Electronic Components, Technology and Materials
Department of Microelectronics

Varun Thukral

Publications

  1. Impact of Temperature Cycling Conditions on Board Level Vibration for Automotive Applications
    Varun Thukral; Irene Bacquet; Michiel Soestbergen; Jeroen Zaal; Romuald Roucou; Rene Rongen; Willem van Driel; GuoQi Zhang;
    In Proc. of Electronic Components and Technology Conference (ECTC),
    2023.

  2. Board level vibration test method of components for automotive electronics: State-of-the-art approaches and challenges
    V. Thukral; M. van Soestbergen; J.J.M. Zaal; R. Roucou; R.T.H. Rongen; W.D. van Driel; GuoQi Zhang;
    Microelectronics Reliability,
    Volume 139, pp. 114830, 2022. DOI: 10.1016/j.microrel.2022.114830

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