Pan Liu
Publications
- Simulation, Prediction, and Verification of the Corrosion Behavior of Cu-Ag Composite Sintered Paste for Power Semiconductor Die-Attach Applications
Xinyue Wang; Zhoudong Yang; Pan Liu; Guoqi Zhang; Jing Zhang;
In Proc. of Electronic Components and Technology Conference (ECTC),
2023. - Wafer Scale Flexible Interconnect Transfer for Hetrogeneous Integration
Pan Liu; Jian Li; Henk van Zeijl; GuoQi Zhang;
In 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
United States, IEEE, pp. 817--823, 06 2020. DOI: 10.1109/ECTC32862.2020.00133 - Multi-functional LED Module Integration and Miniaturization for Solid State Lighting Applications
Pan Liu;
PhD thesis, Delft University of Technology, 2019.
document - Design and fabrication of a foldable 3D silicon based package for solid state lighting applications
R. Sokolovskij; Pan Liu; H.W. van Zeijl; B. Mimoun; GuoQi Zhang;
Journal of Micromechanics and Microengineering,
Volume 25, Issue 5, pp. 055017, 2015.