Hot Embossing for Transparent Spacers in Micro Fabrication Technologies

Hot embossing is a method where a mold is pressed on a substrate with a soft material in between. This creates the inverse pattern of the mold in the soft material. Several approaches are possible using solid or liquid materials at room or elevated temperatures. The shaped material is cured using UV exposure and/or a temperature step. This technique is used to implement transparent spacers in a CMOS image as well as microchannels for organ-on-chip applications. A range of shape materials can be explored.

Assignment

The student will perform the assignment at ECTM:
Duration: ~9 months.
Location: EKL cleanrooms and facilities.

The expected activities to be carried out by the student are:

• Analysis of allowable transparent mold materials.
• Mold design and target substrate requirements definition.
• Fabrication of the design in EKL facilities.
• Characterization of fabricated devices.

Requirements

You are an ambitious master student looking for a challenging thesis project on a microelectronics packaging problem. You have a physics, imaging or microelectronics background and an interest in micro fabrication technology. Good communication skills in English and a pro-active attitude are expected.

Contact

Last modified: 2022-04-08