes Using a Long Short-Term Memory Recurrent Neural Network
    Zhou Jing; Jie Liu; Mesfin Seid Ibrahim; Jiajie Fan; Xuejun Fan; GuoQi Zhang;
    IEEE Electron Device Letters,
    Volume 41, Issue 12, pp. 1817-1820, 2020. DOI: 10.1109/LED.2020.3034567

  22. Hydrolysis kinetic study of CaAlSiN3:Eu2+ red phosphor with both water immersion test and first-principles calculation
    Jiajie Fan; Ling Zhou; Zhen Cui; Shanghuan Chen; Xuejun Fan; GuoQi Zhang;
    Journal of Luminescence,
    Volume 219, pp. 116874, 2019. DOI: 10.1016/j.jlumin.2019.116874
    document

  23. A Reliability Prediction Methodology for LED Arrays
    Bo Sun; Jiajie Fan; Xuejun Fan; GuoQi Zhang; Guohao Zhang;
    IEEE Access,
    Volume 7, pp. 8127-8134, 2019.

  24. Effects of sintering pressure on the densification and mechanical properties of nanosilver double side sintered power module
    Hao Zhang; Yang Liu; Lingen Wang; Fenglian Sun; Jiajie Fan; Mark D. Placette; Xuejun Fan; GuoQi Zhang;
    IEEE Transactions on Components, Packaging and Manufacturing Technology,
    2019. DOI: 10.1109/TCPMT.2018.2884032

  25. Thermal Management on IGBT Power Electronic Devices and Modules
    Cheng Qian; Amir Mirza Gheytaghi; Jiajie Fan; Hongyu Tang; Bo Sun; Huaiyu Ye; GuoQi Zhang;
    IEEE Access,
    Volume 6, pp. 12868-12884, 2018.

  26. A design and qualification of LED flip Chip-on-Board module with tunable color temperatures
    Jiajie Fan; Jianwu Cao; Chaohua Yu; Cheng Qian; Xuejun Fan; GuoQi Zhang;
    Microelectronics Reliability,
    Volume 84, pp. 140-148, 2018.

  27. A new hermetic sealing method for ceramic package using nanosilver sintering technology
    Hao Zhang; Yang Liu; Lingen Wang; Jiajie Fan; Xuejun Fan; Fenglian Sun; GuoQi Zhang;
    Microelectronics Reliability,
    Volume 81, pp. 143-149, 2018.

  28. Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages
    Chengshuo Jiang; Jiajie Fan; Cheng Qian; Hao Zhang; Xuejun Fan; Weiling Guo; GuoQi Zhang;
    IEEE Transactions on Components, Packaging and Manufacturing Technology,
    Volume 8, Issue 7, pp. 1254-1262, 2018.

  29. A probabilistic physics-of-failure reliability assessment approach for integrated LED lamps
    Bo Sun; Jiajie Fan; Xuejun Fan; GuoQi Zhang;
    In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2018.

  30. Color shift acceleration on mid-power LED packages
    Guangjun Lu; Driel, W.D. van; Xuejun Fan; Jiajie Fan; Cheng Qian; GuoQi Zhang;
    Microelectronics Reliability,
    Volume 78, Issue Supplement C, pp. 294 -- 298, 11 2017. DOI: 10.1016/j.microrel.2017.09.014
    Keywords: ... Color shift, Mid-power LED package, Temperature stress, Current stress, Humidity stress.

  31. Colour shift and mechanism investigation on the PMMA diffuser used in LED-based luminaires
    G Lu; van Driel, WD; Xuejun Fan; Yazdan Mehr, M; Jiajie Fan; Cheng Qian; KMB Jansen; GQ Zhang;
    Optical Materials,
    Volume 54, pp. 282--287, 2016. harvest. DOI: 10.1016/j.optmat.2016.02.023
    Keywords: ... Colour shift, PMMA, Solid state lighting, LED-based luminaire, Infrared absorption spectroscopy.

  32. Reliability optimization of gold-tin eutectic die attach layer in HEMT package
    Hao Zhang; Jiajie Fan; Jing Zhang; Cheng Qian; Xuejun Fan; Fenglian Sun; Guoqi Zhang;
    In 13th China International Forum on Solid State Lighting (SSLChina),
    2016.
    document

  33. Degradation of Microcellular PET Reflective Materials Used in LED-based Products
    Guangjun Lu; W.D. van Driel; Xuejun Fan; M. Yazdan Mehr; Jiajie Fan; K.M.B. Jansen; GuoQi Zhang;
    Optical Materials,
    Volume 49, pp. 79-84, 2015.

  34. Color shift investigations for LED secondary optical designs: Comparison between BPA-PC and PMMA
    Guangjun Lu; M. Yazdan Mehr; W.D. van Driel; Xuejun Fan; Jiajie Fan; K.M.B. Jansen; GuoQi Zhang;
    Optical Materials,
    Volume 45, pp. 37-41, 2015.

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Last updated: 14 Jan 2021