Heterogeneous integration using Cu nanoparticle sintering

The need for more functionalization, miniaturization and lower energy consumption drives the ongoing semiconductor industry. Heterogeneous integration, referring to bonding separately components into a higher integration level, enables improved operating characteristics and enhanced functionality. In the past few years, research at the Electronic Components, Technology and Materials (ECTM) of TU Delft has developed a stencil printing technology using a lithographic mask, which enables controllable pattern size for conductive paste filling.

As one of the promising candidates, Cu nanoparticle can be sintered at low temperature to form continuous structure, which has similar properties as its bulk state, for instance, melting point, thermal and electrical conductivities. Thus, low-temperature sintering of Cu nanoparticles can be employed for heterogeneous integration, such as flip-chip and wafer-to-wafer bonding (W2W).

This project aims to investigate the application of low-temperature sintering of Cu nanoparticles in heterogeneous integration. Building onto the group’s knowledge, the project will help develop a deeper understanding of lithographic mask defined patterns and processing aspects of conductive filling technology for heterogeneous integration.

Assignment

This hands-on project will include:

• An extensive review of the related state-of-the-art;
• The development of stencil printing by lithographic mask;
• The development of Cu bump for flip-chip technology;
• The development of fine pitch Cu pattern for W2W technology.
• Characterization of the electrical conductivities and cross-section inspection;
• Comprehensive reporting of the full experimental work.

Requirements

You are an ambitious master student looking for hands-on experience and a multidisciplinary thesis project on microfabrication and nanomaterials. You have a microelectronics, chemistry, nanotechnology or material science background and like experimental lab work. Good communication skill in English and a pro-active attitude are expected.

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Last modified: 2022-02-18