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Electronic Components, Technology and Materials

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Electronic Components, Technology and Materials
Department of Microelectronics
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Teng Ma

Teng Ma graduated at the Section Electronic Components, Technology and Materials (ECTM) in November 2014.

MSc thesis: Monolithic integration of light sensor readout system for multi-functional LED wafer-level packaging based on BICMOS process
Advisor(s): GuoQi Zhang

Program: MSc Microelectronics

Teng Ma, MSc

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Electronic Components, Technology and Materials

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