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Electronic Components, Technology and Materials

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Electronic Components, Technology and Materials
Department of Microelectronics
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Ruoxuan Li

Ruoxuan Li graduated at the Section Electronic Components, Technology and Materials (ECTM) in July 2008. His/her next position was at IHS (China).

MSc thesis: Tapered through silicon via etching and filling for 3D integration
Advisor(s): Ronald Dekker

Program: MSc Microelectronics

Ruoxuan Li, MSc

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Electronic Components, Technology and Materials

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