Zhen Cui
Publications
- Coupling Model of Electromigration and Experimental Verification – Part I: Effect of Atomic Concentration Gradient
Zhen Cui; Xuejun Fan; Yaqian Zhang; Sten Vollebregt; Jiajie Fan; Guoqi Zhang;
Journal of the Mechanics and Physics of Solids,
Volume 174, pp. 105257, 2023. DOI: 10.1016/j.jmps.2023.105257 - Coupling Model of Electromigration and Experimental Verification – Part II: Impact of Thermomigration
Zhen Cui; Xuejun Fan; Yaqian Zhang; Sten Vollebregt; Jiajie Fan; Guoqi Zhang;
Journal of the Mechanics and Physics of Solids,
Volume 174, pp. 105256, 2023. DOI: 10.1016/j.jmps.2023.105256 - Effect of Thermomigration on Electromigration in SWEAT Structures
Zhen Cui; Xuejun Fan; GuoQi Zhang;
In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
2023. DOI: 10.1109/EuroSimE56861.2023.10100774 - Electromigration-induced local dewetting in Cu films
Yaqian Zhang; Jiarui Mo; Zhen Cui; Sten Vollebregt; GuoQi Zhang;
In Proc. of the IEEE International Interconnect Technology Conference,
2023. DOI: 10.1109/IITC/MAM57687.2023.10154761 - Effect of Passivation and Mechanical Constraint on Electromigration in Interconnect
Xuejun Fan; Zhen Cui; GuoQi Zhang;
In Proc. of Electronic Components and Technology Conference (ECTC),
2023. - Effects of Temperature and Grain Size on Diffusivity of Aluminium: Electromigration Experiment and Molecular Dynamic Simulation
Zhen Cui; Yaqian Zhang; Dong Hu; Sten Vollebregt; Jiajie Fan, Xuejun Fan; Guoqi Zhang;
Journal of Physics: Condensed Matter,
Volume 34, pp. 175401, 2022. DOI: 10.1088/1361-648X/ac4b7f - Insights into the high-sulphur aging of sintered silver nanoparticles: An experimental and ReaxFF study
Dong Hu; Tijian Gu; Zhen Cui; Sten Vollebregt; Xuejun Fan; Guoqi Zhang; Jiajie Fan;
Corrosion Science,
pp. 109846, 2021. DOI: 10.1016/j.corsci.2021.109846 - Effects of Defect and Temperature on the Mechanical Performance of WS2: A Multiscale Analysis
Hongyu Tang; Dong Hu; Zhen Cui; Huaiyu Ye; GuoQi Zhang;
Journal of Physical Chemistry C,
2021.
document - Multi-Physics Driven Electromigration Study: Multi-Scale Modeling and Experiment
Zhen Cui;
PhD thesis, Delft University Technology, 2021.
document - The interface adhesion of CaAlSiN3: Eu2+ phosphor/silicone used in light-emitting diode packaging: a first principles study
Zhen Cui; Jiajie Fan; Hendrik Joost van Ginkel; Xuejun Fan; GuoQi Zhang;
Applied Surface Science,
2020. DOI: 10.1016/j.apsusc.2020.145251 - Thermal kinetic and mechanical behaviors of pressure-assisted Cu nanoparticles sintering: A molecular dynamics study
Dong Hu; Zhen Cui; Jiajie Fan; Xuejun Fan; Guoqi Zhang;
Results in Physics,
2020.
document - Implementation of General Coupling Model of Electromigration in ANSYS
Zhen Cui; Xuejun Fan; GuoQi Zhang;
In IEEE 70th Electronic Components and Technology Conference (ECTC),
2020.
document - Hydrolysis kinetic study of CaAlSiN3:Eu2+ red phosphor with both water immersion test and first-principles calculation
Jiajie Fan; Ling Zhou; Zhen Cui; Shanghuan Chen; Xuejun Fan; GuoQi Zhang;
Journal of Luminescence,
Volume 219, pp. 116874, 2019. DOI: 10.1016/j.jlumin.2019.116874
document - PVP-Mediated Galvanic Replacement Synthesis of Smart Elliptic Cu− Ag Nanoflakes for Electrically Conductive Pastes
Yu Zhang; Pengli Zhu; Gang Li; Zhen Cui; Chengqiang Cui; Kai Zhang; Jian Gao; Xin Chen; GuoQi Zhang; Rong Sun; Chingping Wong;
ACS Applied Materials & Interfaces,
2019. - General coupling model for electromigration and one-dimensional numerical solutions
Zhen Cui; Xuejun Fan; GuoQi Zhang;
Journal of Applied Physics,
Volume 125, pp. 105101-1-9, 2019. DOI: 10.1063/1.5065376 - Interfacial properties of Cu/SiO2 using a multiscale modelling approach in electronic packages
Zhen Cui; Xianping Chen; Xuejun Fan; GuoQi Zhang;
In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
2018. - Interfacial Failure Characterization of Electronic Packaging Component Using a Multiscale Modelling Approach
Zhen Cui; Yingying Zhang; Qun Yang; GuoQi Zhang; Xianping Chen;
In IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM),
2018. DOI: 10.1109/EDTM.2018.8421434