Electronic Components, Technology and Materials
Department of Microelectronics

Xu Liu

Publications

  1. Transient thermal measurement on nano-metallic sintered die-attach joints using a thermal test chip
    R. Sattari; Dong Hu; Xu Liu; H. van Zeijl; S. Vollebregt; GuoQi Zhang;
    Applied Thermal Engineering,
    Volume 221, pp. 119503, 2023. DOI: 10.1016/j.applthermaleng.2022.119503

  2. Study on Sintering Mechanism and Mechanical Properties of Nano-Cu based on Molecular Dynamics Simulation
    Cheng Qian; Dong Hu; Xu Liu; Xuejun Fan; Guoqi Zhang; Jiajie Fan;
    In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2023. DOI: 10.1109/EuroSimE56861.2023.10100810

  3. Reliability Analysis on Ag and Cu Nanoparticles Sintered Discrete Power Devices with Various Frontside and Backside Interconnects
    Dong Hu; Xu Liu; Sten Vollebregt; Jiajie Fan; Guoqi Zhang; Ali Roshanghias; Xing Liu; Thomas Basler; Emiel De Bruin;
    In Proc. of Electronic Components and Technology Conference (ECTC),
    2023.

  4. Pressure-assisted Cu sintering for SiC Die-attachment application
    Xu Liu;
    PhD thesis, Delft University Technology, 2023. DOI: 10.4233/uuid:291baefe-c4b9-46ea-b250-a6c8f4e6ece8

  5. Low Leakage and High Forward Current Density Quasi-Vertical GaN Schottky Barrier Diode With Post-Mesa Nitridation
    X. Kang; Y. Sun; Y. Zheng; K. Wei; H. Wu; Y. Zhao; Xu Liu; GuoQi Zhang;
    IEEE Transactions on Electron Devices,
    Volume 68, Issue 3, pp. 1369-1373, 2021. DOI: 10.1109/TED.2021.3050739

  6. A DFT Model Study about Structure Sensitivity for Benzotriazole Adsorption on Copper Surfaces and Nano Cluster
    Weihong Zhang; Quan Zhou; Honghao Tang; Xu Liu; Huaiyu Ye; Sau Wee Koh; GuoQi Zhang;
    In 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
    Guangzhou, China, IEEE, pp. 1-4, Aug 2020. DOI: 10.1109/ICEPT50128.2020.9202975

  7. Study on the effect of mixing proportion of micro- and nano-copper particles on sintering properties
    Xu Liu; Quan Zhou; Qipeng Liu; Honghao Tang; Chenshan Gao; Bin Xie; Sau Wee Koh; Huaiyu Ye; GuoQi Zhang;
    In 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
    pp. 1-5, 2020. DOI: 10.1109/ICEPT50128.2020.9201937

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