R. Dekker

Parttime Professor
Electronic Components, Technology and Materials (ECTM), Department of Microelectronics

Expertise: Flexible electronics

Themes: Flexible and Stretchable Electronics



Projects history


Accelerate Innovation in emerging medical devices with open technology platforms

Health.E Lighthouse Support Initiative

POSITION-II: innovation in smart medical instruments

Ultrasound Integrated Patch for Medical Diagnostics

In this project, we will develop flexible, programmable transducer modules for ultrasound body patches

Spatially specific peripheral nerve stimulation with focused ultrasound

Intelligent Catheters in Advanced Systems for Interventions (INCITE) – WP2 Imaging

InForMed: D4 - Steering deep brain stimulation probe (Chip-in-Tip)

Sensors and Circuits on Catheters

How to bring highly miniaturized circuits, sensors and actuators to the tip of the catheters and other minimal invasive surgical instruments?

Smart Flexible Sensors for in-vivo Coronary Circulation Diagnostics

Combined pressure and flow sensor, so small that it can be positioned in the tip of the guide wire used in heart angioplasty surgery

Living Chip: Stretchable Multi-Electrode Array for drug screening with stem-cell-derived cardiomyocytes

Stem cell derived human cardiomyocytes are used to detect cardiotoxic side effects of newly developed drugs

  1. Modeling and Characterization of Pre-Charged Collapse-Mode CMUTs
    M. Saccher; S. Kawasaki; J. H. Klootwijk; R. Van Schaijk; R. Dekker;
    IEEE Open Journal of Ultrasonics, Ferroelectrics, and Frequency Control,
    Volume 3, pp. 14-28, 2023. DOI: 10.1109/OJUFFC.2023.3240699

  2. 25.8 Gb/s Submillimeter Optical Data Link Module for Smart Catheters
    Jian Li; Chenhui Li; Vincent Henneken; Marcus Louwerse; Jeannet Van Rens; Paul Dijkstra; Oded Raz; Ronald Dekker;
    Journal of Lightwave Technology,
    Volume 40, Issue 8, pp. 2456-2464, 2022. DOI: 10.1109/JLT.2021.3137981

  3. A Microfluidic Cancer-on-Chip Platform Predicts Drug Response Using Organotypic Tumor Slice Culture
    Sanjiban Chakrabarty; William F. Quiros-Solano; Maayke M.P. Kuijten; Ben Haspels; Sandeep Mallya; Calvin Shun Yu Lo; Amr Othman; Cinzia Silvestri; Anja van de Stolpe; Nikolas Gaio; Hanny Odijk; Marieke van de Ven; Corrina M.A. de Ridder; Wytske M. van Weerden; Jos Jonkers and Ronald Dekker; Nitika Taneja; Roland Kanaar; Dik C. van Gent;
    Cancer Research,
    Volume 82, Issue 3, pp. 510-520, 2022. DOI: 10.1158/0008-5472.CAN-21-0799

  4. Focused ultrasound neuromodulation on a multiwell MEA
    Marta Saccher; Shinnosuke Kawasaki; Martina Proietti Onori; Geeske M. van Woerden; Vasiliki Giagka; Ronald Dekker;
    Bioelectronic Medicine,
    Volume 8, 2022. DOI: 10.1186/s42234-021-00083-7

  5. Bulk Acoustic Wave Based Microfluidic Particle Sorting With Capacitive Micromachined Ultrasonic Transducers
    Shinnosuke Kawasaki; Jia-Jun Yeh; Marta Saccher; Jian Li; Ronald Dekker;
    In 35th Intl. Conf. on Micro Electro Mechanical Systems (MEMS 2022),
    2022. DOI: 10.1109/MEMS51670.2022.9699807

  6. Time-efficient low power time/phase-reversal beamforming for the tracking of ultrasound implantable devices
    M. Saccher; S.S. Lolla; S. Kawasaki; R. Dekker;
    In IEEE International Ultrasonics Symposium (IUS),
    2022. DOI: 10.1109/IUS54386.2022.9957652

  7. Monolithic Integration of a Smart Temperature Sensor on a Modular Silicon-based Organ-on-a-chip Device
    Ronaldo Martins da Ponte; Nikolas Gaio; Henk van Zeijl; Sten Vollebregt; Paul Dijkstra; Ronald Dekker; Wouter A. Serdijn; Vasiliki Giagka;
    Sensors and Actuators A: Physical,
    Volume 317, pp. 112439, 2021. DOI: 10.1016/j.sna.2020.112439

  8. Cavity-BOX SOI: Advanced Silicon Substrate with Pre-Patterned BOX for Monolithic MEMS Fabrication
    Kluba, Marta Maria; Li, Jian; Parkkinen, Katja; Louwerse, Marcus; Snijder, Jaap; Dekker, Ronald;
    Micromachines 2021, 12(4), 414;,
    Volume 12, Issue 4, 2021. DOI: 10.3390/mi12040414

  9. A microwatt telemetry protocol for targeting deep implants
    S. Kawasaki; I. Subramaniam; M. Saccher; R. Dekker;
    In Proc. IEEE International Ultrasonics Symposium,
    2021. DOI: 10.1109/IUS52206.2021.9593603

  10. Microelectronmechanical organs-on-chip
    Massimo Mastrangeli; Hande Aydogmus; Milica Dostanic; Paul Motreuil-Ragot; Nele Revyn; Bjorn de Wagenaar; Ronald Dekker; Pasqualina M. Sarro;
    In 21st Int. Conf. on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS 2021),
    online, 20-25 June, 2021.

  11. The long-term reliability of pre-charged CMUTs for the powering of deep implanted devices
    M. Saccher; S. Kawasaki; R. Dekker;
    In Proc. IEEE International Ultrasonics Symposium,
    2021. DOI: 10.1109/IUS52206.2021.9593683

  12. Pre-charged collapse-mode capacitive micromachined ultrasonic transducer (CMUT) for broadband ultrasound power transfer
    S. Kawasaki; Y. Westhoek; I. Subramaniam; M. Saccher; R. Dekker;
    In Proc. IEEE Wireless Power Transfer Conference,
    2021. DOI: 10.1109/WPTC51349.2021.9458104

  13. Low-Impedance PEDOT:PSS MEA Integrated in a Stretchable Organ-on-Chip Device
    Affan K. Waafi; Nikolas Gaio; William F. Quiros-Solano; Paul Dijkstra; Pasqualina M. Sarro; Ronald Dekker;
    IEEE Sensors,
    Volume 20, Issue 3, pp. 1150-1157, 2020. DOI: 10.1109/JSEN.2019.2946854

  14. Multi-axial electro-mechanical testing methodology for highly stretchable freestanding micron-sized structures
    S. Shafqat; A.M. Savov; S. Joshi; R. Dekker; M.G.D. Geers; J.P.M. Hoefnagels;
    Journal of Micromechanics and Microengineering,
    Volume 30, Issue 5, pp. 1--17, 2020. DOI: 10.1088/1361-6439/ab748f

  15. Embedded High-Density Trench Capacitors for Smart Catheters
    Jian Li; Jeroen Naaborg; Marcus Louwerse; Vincent Henneken; Carlo Eugeni; Ronald Dekker;
    In 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),
    pp. 1-5, Sep. 2020. DOI: 10.1109/ESTC48849.2020.9229800

  16. PDMS-Parylene Adhesion Improvement via Ceramic Interlayers to Strengthen the Encapsulation of Active Neural Implants
    N. B. Babaroud; R. Dekker; W. Serdijn; V. Giagka;
    In 2020 42nd Annual International Conference of the IEEE Engineering in Medicine Biology Society (EMBC),
    pp. 3399-3402, July 2020. DOI: 10.1109/EMBC44109.2020.9175646

  17. Metal and Polymeric Strain Gauges for Si-Based, Monolithically Fabricated Organs-on-Chips
    Quirós-Solano, William F.; Gaio, Nikolas; Silvestri, Cinzia; Pandraud, Gregory; Dekker, Ronald; Sarro, Pasqualina M.;
    Volume 10, Issue 8, pp. 536, Aug 2019. DOI: 10.3390/mi10080536

  18. Novel method of alignment to buried cavities in cavity-SOI wafers for advanced MEMS devices
    Mountain, C.; Kluba, M.; Bergers, L.; Snijder, J.; Dekker, R.;
    Micro and Nano Engineering,
    2019. DOI: 10.1016/j.mne.2019.100043

  19. Pressure measurement of geometrically curved ultrasound transducer array for spatially specific stimulation of the vagus nerve
    Kawasaki, S.; Giagka, V.; de Haas, M.; Louwerse, M.; Henneken, V.; van Heesch, C.; Dekker, R.;
    In 9th International IEEE/EMBS Conference on Neural Engineering. IEEE,
    2019. DOI: 10.1109/NER.2019.8717064

  20. Effect of Signals on the Encapsulation Performance of Parylene Coated Platinum Tracks for Active Medical Implants
    Nanbakhsh, K.; Kluba, M.; Pahl, B.; Bourgeois, F.; Dekker, R.; Serdijn, W.; Giagka, V.;
    In 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC),
    IEEE, pp. 3840-3844, 2019. DOI: 10.1109/EMBC.2019.8857702

  21. Towards a semi-flexible parylene-based platform technology for active implantable medical devices
    Bakhshaee Babaroud, N.; Kluba, M.; Dekker, R.; Serdijn, W.; Giagka, V.;
    In 7th Dutch Bio-Medical Engineering Conference - Egmond aan Zee, Netherlands,

  22. A Platform for Mechano(-Electrical) Characterization of Free-Standing Micron-Sized Structures and Interconnects
    Angel Savov; Shivani Savov; Salman Shafqat; Johan Hoefnagels; Marcus Louwerse; Ronald Stoute; Ronald Dekker;
    Volume 9, Issue 1, pp. 39, 2018.

  23. Microfabricated tuneable and transferable porous PDMS membranes for Organs-on-Chips
    W. F. Quirós-Solano; N. Gaio; O. M. J. A. Stassen; Y. B. Arik; C. Silvestri; N. C. A. Van Engeland; A. Van der Meer; R. Passier; C. M. Sahlgren; C. V. C. Bouten; A. van den Berg; R. Dekker; P. M. Sarro;
    Scientific Reports,
    pp. 13524, 2018. DOI: 10.1038/s41598-018-31912-6

  24. Investigation of 'Fur-like' Residues Post Dry Etching of Polyimide Using Aluminum Hard Etch Mask
    Shivani Joshi; Angel Savov; Salman Shafqat; Ronald Dekker;
    Materials Science in Semiconductor Processing,
    Volume 75, pp. 130-135, 2018.

  25. Wafer-Scale Integration for Semi-Flexible Neural Implant Miniaturization
    Marta Kluba; Bruno Morana; Angel Savov; Henk Van Zeijl; Gregory Pandraud; Ronald Dekker;
    In Proceedings Eurosensors,
    pp. 941, 2018. DOI: 10.3390/proceedings2130941

  26. A novel method to transfer porous PDMS membranes for high throughput Organ-on-Chip and Lab-on-Chip assembly
    William.F Quirós-Solano; Nikolas Gaio; Cinzia Silvestri; Oscar M. J. A. Arik; Yusuf, B. Stassen; Andries van der Meer; Carlijn V.C. Bouten; Albert van den Berg; Ronald Dekker; P.M. Sarro;
    In 31th IEEE International Conference on Micro Electro Mechanical Systems (MEMS),
    pp. 318-321, 2018.

  27. A Multi Well Plate Organ-on-chip (Ooc) Device For In-vitro Cell Culture Stimulation And Monitoring
    N. Gaio; A. Waafi; M.L.H. Vlaming; E. Boschman; P. Dijkstra; P. Nacken; S.R. Braam; C. Boucsein; P.M. Sarro; R. Dekker;
    In 31th IEEE International Conference on Micro Electro Mechanical Systems (MEMS),

  28. Novel Method for Adhesion between PI-PDMS Using Butyl Rubber for Large Area Flexible Body Patches
    Joshi, Shivani; Bagani, Rishab; Beckers, Lucas; Dekker, Ronald;
    In Proceedings of Eurosensors,
    pp. 307, 2017.

  29. Generic platform for the miniaturization of bioelectronic implants
    M. M. Kluba; J. W. Weekamp; M. Louwerse; V. Henneken; R. Dekker;
    In Design of Medical Devices Conference (DMD Europe),

  30. Next generation smart catheters
    R. Dekker;
    In Philips Research,

  31. Singe-Step CMOS Compatible Fabrication of High Aspect Ratio Microchannels Embedded in Silicon
    M. Kluba; A. Arslan; R. Stoute; J. Muganda; R. Dekker;
    In Eurosensors,

  32. Towards the Next Generation Smart Catheters and implants
    R. Dekker;
    In Smart Systems Industry Summit,
    DSP Valley, 2017.

  33. Organ-on-Chip
    R. Dekker;
    In Professors in de theatre arena,
    Theatre de Veste, Technical University of Delft, 2017.

  34. Towards the next generation of smart catheters and bioelectronics medicines
    R. Dekker;
    In Tyndall Technology Days 2017,

  35. A low-cost electrical read-out system for cell stiffness measurement using silicon based microfluidic device
    S. Kawasaki; M. M. Kluba; R. Dekker;
    In ICT.OPEN,

  36. The Next Generation Smart Catheters
    R. Dekker;
    Maxwell, November 2017. "Maxwell" is a periodical of the Delft university of technology that is distributed amongst students and alumni.

  37. Cytostretch, an Organ-on-Chip Platform
    Gaio, N.; van Meer, B.; Quiros Solano, W.; Bergers, L.; van de Stolpe, A.; Mummery, C.; Sarro, P.M.; Dekker, R.;
    Volume 7, Issue 7, pp. 120, 2016.

  38. Fabrication and characterization of an Upside-down Carbon Nanotube (CNT) Microelectrode array (MEA)
    Gaio, N.; Silvestri, C.; van Meer, B.; Vollebregt, S.; Mummery, C.; Dekker, R.;
    IEEE Sensors Journal,
    Volume 16, Issue 24, pp. 8685, 2016.

  39. Adhesion Improvement of Polyimide/PDMS Interface by Polyimide Surface Modification
    Shivani Joshi; Antonie van Loona; Angel Savov; Ronald Dekker;
    MRS Advances,
    Volume 1, pp. 33-38, 2016.

  40. High Definition Flex-to-Rigid (HD F2R): an Interconnect Substrate Technology
    Ronald Stoute; Marcus C. Louwerse; Vincent A. Henneken; Ronald Dekker;
    In ICT.OPEN,

  41. CMOS compatible embedded microchannels
    R. Stoute; J.M. Muganda; S. Dahar; A. Arslan; R.J.M Henderikx; P.C.M. van Stiphout; J.M.J. den Toonder; R. Dekker;
    In 20th International Conference on Miniaturized Systems for Chemistry and Life Sciences,

  42. Intravascular Ultrasound at the Tip of a Guidewire: Concept and First Assembly Steps
    Ronald Stoute; Marcus C. Louwerse; Vincent A. Henneken; Ronald Dekker;
    In Procedia Engineering: Proceedings of the 30th anniversary Eurosensors Conference,
    pp. 1563-1567, 2016.

  43. High Aspect Ratio Buried Channel Fabricated Using Two Step DRIE Process
    M. M. Kluba; A. Arslan; R. Dekker;
    In ICT.OPEN,

  44. Flexible/Stretchable Ultrasound Body Patches
    Shivani Joshi; Sourush Yazdi; Vincent Henneken; Rene Sanders; Ronald Dekker;
    In ICT.OPEN Conference,

  45. Flexible membrane sensor for opto-mechanical force transducer
    Ronald Stoute; James Muganda; Steven Beekmans; Davide Iannuzzi; Ronald Dekker;
    In 13th International Workshop on Nanomechanical Sensing,

  46. Flex-to-Rigid, an assembly platform for the next generation smart catheters
    R. Dekker;
    In Forum BE-FLEXIBLE,
    Fraunhofer EMFT, 2016.

  47. Origami assembly platform for smart medical instruments
    R. Stoute; M. C. Louwerse; V. A. Henneken; R. Dekker;
    In 28th Conference of the international Society for Medical Innovation and Technology (iSMIT) / 4th Design of Medical Devices Conference,

  48. Towards the Next Generation of Smart Catheters
    R. Dekker;
    In SEMICON Europa,

  49. Meet Dr. Frankenstein
    R. Dekker;
    Guest Lecture at École Polytechnique Fédérale de Lausanne, November 2016.

  50. A novel processing concept for reduction of substrate artifacts in ultrasound transducer arrays
    A.Savov; A. H. Noor; R. Dekker;
    In Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2015 10th International,,
    pp. 145-148, 2015.

  51. Upside-down Carbon Nanotube (CNT) Micro-electrode Array (MEA)
    N. Gaio; B. van Meer; C. Silvestri; Saeed Khoshfetrat Pakazad; S. Vollebregt; C.L. Mummery; R. Dekker;
    In IEEE Sensors Conference,

  52. Conformable Body Patches for Ultrasound Applications
    S. Joshi; S. Yazadi; V. Henneken; R. Sanders; R. Dekker;
    In 17th IEEE Electronics Packaging Technology Conference,

  53. Miniaturized Optical Data Link Assembly for 360 �m Guidewires
    Stoute, Ronald; Louwerse, Marcus C.; van Rens, Jeannet; Henneken, Vincent A.; Dekker, Ronald;
    In ICT.OPEN Conference,
    pp. 46-51, 2015.

  54. A novel stretchable micro-electrode array (SMEA) design for directional stretching of cells
    S Khoshfetrat Pakazad; A Savov; A van de Stolpe; R Dekker;
    Journal of Micromechanics and Microengineering,
    Volume 24, Issue 3, pp. 034003, 2014.

  55. A post processing approach for manufacturing high-density stretchable sensor arrays
    A. Savov; S. Khoshfetrat Pakazad; S. Joshi; V. Henneken; R. Dekker;
    In IEEE Sensors,
    pp. 1703-1705, 2014.

  56. Residue-free plasma etching of polyimide coatings for small pitch vias with improved step coverage
    B. Mimoun; H.T.M. Pham; V. Henneken; R. Dekker;
    Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures,
    Volume 31, Issue 2, pp. 021201-021201-6, Mar. 2013. DOI 10.1116/1.4788795.

  57. Flex-to-Rigid (F2R): A Generic Platform for the Fabrication and Assembly of Flexible Sensors for Minimally Invasive Instruments
    Benjamin Mimoun; Vincent Henneken; Arjen van der Horst; Ronald Dekker;
    IEEE Sensors Journal,
    Volume 13, Issue 10, 2013. DOI: 10.1109/JSEN.2013.2252613

  58. A manufacturable platform for in vito electrophysiological studies under mechanical stimulation
    S. Khoshferat Pakazad; A. Savov; R. Dekker;
    In Proceedings of the 17th international conference on miniaturized systems for chemistry and life sciences,
    pp. 1412-1414, 2013.

  59. A novel SMEA design for directional stretching of cells
    S. Khoshferat Pakazad; A. Savov and. A. van der Stolpe; R. Dekker;
    In Proceedings of the 2013 International Conference on Microtechnologies in Medicine,
    pp. 6-7, 2013.

  60. Ultra-flexible devices for 360 _m diameter guidewires
    B. Mimoun; V. Henneken; P.M. Sarro; R. Dekker;
    In 25th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2012),
    Paris, France, IEEE, pp. 472-475, Jan. 2012. ISBN: 978-978-1-4673-0325-5, DOI 10.1109/MEMSYS.2012.6170227.

  61. Living chips and Chips for the living
    R. Dekker; S. Braam; V. Henneken; A. van der Horst; S. Khoshfetrat Pakazad; M. Louwerse; B. van Meer; B. Mimoun; A. Savov; A. van de Stolpe;
    In Proc. of IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM 2012),
    Portland, Oregon, USA, pp. 1-9, Sep. 2012. DOI 10.1109/BCTM.2012.6352653.

  62. Thermal flow sensors on flexible substrates for minimally invasive medical instruments
    B. Mimoun; A. van der Horst; D. van der Voort; M. Rutten; R. Dekker; F. van de Vosse;
    In Proc. of IEEE Sensors Conference 2012,
    Taipei, Taiwan, pp. 1-4, Oct. 2012 2012. DOI 10.1109/ICSENS.2012.6411429.

  63. A platform for manufacturable stretchable micro-electrode arrays
    S. Khoshfetrat Pakazad; A. Savov; S.R. Braam; R. Dekker;
    In R. Walczak; J. Dziuban (Ed.), Proc. Eurosensors XXVI,
    Krakow, Poland, Procedia Engineering, pp. 817-820, Sep 2012. DOI 10.1016/j.proeng.2012.09.272.

  64. Flexible multipolar cuff microelectrode for FES of sacral nerve roots
    F. Rodrigues; B. Mimoun; M. Bartek; P.M. Mendes; R. Dekker;
    In Proc. 17th Annual International FES Society Conference (IFESS 2012),
    Banff, Alberta, Canada, pp. 1-4, Sept. 2012.

  65. Residue-free plasma etching of polyimide coatings
    B. Mimoun; H.T.M. Pham; V. Henneken; R. Dekker;
    In International Conference on Electronics Packaging 2012 (ICEP),
    Tokyo, Japan, pp. 265-269, Apr. 2012.

  66. Atomic-scale electron-beam sculpting of near-defect-free graphene nanostructures
    B. Song; G.F. Schneider; Q. Xu; G. Pandraud; C. Dekker; H.W. Zandbergen;
    Nano Letters,
    Volume 11, Issue 6, pp. 2247-2250, 2011. DOI 10.1021/nl200369r.

  67. A novel SOI-MEMS �micro-swing� time-accelerometer operating in two time-based transduction modes for high sensitivity and extended range
    V. Rajaraman; B.S. Hau; L.A. Rocha; R.A. Dias; K.A.A. Makinwa; R. Dekker;
    In 16th International Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS 2011),
    Beijing, China, pp. 2066-2069, Jun. 2011. ISBN 978-1-4577-0157-3; DOI 10.1109/TRANSDUCERS.2011.5969225.

  68. A stretchable micro-electrode array for in vitro electrophysiology
    S. Khoshfetrat Pakazad; A. Metodiev Savov; A. van de Stolpe; S. Braam; B. van Meer; R. Dekker;
    In Proc. 24th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2011),
    Cancun, Mexico, IEEE, pp. 829-832, Jan. 2011. ISBN 978-1-4244-9633-4; DOI 10.1109/MEMSYS.2011.5734553.

  69. Millimeter-wave integrated waveguides on silicon
    G. Gentile; R. Dekker; P. de Graaf; M. Spirito; L.C.N. de Vreede; B. Rejaei;
    In Proc. 2011 IEEE Topical Meeting on Silicon Monolithic Integrated Circuits RF Systems (SiRF 2011),
    Phoenix, AZ, pp. 37-40, Jan. 2011. ISBN 978-1-4244-8060-9; DOI 10.1109/SIRF.2011.5719314.

  70. FleXss: A standalone Matlab-based graphical user interface (GUI) for stress-strain analytical modeling of multilayered structures with applied bending
    B. Mimoun; A. Vieira da Silva; R. Dekker;
    In 3rd Flexible and Stretchable Electronics Workshop 2011,
    Berlin, Germany, Nov. 2011.

  71. Living chips-Chips for the living
    R. Dekker; B. Mimoun; S. Pakazaad;
    In 3rd Flexible and Stretchable Electronics Workshop 2011,
    Berlin, Germany, Nov. 2011.

  72. Ultra-flexible devices for smart invasive medical instruments
    B. Mimoun; V. Henneken; R. Dekker;
    In 3rd Flexible and Stretchable Electronics Workshop 2011,
    Berlin, Germany, Nov. 2011.

  73. Flex-to-Rigid (F2R): A Novel Ultra-Flexible Technology for Smart Invasive Medical Instruments
    B. Mimoun; V. Henneken; R. Dekker;
    In Stretchable Electronics and Conformal Biointerfaces,
    Mater. Res. Soc. Symp. Proc. Volume 1271E, 2010.

  74. FleSS: a Matlab Based Graphical User Interface for Stress � Strain Analytical Modeling of Multilayered Structures with Applied Bending
    A. Vieira da Silva; B. Mimoun; R. Dekker;
    In Proc. of 13th Workshop on Semiconductors Advances for Future Electronics and Sensors 2010 (SAFE 2010),
    Veldhoven, The Netherlands, STW, pp. 175-179, 2010. ISBN 978-90-73461-67-3).

  75. Release and Mounting of Partially Flexible Devices Inside and Around Tubes for Smart Invasive Medical Applications
    B. Mimoun; V. Henneken; R. Dekker;
    In Proc. of 12th Electronic Packaging and Technology Conference 2010 (EPTC 2010),
    Singapore, IEEE, pp. 7-12, 2010. ISBN 978-1-4244-8561-1.

  76. High-aspect-ratio through-wafer parylene beams for stretchable silicon electronics.
    T. Zoumpoulidis; M. Bartek; P. de Graaf; R. Dekker;
    Sensors and actuators a-physical,
    Volume 156, Issue 1, pp. 257-264, 2009. ISSN 0924-4247.

  77. Stretchable array of ISFET devices for applications in biomedical imagers.
    T. Zoumpoulidis; T. Prodomakis; K. Michelakis; H.W. van Zeijl; M. Bartek; C. Toumazou; R. Dekker;
    In S.C. Mukhopadhyay (Ed.), Proc. IEEE Sensors 2009 Conference,
    Christchurch, New Zealand, IEEE, pp. 7-12, 2009. ISBN 978-1-4244-5335-1).

  78. Parylene-embedded metal interconnects for stretchable silicon electronics.
    T. Zoumpoulidis; M. Bartek; R. Dekker;
    In Proc. International Conference on Electronics Packaging (ICEP 2009),
    Kyoto, Japan, JIEP, IEEE, pp. 611-615, 2009.

  79. Fabrication of Stretchable PDMS Membrane as Substrate Material for Multi-Electrode Array Devices
    R. Li; A. van Bogaard; R. Dekker;
    In Proc. of SAFE 2009,
    Veldhoven, The Netherlands, pp. 91-94, 2009.

  80. Mechanical study of silicon nitride layers on thin flexible substrates under bending
    B. Mimoun; O. Gourhant; R. Dekker;
    In Proc. of 12th Workshop on Semiconductors Advances for Future Electronics and Sensors 2009 (SAFE 2009),
    Veldhoven, The Netherlands: STW (ISBN: 978-90-73461-62-8)-Best Flash Presentation Award, pp. 95-98, 2009.

  81. Biocompatible encapsulation of CMOS based chemical sensors
    T. Prodomakis; K. Michelakis; T. Zoumpoulidis; R. Dekker; C. Toumazou;
    In Proc. IEEE Sensors 2009 Conference,
    Christchurch, New Zealand, pp. 791-794, 2009.

  82. Large-area silicon electronics using stretchable metal interconnect
    S. Sosin; T. Zoumpoulidis; M. Bartek; R. Dekker;
    In Proc. 59th Electronic Components & Technology Conference (ECTC 2009),
    San Diego, CA, pp. 1059-1064, 2009.

  83. Mechanical study of silicon nitride layers on thin flexible substrates under bending
    B. Mimoun; O. Gourhant; R. Dekker;
    In 2nd International Workshop on Flexible & Stretchable Electronics 2009,
    Ghent, Belgium, 2009.

  84. Front-to back-side overlay optimization after wafer bonding for 3D integration
    L. Marinier; W. van Noort; R. Pellens; B. Sutedja; R. Dekker; H. W. van Zeijl;
    In Proc. 31st International Conference on Micro- and Nano-Engineering 2005,
    Vienna, Austria, Sep. 2005.

  85. A Back-Wafer Contacted Silicon-On-Glass Integrated Bipolar Process - Part I: The Conflict Electrical Versus Thermal Isolation
    L.K. Nanver; N. Nenadovic; V. d Alessandro; H. H. Schellevis; W. van Zeijl; R. Dekker; D.B. de Mooij; V. Zieren; J.W. Slotboom;
    IEEE Trans. on Electron Devices,
    Volume 51, Issue 1, pp. 42-50, Jan. 2004.

  86. Substrate Transfer Technology
    R. Dekker;
    PhD thesis, Delft University of Technology, Jun. 2004. ISBN 90-74445-61-6; Promotors: prof. J.W. Slotboom, prof. J.N. Burghartz.

  87. Substrate Transfer for RF Technologies
    R. Dekker; P.G.M. Baltus; H.G.R. Maas;
    IEEE Transactions on Electron Devices,
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