ET4277 Microelectronics reliability

Topics: Reliability issues involved in electronic components and system
This course aims to provide the students with a thorough understanding of the reliability issues involved in electronic components and systems. The following subjects will be treated.
  • Basic reliability definition and lifetime distributions.
  • Reliability prediction methods.
  • Physical failure mechanisms in electronic components
  • Package related failures
  • Reliability screening and reliability testing
  • Failure analysis methods
  • Reliability data handling
  • Design considerations
  • System reliability

Teachers Andre Bossche

Integrated Sensors, Nano-Fluidic Devices and Packaging Technology

dr. Willem van Driel


prof.dr. GuoQi Zhang

Heterogenous system integration, 2D materials and devices, wide bandgap semiconductor sensors, digital twin and reliability, multi-scale and multi-physics modeling

Last modified: 2016-02-25


Credits: 4 EC
Period: 0/3/0/0