prof.dr. GuoQi Zhang

Professor
Electronic Components, Technology and Materials (ECTM), Department of Microelectronics

Expertise: Heterogenous system integration, 2D materials and devices, wide bandgap semiconductor sensors, digital twin and reliability, multi-scale and multi-physics modeling

Themes: Advanced sensor materials, Micro/Nano System Integration and Reliability

Biography

Dr. G.Q. Zhang is a member of Netherlands Academy of Engineering, IEEE Fellow, chair professor for "Micro/Nanoelectronics System Integration and Reliability" of Delft University of Technology (TUD). His research interests cover multi-level heterogeneous system integration and packaging; multi-physics and multiscale modelling and optimization of micro/nanoelectronics; digital twin and designing for reliability; wide-bandgap semiconductors sensors and components; SSL technology; and their applications mainly in healthcare, energy and mobility.

He authored/co-authored more than 450 scientific publications; chaired /co-chaired several international conferences; serves as chief editor for Springer book series "SSL Technology and Applications", chief editor for Science Partner Journal “BioMedical Engineering Frontiers” and associated editor for three other international journals. He serves as deputy director of European Center for Micro- and Nanoreliability (EUCEMAN); co-chair of Advisory Board of International Solid-State Lighting Alliance (ISA); secretary-general of IEEE ITRW (International Technology Roadmap of Wide bandgap power semiconductors).

He chaired the Strategic Research Agenda of “More than Moore” of European’s technology platform for micro/nanoelectronics; served as co-chair of the academic council of Dutch national innovation program “Point-One” on “Micro/nanoelectronics and embedded system”; he was the founding person for MEMSLand, the NL national MEMS research consortium. Before becoming full-time professor of TUD, he worked for NXP Semiconductors as Senior Director of Technology Strategy until 2009, Philips Research Fellow until May 2013. He was also a part-time professor of Technical University of Eindhoven from 2001 and part-time professor of TUD from 2005.

ET4277 Microelectronics reliability

Reliability issues involved in electronic components and system

ET4391 Advanced microelectronics packaging

Basics and state-of-the-art of semiconductor device packaging and system integration.

Next-generation chip assembly processes

Developing technology for ultra-high throughput and sustainable chip assembly processes.

Compact modelling of high-tech systems for health management and optimization along the supply chain

Fundamentals of backside metals system for 5G RF power modules

In-vehicle health monitoring

Restoring Cardiac Mechanical Function by Polymeric Artificial Muscular Tissue

Projects history

Challenging environments tolerant smart systems for IoT

Intelligent Reliability 4.0

Internet of Things (IoT) security through machine learning and data sharing

Power2Power

European research project Power2Power for more efficient power semiconductors

High Performance Vehicle Computer and Communication System for Autonomous Driving

Solid State Lighting reliability for automotive application

GaN-based PiN Diodes for RF Power Limiter Application

Monolithically integrated SiC sun sensor for Space

Advanced packaging technology of SiC power module

High performance devices based on advanced materials

IoSense

Superconducting Carbon Nanotubes composite as Vertical Interconnect for Qubit Integration at Cryogenic Temperature

AlGaN/GaN High Electron Mobility Transistor (HEMT) Gas Sensor Platform Development

Thermal management in 3d heterogeneous integration

2D materials-based Heat Waste Recovery of LED

Gallium nitride (GaN) on silicon system integration

LED Luminaire Colour Shift

Smart Optics

Quick reliability assessment for mid-power white-light LED packages

3D System-in-package Design Using Stacked Silicon Submount Technology

Multifuntional LED Integration and Miniaturization

3D Smart Wafer Level Package for LEDs

Material Degradation in Solid State Lightening Applications

Fast qualification of solder reliability in solid state lighting application

Solid State Lighting reliability for automotive application

The use of SiPs in all kinds of applications is only possible if its reliability can be qualified

Innovative Thermal Management Breakthrough Of Advanced Solid State Lighting Module

A Fully Integrated Sequential Synchronized Switch Harvesting on Capacitors Rectifier Based on Split-Electrode for Piezoelectric Energy Harvesting
Xinling Yue; Jiarui Mo; Zhiyuan Chen; Sten Vollebregt; Guoqi Zhang; Sijun Du;
IEEE Transactions on Power Electronics,
Volume 39, Issue 6, pp. 7643-7653, 2024. DOI: 10.1109/TPEL.2024.3369728
Measuring residual stresses in individual on-chip interconnects using synchrotron nanodiffraction
Yaqian Zhang; Leiming Du; Olof Bäcke; Sebastian Kalbfleisch; Guoqi Zhang; Sten Vollebregt; Magnus Hörnqvist Colliander;
Applied Physics Letters,
Volume 124, pp. 083501-1-6, 2024. DOI: 10.1063/5.0192672
A high aspect ratio surface micromachined accelerometer based on a SiC-CNT composite material
Jiarui Mo; Shreyas Shankar; Roberto Pezone; Guoqi Zhang; Sten Vollebregt;
Microsystems & Nanoengineering,
Volume 10, Issue 42, 2024. DOI: 10.1038/s41378-024-00672-x
An Analog to Digital Converter in a SiC CMOS Technology for High-temperature Applications
Jiarui Mo; Yunfan Niu; Alexander May; Mathias Rommel; Chiara Rossi; Joost Romijn; Guoqi Zhang; Sten Vollebregt;
Applied Physics Letters,
Volume 124, Issue 15, 2024. DOI: 10.1063/5.0195013
Rectification in Ionic Field Effect Transistors Based on Single Crystal Silicon Nanopore
Hao Hong; Xin Lei; Jiangtao Wei; Yang Zhang; Yulong Zhang; Jianwen Sun; Guoqi Zhang; Pasqualina M. Sarro; Zewen Liu;
Advanced Electronic Materials,
pp. 2300782, 2024. DOI: 10.1002/aelm.202300782
Temperature Sensing Elements for Harsh Environments in a 4H-SiC CMOS Technology
Jiarui Mo; Jinglin Li; Alexander May; Mathias Rommel; Sten Vollebregt; Guoqi Zhang;
IEEE Transactions on Electron Devices,
Volume 71, Issue 10, pp. 5881-5887, 2024. DOI: 10.1109/TED.2024.3450828
Investigating Mechanical Properties of Silicon Carbide Coated Carbon Nanotube Composite at Elevated Temperatures
Jiarui Mo; Gerald J.K. Schaffar; Leiming Du; Verena Maier-Kiener; Daniel Kiener; Sten Vollebregt; Guoqi Zhang;
In IEEE 37th Intl. Conf. on Micro Electro Mechanical Systems (MEMS2024),
2024. DOI: 10.1109/MEMS58180.2024.10439455
In Situ Analysis of Copper Microstructures in Electromigration Using SEM-EBSD Techniques
Yaqian Zhang; Yixin Yan; Sten Vollebregt; GuoQi Zhang;
In Proceedings - IEEE 74th Electronic Components and Technology Conference (ECTC),
pp. 1317-1321, 2024. DOI: 10.1109/ECTC51529.2024.00214
Transient thermal measurement on nano-metallic sintered die-attach joints using a thermal test chip
R. Sattari; Dong Hu; Xu Liu; H. van Zeijl; S. Vollebregt; GuoQi Zhang;
Applied Thermal Engineering,
Volume 221, pp. 119503, 2023. DOI: 10.1016/j.applthermaleng.2022.119503
Coupling Model of Electromigration and Experimental Verification – Part I: Effect of Atomic Concentration Gradient
Zhen Cui; Xuejun Fan; Yaqian Zhang; Sten Vollebregt; Jiajie Fan; Guoqi Zhang;
Journal of the Mechanics and Physics of Solids,
Volume 174, pp. 105257, 2023. DOI: 10.1016/j.jmps.2023.105257
Coupling Model of Electromigration and Experimental Verification – Part II: Impact of Thermomigration
Zhen Cui; Xuejun Fan; Yaqian Zhang; Sten Vollebregt; Jiajie Fan; Guoqi Zhang;
Journal of the Mechanics and Physics of Solids,
Volume 174, pp. 105256, 2023. DOI: 10.1016/j.jmps.2023.105256
Microfabricated albedo insensitive sun position sensor system in silicon carbide with integrated 3D optics and CMOS electronics
Joost Romijn; Sten Vollebregt; Vincent G. de Bie; Luke M. Middelburg; Brahim El Mansouri; Henk W. van Zeijl; Alexander May; Tobias Erlbacher; Johan Leijtens; Guoqi Zhang; Pasqualina M. Sarro;
Sensors and Actuators A: Physical,
Volume 354, pp. 114268, 2023. DOI: 10.1016/j.sna.2023.114268
A Highly Linear Temperature Sensor Operating up to 600°C in a 4H-SiC CMOS Technology
Jiarui Mo; Jinglin Li; Yaqian Zhang; Joost Romijn; Alexander May; Tobias Erlbacher; Guoqi Zhang; Sten Vollebregt;
IEEE Electron Device Letters,
Volume 44, Issue 6, pp. 995-998, 2023. DOI: 10.1109/LED.2023.3268334
Study on the controllability of the fabrication of single-crystal silicon nanopores/nanoslits with a fast-stop ionic current-monitored TSWE method
Hao Hong; Jiangtao Wei; Xin Lei; Haiyun Chen; Pasqualina M. Sarro; Guoqi Zhang; Zewen Liu;
Microsystems & Nanoengineering,
Volume 9, pp. 63, 2023. DOI: 10.1038/s41378-023-00532-0
Nanostructured Thermoelectric Films Synthesised by Spark Ablation and Their Oxidation Behaviour
Joost van Ginkel; Lisa Mitterhuber; Marijn Willem van de Putte; Mark Huijben; Sten Vollebregt; Guoqi Zhang;
Nanomaterials,
Volume 13, Issue 11, pp. 1778, 2023. DOI: 10.3390/nano13111778
Copper Nanoparticle Sintering Enabled Hermetic Packaging With Fine Sealing Ring for MEMS Application
Dong Hu; Mustafeez Bashir Shah; Jiajie Fan; Sten Vollebregt; Guoqi Zhang;
IEEE Transactions on Electron Devices,
Volume 70, Issue 11, pp. 5818-5823, 2023. DOI: 10.1109/TED.2023.3312066
Design and Characterization of a Data Converter in a SiC CMOS Technology for Harsh Environment Sensing Applications
Yunfan Niu; Jiarui Mo; Alexander May; Mathias Rommel; Chiara Rossi; Joost Romijn; Guoqi Zhang; Sten Vollebregt;
In Proc. of IEEE Sensors,
2023. DOI: 10.1109/SENSORS56945.2023.10325061
Silicon carbide reinforced vertically aligned carbon nanotube composite for harsh environment MEMS
Jiarui Mo; Shreyas Shankar; Guoqi Zhang; Sten Vollebregt;
In IEEE 36th Intl. Conf. on Micro Electro Mechanical Systems (MEMS2023),
2023. DOI: 10.1109/MEMS49605.2023.10052162
Manufacturing of an In-Package Relative Humidity Sensor for Epoxy Molding Compound Packages
Romina Sattari; Henk van Zeijl; GuoQi Zhang;
In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
2023. DOI: 10.1109/EuroSimE56861.2023.10100771
Study on Sintering Mechanism and Mechanical Properties of Nano-Cu based on Molecular Dynamics Simulation
Cheng Qian; Dong Hu; Xu Liu; Xuejun Fan; Guoqi Zhang; Jiajie Fan;
In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
2023. DOI: 10.1109/EuroSimE56861.2023.10100810
Effect of Thermomigration on Electromigration in SWEAT Structures
Zhen Cui; Xuejun Fan; GuoQi Zhang;
In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
2023. DOI: 10.1109/EuroSimE56861.2023.10100774
Temperature Field Simulation and optimization for Horizontal 6-inch 4H-SiC Epitaxial CVD Reactor by Induction Heating
Zhuorui Tang; Jing Tian; Chaobin Mao; Nan Zhang; Jiyu Huang; Jiajie Fan; Guoqi Zhang;
In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
2023. DOI: 10.1109/EuroSimE56861.2023.10100813
Hydrolysis Mechanism Analysis of (Ca, Sr)AlSiN₃:Eu²⁺ Red Phosphor Aged Under Pressure Cooker Test and 85°C&85%RH Test: Kinetics Modeling and First-principles Calculation
Minzhen Wen; Baotong Guo; Shanghuan Chen; Xiao Hu; Xuejun Fan; Guoqi Zhang; Jiajie Fan;
In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
2023. DOI: 10.1109/EuroSimE56861.2023.10100750
Electromigration-induced local dewetting in Cu films
Yaqian Zhang; Jiarui Mo; Zhen Cui; Sten Vollebregt; GuoQi Zhang;
In Proc. of the IEEE International Interconnect Technology Conference,
2023. DOI: 10.1109/IITC/MAM57687.2023.10154761
Effect of Passivation and Mechanical Constraint on Electromigration in Interconnect
Xuejun Fan; Zhen Cui; GuoQi Zhang;
In Proc. of Electronic Components and Technology Conference (ECTC),
2023.
Low Temperature Fine Pitch All-Copper Interconnects Combining Photopatternable Underfill Films
Xinrui Ji; Henk Van Zeijl; Weiping Jiao; Shan He; Leiming Du; Guoqi Zhang;
In Proc. of Electronic Components and Technology Conference (ECTC),
2023.
Reliability Analysis on Ag and Cu Nanoparticles Sintered Discrete Power Devices with Various Frontside and Backside Interconnects
Dong Hu; Xu Liu; Sten Vollebregt; Jiajie Fan; Guoqi Zhang; Ali Roshanghias; Xing Liu; Thomas Basler; Emiel De Bruin;
In Proc. of Electronic Components and Technology Conference (ECTC),
2023.
A Thin-Film Reconfigurable SiC Thermal Test Chip for Reliability Monitoring in Harsh Environments
Romina Sattari; Henk van Zeijl; GuoQi Zhang;
In Proc. of Electronic Components and Technology Conference (ECTC),
2023.
Simulation, Prediction, and Verification of the Corrosion Behavior of Cu-Ag Composite Sintered Paste for Power Semiconductor Die-Attach Applications
Xinyue Wang; Zhoudong Yang; Pan Liu; Guoqi Zhang; Jing Zhang;
In Proc. of Electronic Components and Technology Conference (ECTC),
2023.
Thermal-Mechanical-Electrical Co-Design of Fan-Out Panel-Level SiC MOSFET Packaging with a Multi-Objective Optimization Algorithm
Wei Chen; Xuyang Yan; Jiajie Fan; Mesfin S. Ibrahim; Jing Jiang; Xuejun Fan; Guoqi Zhang;
In Proc. of Electronic Components and Technology Conference (ECTC),
2023.
Impact of Temperature Cycling Conditions on Board Level Vibration for Automotive Applications
Varun Thukral; Irene Bacquet; Michiel Soestbergen; Jeroen Zaal; Romuald Roucou; Rene Rongen; Willem van Driel; GuoQi Zhang;
In Proc. of Electronic Components and Technology Conference (ECTC),
2023.
Heterogeneous Integration of Diamond Heat Spreaders for Power Electronics Application
Henry Antony Martin; Marcia Reintjes; Xiao Tang; Dave Reijs; Sander Dorrestein; Martien Kengen; Sebastien Libon; Edsger Smits; Marco Koelink; Rene Poelma; Willem Van Driel; GuoQi Zhang;
In Proc. of Electronic Components and Technology Conference (ECTC),
2023.
High-Temperature Creep Properties of a Novel Solder Material and Its Thermal Fatigue Properties Under Potting Material
Leiming Du; Guoqi Zhang; Xiujuan Zhao; Willem Van Driel; Rene Poelma;
In Proc. of Electronic Components and Technology Conference (ECTC),
2023.
High-performance Silicon Carbide-on-insulator Thermoresistive High-temperature Sensor Up To 750 C
Baoyun Sun; Jiarui Mo; Willem D. van Driel; GuoQi Zhang;
In 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS 2023),
2023.
document
MOSFET-based And P-N Diode Based Temperature Sensors In A 4H-sSiC CMOS Technology
Jiarui Mo; Jinglin Li; Yaqian Zhang; Alexander May; Tobias Erlbacher; Guoqi Zhang; Sten Vollebregt;
In 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS 2023),
2023.
document
Silicon Carbide-on-Insulator Thermal-Piezoresistive Resonator for Harsh Environment Application
Baoyun Sun; Jiarui Mo; Hemin Zhang; Henk W. van Zeijl; Willem D. van Driel; GuoQi Zhang;
In IEEE 36th Intl. Conf. on Micro Electro Mechanical Systems (MEMS2023),
2023. DOI: 10.1109/MEMS49605.2023.10052401
Time Dependent Dielectric Breakdown of 4H-SiC MOSFETs in CMOS technology
Yaqian Zhang; Jiarui Mo; Sten Vollebregt; GuoQi Zhang;
In 24th International Conference on Electronic Packaging Technology (ICEPT),
2023. DOI: 10.1109/ICEPT59018.2023.10492218
Integrated Digital and Analog Circuit Blocks in a Scalable Silicon Carbide CMOS Technology
Joost Romijn; Sten Vollebregt; Luke M. Middelburg; Brahim El Mansouri; Henk W. van Zeijl; Alexander May; Tobias Erlbacher; Guoqi Zhang; Pasqualina M. Sarro;
IEEE Transactions on Electron Devices,
Volume 69, Issue 1, pp. 4-10, 2022. DOI: 10.1109/TED.2021.3125279
Mass and density determination of porous nanoparticle films using a quartz crystal microbalance
Hendrik Joost van Ginkel; Sten Vollebregt; GuoQi Zhang; Andreas Schmidt-Ott;
IOP Nanotechnology,
Volume 33, Issue 48, 2022. DOI: 10.1088/1361-6528/ac7811
Effects of Temperature and Grain Size on Diffusivity of Aluminium: Electromigration Experiment and Molecular Dynamic Simulation
Zhen Cui; Yaqian Zhang; Dong Hu; Sten Vollebregt; Jiajie Fan, Xuejun Fan; Guoqi Zhang;
Journal of Physics: Condensed Matter,
Volume 34, pp. 175401, 2022. DOI: 10.1088/1361-648X/ac4b7f
Angle Sensitive Optical Sensor for Light Source Tracker Miniaturization
Joost Romijn; Secil Sanseven; Guoqi Zhang; Sten Vollebregt; Pasqualina M. Sarro;
IEEE Sensors Letters,
Volume 6, Issue 6, pp. 1-4, 2022. DOI: 10.1109/LSENS.2022.3175607
Board level vibration test method of components for automotive electronics: State-of-the-art approaches and challenges
V. Thukral; M. van Soestbergen; J.J.M. Zaal; R. Roucou; R.T.H. Rongen; W.D. van Driel; GuoQi Zhang;
Microelectronics Reliability,
Volume 139, pp. 114830, 2022. DOI: 10.1016/j.microrel.2022.114830
Integrated 64 pixel UV image sensor and readout in a silicon carbide CMOS technology
Joost Romijn; Sten Vollebregt; Luke M. Middelburg; Brahim El Mansouri; Henk W. van Zeijl; Alexander May; Tobias Erlbacher; Johan Leijtens; Guoqi Zhang; Pasqualina M. Sarro;
Nature Microsystems & Nanoengineering,
Volume 8, pp. 114, 2022. DOI: 10.1038/s41378-022-00446-3
Reliability of Organic Compounds in Microelectronics and Optoelectronics
Willem Dirk van Driel; Maryam Yazdan Mehr; Xuejun Fan; GuoQi Zhang (Ed.);
Springer, , 2022. DOI: 10.1007/978-3-030-81576-9
Degradation and Failures of Polymers Used in Light-Emitting Diodes
Maryam Yazdan Mehr; W. D. van Driel; GuoQi Zhang;
Springer, , 2022. DOI: 10.1007/978-3-030-81576-9_8
Outlook: From Physics of Failure to Physics of Degradation
W. D. van Driel; Maryam Yazdan Mehr; X. J. Fan; GuoQi Zhang;
Springer, , 2022. DOI: 10.1007/978-3-030-81576-9_17
Patterning of Fine-Features in Nanoporous Films Synthesized by Spark Ablation
Xinrui Ji; Joost van Ginkel; Dong Hu; Andreas Schmidt-Ott; Henk van Zeijl; Sten Vollebregt; GuoQi Zhang;
In Proc. IEEE Nano,
pp. 238-241, 2022. DOI: 10.1109/NANO54668.2022.9928705
Visible Blind Quadrant Sun Position Sensor in a Silicon Carbide Technology
Joost Romijn; Sten Vollebregt; Alexander May; Tobias Erlbacher; Henk W. van Zeijl; Johan Leijtens; GuoQi Zhang; Pasqualina M. Sarro;
In 35th Intl. Conf. on Micro Electro Mechanical Systems (MEMS 2022),
2022. DOI: 10.1109/MEMS51670.2022.9699533
ZnO Nanoparticle Printing for UV Sensor Fabrication
Hendrik Joost van Ginkel; Mattia Orvietani; Joost Romijn; GuoQi Zhang; Sten Vollebregt;
In Proc. of IEEE Sensors,
2022. DOI: 10.1109/SENSORS52175.2022.9967053
In-situ reliability monitoring of power packages using a Thermal Test Chip
H. A. Martin; R. Sattari; E. C. P. Smits; H. W. van Zeijl; W. D. van Driel; GuoQi Zhang;
In 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
2022. DOI: 10.1109/EuroSimE54907.2022.9758913
Surface-micromachined Silicon Carbide Pirani Gauges for Harsh Environments
Jiarui Mo; Luke Middelburg; Bruno Morana; H.W. Van Zeijl; Sten Vollebregt; GuoQi Zhang;
IEEE Sensors Letters,
Volume 21, Issue 2, pp. 1350-1358, 2021. DOI: 10.1109/JSEN.2020.3019711
A Review of Modification Methods of Solid Electrolytes for All-Solid-State Sodium-Ion Batteries
Dai, Hanqing; Chen, Yuanyuan; Xu, Wenqian; Hu, Zhe; Gu, Jing; Wei, Xian; Xie, Fengxian; Zhang, Wanlu; Wei, Wei; Guo, Ruiqian; Zhang, Guoqi;
Energy Technology,
Volume 9, Issue 1, pp. 2000682, 2021. DOI: 10.1002/ente.202000682
document
Insights into the high-sulphur aging of sintered silver nanoparticles: An experimental and ReaxFF study
Dong Hu; Tijian Gu; Zhen Cui; Sten Vollebregt; Xuejun Fan; Guoqi Zhang; Jiajie Fan;
Corrosion Science,
pp. 109846, 2021. DOI: 10.1016/j.corsci.2021.109846
Optical ventricular cardioversion by local optogenetic targeting and LED implantation in a cardiomyopathic rat model
Emile C. A. Nyns; Tianyi Jin; Magda S Fontes; Titus van den Heuvel; Vincent Portero; Catilin Ramsey; Cindy I. Bart; Katja Zeppenfeld; Martin J. Schalij; Thomas J. van Brakel; Arti A. Ramkisoensing; GuoQi Zhang; René H. Poelma; Balazs Ördög; Antoine A. F. de Vries; Daniël A. Pijnappels;
Cardiovascular Research,
September 2021. DOI: 10.1093/cvr/cvab294
Enhanced Sensitivity Pt/AlGaN/GaN Heterostructure NO₂ Sensor Using a Two-Step Gate Recess Technique
Jianwen Sun; Teng Zhan; Robert Sokolovskij; Zewen Liu; Pasqualina M. Sarro; Guoqi Zhang;
IEEE Sensors Journal,
Volume 21, Issue 15, pp. 16475-16483, 2021. DOI: 10.1109/JSEN.2021.3082205
Design of a Fan-Out Panel-Level SiC MOSFET Power Module Using Ant Colony Optimization-Back Propagation Neural Network
Qian, Yichen; Hou, Fengze; Fan, Jiajie; Lv, Quanya; Fan, Xuejun; Zhang, Guoqi;
IEEE Transactions on Electron Devices,
Volume 68, Issue 7, pp. 3460-3467, 2021. DOI: 10.1109/TED.2021.3077209
Room temperature ppt-level NO2 gas sensor based on SnOx/SnS nanostructures with rich oxygen vacancies
Hongyu Tang; Chenshan Gao; Huiru Yang; Leandro Nicolas Sacco; Robert Sokolovskij; Hongze Zheng; Huaiyu Ye; Sten Vollebregt; Hongyu Yu; Xuejun Fan; Guoqi Zhang;
2D Materials,
2021. DOI: 10.1088/2053-1583/ac13c1
System level reliability assessment for high power light-emitting diode lamp based on a Bayesian network method
Mesfin Seid Ibrahim; Jiajie Fan; Winco K.C. Yung; Zhou Jing; Xuejun Fan; Willem van Driel; Guoqi Zhang;
Measurement,
Volume 176, pp. 109191, 2021. DOI: 10.1016/j.measurement.2021.109191
document
Low Leakage and High Forward Current Density Quasi-Vertical GaN Schottky Barrier Diode With Post-Mesa Nitridation
X. Kang; Y. Sun; Y. Zheng; K. Wei; H. Wu; Y. Zhao; Xu Liu; GuoQi Zhang;
IEEE Transactions on Electron Devices,
Volume 68, Issue 3, pp. 1369-1373, 2021. DOI: 10.1109/TED.2021.3050739
Investigating the Electrochemical Performance of Smart Self-Powered Bionic Skin Fragment Based on Bioelectricity Generation
Dai, H.; Chen, Y.; Dai, W.; Hu, Z.; Xie, F.; Xu, W.; Cui, Z.; Wei, X.; Chen, Z.; Yang, B.; Zhang, W.; Wei, W.; Guo, R.; Zhang, GuoQi;
Advanced Materials Technologies,
Volume 6, Issue 3, 2021. DOI: 10.1002/admt.202000848
document
Facile Synthesis of Ag Nanowire/TiO2 and Ag Nanowire/TiO2/GO Nanocomposites for Photocatalytic Degradation of Rhodamine B
Hajipour, Pejman; Bahrami, Abbas; Mehr, Maryam Yazdan; van Driel, Willem Dirk; Zhang, GuoQi;
Materials,
Volume 14, Issue 4, 2021. DOI: 10.3390/ma14040763
document
Correction: The inactivation mechanism of chemical disinfection against SARS-CoV-2: from MD and DFT perspectives
Tan, Chunjian; Gao, Chenshan; Zhou, Quan; Van Driel, Willem; Ye, Huaiyu; Zhang, GuoQi;
RSC Adv.,
Volume 11, pp. 3509-3509, 2021. DOI: 10.1039/D0RA90127J
document
Effects of Defect and Temperature on the Mechanical Performance of WS2: A Multiscale Analysis
Hongyu Tang; Dong Hu; Zhen Cui; Huaiyu Ye; GuoQi Zhang;
Journal of Physical Chemistry C,
2021.
document
Resistive and PTAT Temperature Sensors in a Silicon Carbide CMOS Technology
Joost Romijn; Luke M. Middelburg; Sten Vollebregt; Brahim El Mansouri; Henk W. van Zeijl; Alexander May; Tobias Erlbacher; Guoqi Zhang; and Pasqualina M. Sarro;
In Proc. of IEEE Sensors,
2021.
Constitutive Modeling of Sintered Nano-silver Particles: A Variable-order Fractional Model versus an Anand Model
Fan, Jiajie; Gu, Tijian; Wang, Ping; Cai, Wei; Fan, Xuejun; Zhang, Guoqi;
In 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
pp. 1-4, 2021. DOI: 10.1109/EuroSimE52062.2021.9410807
High step coverage interconnects by printed nanoparticles
Hendrik Joost van Ginkel; Joost Romijn; Sten Vollebregt; GuoQi Zhang;
In Proc. of the 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC),
2021.
Design and Fabrication of a Multi-Functional Programmable Thermal Test Chip
R. Sattari; H. van Zeijl; GuoQi Zhang;
In 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC),
2021. DOI: 10.23919/EMPC53418.2021.9584984
Fan-out Panel-level PCB Embedded SiC Power MOSFETs Packaging
Fengze Hou; W. Wang; R. Ma; Y. Li; Z. Han; M. Su; J. Li; Z. Yu; Y. Song; Q. Wang; M. Chen; L. Cao; GuoQi Zhang; J.A. Ferreira;
IEEE Journal of Emerging and Selected Topics in Power Electronics,
Volume 8, Issue 1, pp. 367-380, 2020.
Review of Packaging Schemes for Power Module
Fengze Hou; W. Wang; L. Cao; M. Su; J. Li; GuoQi Zhang; J.A. Ferreira;
IEEE Journal of Emerging and Selected Topics in Power Electronics,
Volume 8, Issue 1, pp. 223-238, 2020.
Microchannel Thermal Management System with Two-Phase Flow for Power Electronics over 500 W/cm2 Heat Dissipation
Fengze Hou; Hengyun Zhang; Dezhu Huang; Jiajie Fan; Fengman Liu; Tingyu Lin; Liqiang Cao; Xuejun Fan; Braham Ferreira; GuoQi Zhang;
IEEE Transactions on Power Electronics,
Volume 35, Issue 10, pp. 10592-10600, 2020. DOI: 10.1109/TPEL.2020.2985117
Towards Multi-Functional SiO2@YAG:Ce Core–Shell Optical Nanoparticles for Solid State Lighting Applications
Mahdi Kiani Khouzani; Abbas Bahrami; Maryam Yazdan Mehr; Willem Dirk van Driel; GuoQi Zhang;
Nanomaterials,
Volume 10, Issue 1, pp. 153, 2020. DOI: 10.3390/nano10010153
Maintaining Transparency of a Heated MEMS Membrane for Enabling Long-Term Optical Measurements on Soot-Containing Exhaust Gas
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Germanene on single layer ZnSe substrate: Novel electronic and optical properties
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A stochastic process based reliability prediction method for LED driver
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Volume 178, pp. 140-146, 2018.
High Selective Gas Detection for small molecules based on Germanium selenide monolayer
Liu, L.; Yang, Q.; Wang, Z.; Ye, H.; Chen, X.; Fan, X.; GuoQi Zhang;
Applied Surface Science,
pp. 575-581, 2018. DOI: 10.1016/j.apsusc.2017.10.084
Hydrogen sulfide detection properties of Pt-gated AlGaN/GaN HEMT-sensor
Sokolovskij, R.; Zhang, J.; Iervolino, E.; Zhao, C.; Santagata, F.; Wang, F.; Yu, H.; Sarro, P. M.; GuoQi Zhang;
Sensors and Actuators B: Chemical,
2018. DOI: 10.1016/j.snb.2018.08.015
In Situ Failure Detection of Electronic Control Units Using Piezoresistive Stress Sensor
Prisacaru, A.; Palczynska, A.; Theissler, A.; Gromala, P.; Han, B.; GuoQi Zhang;
IEEE Transactions on Components, Packaging and Manufacturing Technology,
Volume 750-763, 2018. DOI: 10.1109/TCPMT.2018.2816259
Influence of pressure on the mechanical and electronic properties of wurtzite and zinc-blende gaN crystals
Qin, H.; Kuang, T.; Luan, X.; Li, W.; Xiao, J.; Zhang, P.; Yang, D.; GuoQi Zhang;
Crystals,
2018. DOI: 10.3390/cryst8110428
The effects of graphene stacking on the performance of methane sensor: A first-principles study on the adsorption, band gap and doping of graphene
Yang, N.; Yang, D.; GuoQi Zhang; Chen, L.; Liu, D.; Cai, M.; Fan, X.;
Sensors,
2018. DOI: 10.3390/s18020422
Study on the Degradation of Optical Silicone Exposed to Harsh Environments
Yazdan Mehr, M.; van Driel, W.; De Buyl, F.; GuoQi Zhang;
Materials,
2018. DOI: 10.3390/ma11081305
Microstructure and hardness of SAC305 and SAC305-0.3Ni solder on Cu, high temperature treated Cu, and graphene-coated Cu substrates
Li, S.; Yang Liu; Hao Zhang; Cai, H.; Sun, F.; GuoQi Zhang;
Results in Physics,
2018. DOI: 10.1016/j.rinp.2018.10.005
Microstructure and hardness of SAC305-xNi solder on Cu and graphene-coated Cu substrates
Yang Liu; Li, S.; Hao Zhang; Cai, H.; Sun, F.; GuoQi Zhang;
Journal of Materials Science: Materials in Electronics,
pp. 13167-13175, 2018. DOI: 10.1007/s10854-018-9440-2
Promoting sensitivity and selectivity of HCHO sensor based on strained InP3 monolayer: A DFT study
Yang, H.; Wang, Z.; Ye, H.; Zhang, K.; Chen, X.; GuoQi Zhang;
Applied Surface Science,
pp. 554-561, 2018. DOI: 10.1016/j.apsusc.2018.08.014
A photovoltaic window with sun-tracking shading elements towards maximum power generation and non-glare daylighting
Yuan Gao; Jianfei Dong; Olindo Isabella; Rudi Santbergen; Hairen Tan; Miro Zeman; GuoQi Zhang;
Applied Energy,
Volume 228, pp. 1454-1472, 2018.
Effects of Conformal Nanoscale Coatings on Thermal Performance of Vertically Aligned Carbon Nanotubes
Cinzia Silvestri; Michele Riccio; René H. Poelma; Aleksandar Jovic; Bruno Morana; Sten Vollebregt; Andrea Irace; GuoQi Zhang; Pasqualina M. Sarro;
Small,
Volume 14, Issue 20, pp. 1800614, 2018. DOI: 10.1002/smll.201800614
Reliability Prediction of Integrated LED Lamps with Electrolytic Capacitor-Less LED Drivers
Bo Sun; Fan, X.; van Driel, W. D. (ed.); GuoQi Zhang;
Springer, , 2018. DOI: 10.1007/978-3-319-58175-0_16
LED-Based Luminaire Color Shift Acceleration and Prediction
Lu, G.; van Driel, W. D. (ed.); Fan, X.; Fan, J.; GuoQi Zhang;
Springer, , pp. 201-219, 2018. DOI: 10.1007/978-3-319-58175-0_9
Reliability and Lifetime Assessment of Optical Materials in LED-Based Products
Maryam Yazdan Mehr; Willem Dirk van Driel; GuoQi Zhang;
In Solid State Lighting Reliability Part 2,
Springer, 2018.
High Power-Density 3D Integrated Power Supply Module Based on Panel-Level PCB Embedded Technology
Fengze Hou; Xueping Guo; Qidong Wang; Wenbo Wang; Tingyu Lin; Liqiang Cao; GuoQi Zhang; J.A. Ferreira;
In Proc. IEEE Electronic Components and Technol. Conf. (ECTC),
pp. 1365- 1370, 2018.
Designing a 100 [aF/nm] capacitive transducer
L. M. Middelburg; B. El Mansouri; R. H. Poelma; H. W. van Zeijl; Jia Wei; GuoQi Zhang; W. D. van Driel;
In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
2018.
Modeling of two-dimensional hyperbolic heat conduction in silicon-on-insulator transistor by equivalent RLC network
Amir Mirza Gheytaghi; Huaiyu Ye; GuoQi Zhang;
In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
2018.
Wafer Level Through-polymer Optical Vias (TPOV) Enabling High Throughput of Optical Windows Manufacturing
Z. Huang; R.H. Poelma; S. Vollebregt; M.H. Koelink; E. Boschman; R. Kropf; M. Gallouch; GuoQi Zhang;
In IEEE Electronics System-Integration Technology Conference (ESTC),
pp. 1-5, 2018.
Interfacial properties of Cu/SiO2 using a multiscale modelling approach in electronic packages
Zhen Cui; Xianping Chen; Xuejun Fan; GuoQi Zhang;
In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
2018.
A probabilistic physics-of-failure reliability assessment approach for integrated LED lamps
Bo Sun; Jiajie Fan; Xuejun Fan; GuoQi Zhang;
In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
2018.
SiC MOSFET Threshold-Voltage Instability under High Temperature Aging
Liu, Y.; Chen, X.; Zhao, Z.; Li, Z.; Lu, C.; Zhang, J.; Ye, H.; Koh, S. W.; Wang, L.; GuoQi Zhang;
In Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018,
2018. DOI: 10.1109/ICEPT.2018.8480781
The performance of sintered nanocopper interconnections for high temperature device
Liu, Q.; Chen, X.; Zhu, J.; Zhang, H.; Zhang, J. S.; Zhang, J. G.; Wang, L.; Ye, H.; Koh, S. W.; GuoQi Zhang;
In 19th International Conference on Electronic Packaging Technology, ICEPT 2018,
IEEE, 2018. DOI: 10.1109/ICEPT.2018.8480591
Non-Linear Bulk Micromachined Accelerometer for High Sensitivity Applications
Middelburg, L. M.; Mansouri, B. E.; Poelma, R.; GuoQi Zhang; Van Zeijl, H.; Wei, J.;
In Proc. IEEE Sensors,
2018. DOI: 10.1109/ICSENS.2018.8589630
Study of ultraviolet assisted cure mechanism of the phosphor/silicone composites used in White LEDs
Wang, Z.; Fan, J.; Liu, J.; Hu, A.; Qian, C.; Fan, X.; GuoQi Zhang;
In 19th International Conference on Electronic Packaging Technology, ICEPT 2018,
IEEE, pp. 525-530, 2018. DOI: 10.1109/ICEPT.2018.8480566
Interfacial Failure Characterization of Electronic Packaging Component Using a Multiscale Modelling Approach
Zhen Cui; Yingying Zhang; Qun Yang; GuoQi Zhang; Xianping Chen;
In IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM),
2018. DOI: 10.1109/EDTM.2018.8421434
Shining light on cardiac tachyarrhythmias
Nyns E CA; Bingen B O; Bart C I; Kip A; Poelma R H; Volkers L; Plomp J J; Jangsangthong W; Engels M C; Schalij M J; GuoQi Zhang; de Vries A AF; Pijnappels D A;
In Changing the Face of Modern Medicine: Stem Cell and Gene Therapy,
2018. DOI: 10.1089/hum.2018.29077.abstracts
Internal stress state of TQFP subjected to liquid thermal shock using piezoresistive silicon stress sensor
Prisacaru, A.; Sun, Y.; Gromala, P. J.; Han, B.; GuoQi Zhang;
In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE,
IEEE, pp. 1-3, 2018. DOI: 10.1109/EuroSimE.2018.8369955
Fatigue Damage Assessment of LED Chip Scale Packages with Finite Element Simulation
Fan, J.; Hu, A.; Pecht, M.; Chen, W.; Fan, X.; Xu, D.; GuoQi Zhang;
In 19th International Conference on Electronic Packaging Technology, ICEPT 2018,
IEEE, pp. pp. 1642-1648, 2018. DOI: 10.1109/ICEPT.2018.8480748
Three dimensional thermoacoustic device composed of nanoporous material and the method to fabricate such a device
Poelma, R.; GuoQi Zhang, G. Q.; Yi, H.; van Zeijl, H.;
Patent, NL 2017268, 2018. IPC No. H04R, Priority date 1 Aug 2016, Priority No. NL 2017268.
First-Principles Study of Nitric Oxide Sensor Based on Blue Phosphorus Monolayer
HC Luo; RS Meng; H Gao; X Sun; J Xiao; HY Ye; GuoQi Zhang; XP Chen;
IEEE Electron Device Letters,
Volume 38, Issue 8, pp. 1139-1142, 2017.
Effects of Graphene Monolayer Coating on the Optical Performance of Remote Phosphors
Maryam Yazdan Mehr; S. Vollebregt; W. D. van Driel; GuoQi Zhang;
Journal of Electronic Materials,
Volume 46, Issue 10, pp. 5866--5872, 2017. DOI: 10.1007/s11664-017-5592-8

Keywords: ...
graphene, Light-emitting diode, reliability, remote phosphor.
Color shift acceleration on mid-power LED packages
Guangjun Lu; Driel, W.D. van; Xuejun Fan; Jiajie Fan; Cheng Qian; GuoQi Zhang;
Microelectronics Reliability,
Volume 78, Issue Supplement C, pp. 294 -- 298, 11 2017. DOI: 10.1016/j.microrel.2017.09.014

Keywords: ...
Color shift, Mid-power LED package, Temperature stress, Current stress, Humidity stress.
Reliability and diffusion-controlled through thickness oxidation of optical materials in LED-based products
Yazdan Mehr, M.; M.R. Toroghinejad; F. Karimzadeh; van Driel, W.D.; GuoQi Zhang;
Microelectronics Reliability,
Volume 78, pp. 143--147, 2017. DOI: 10.1016/j.microrel.2017.08.014

Keywords: ...
BPA-PC, LED-based products, Optics, Oxidation, Yellowing.
Microstructure, hardness, and shear behavior of the as-soldered SnBi–SAC composite solder pastes
Y Liu; H Fu; H Zhang; F Sun; X Wang; GuoQi Zhang;
Journal of Materials Science: Materials in Electronics,
Volume 28, Issue 24, pp. 19113-19120, 2017.
Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component
Hongyu Tang; H Ye; CKY Wong; SYY Leung; J Fan; X Chen; X Fan; GuoQi Zhang;
Microelectronics Reliability,
Volume 78, pp. 197-204, 2017.
Phosphor–silicone interaction effects in high power white light emitting diode packages
J Fan; M Zhang; X Luo; C Qian; X Fan; A Ji; GuoQi Zhang;
Journal of Materials Science: Materials in Electronics,
Volume 28, Issue 23, pp. 17557-17569, 2017.
Photometric and Colorimetric Assessment of LED Chip Scale Packages by Using a Step-Stress Accelerated Degradation Test (SSADT) Method
C Qian; J Fan; J Fang; C Yu; Y Ren; X Fan; GuoQi Zhang;
Materials,
Volume 10, Issue 10, pp. 1181, 2017.
Modeling nonlinear moisture diffusion in inhomogeneous media
L Chen; J Zhou; H Chu; GuoQi Zhang; X Fan;
Microelectronics Reliability,
Volume 75, pp. 162-170, 2017.
Humidity sensor based on the ionic polymer metal composite
E Esmaeli; M Ganjian; H Rastegar; M Kolahdouz; Z Kolahdouz; GuoQi Zhang;
Sensors and Actuators B: Chemical,
Volume 247, pp. 498-504, 2017.
Silicon-based multi-functional wafer-level-package for LEDs in 7-mask BiCMOS process
Zahra Kolahdouz; T Ma; H Abdy; M Kolahdouz; H van Zeijl; GuoQi Zhang;
Sensors and Actuators A: Physical,
Volume 263, pp. 622-632, 2017.
Sensitive and Reversible Detection of Methanol and Water Vapor by In Situ Electrochemically Grown CuBTC MOFs on Interdigitated Electrodes
Sumit Sachdeva; Manjunath R. Venkatesh; Brahim El Mansouri; Jia Wei; Andre Bossche; Freek Kapteijn; GuoQi Zhang; Jorge Gascon; Louis C. P. M. de Smet; Ernst J. R. Sudhölter;
Small,
Volume 13, Issue 29, pp. 1604150, 2017.
Hybrid plasmonics slot THz waveguide for subwavelength field confinement and crosstalk between two waveguides
J Xiao; QQ Wei; DG Yang; P Zhang; N He; GuoQi Zhang; XP Chen;
IEEE Journal of Selected Topics in Quantum Electronics,
Volume 23, Issue 4, 2017.
Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package
Fengze Hou; T Lin; L Cao; F Liu; J Li; X Fan; GuoQi Zhang;
IEEE Transactions on Components, Packaging and Manufacturing Technology,
Volume 7, Issue 10, pp. 1721-1728, 2017.
Nitrogen Dioxide Gas Sensor Based on Monolayer SnS: A First-Principle Study
FF Hu; Hongyu Tang; CJ Tan; HY Ye; XP Chen; GuoQi Zhang;
IEEE Electron Device Letters,
Volume 38, Issue 7, pp. 983-986, 2017.
Thermal/luminescence characterization and degradation mechanism analysis on phosphor-converted white LED chip scale packages
J Fan; C Yu; C Qian; X Fan; GuoQi Zhang;
Microelectronics Reliability,
Volume 74, pp. 179-185, 2017.
A Reliability Prediction for Integrated LED Lamp With Electrolytic Capacitor-Free Driver
Bo Sun; X Fan; L Li; H Ye; W van Driel; GuoQi Zhang;
IEEE Transactions on Components and Packaging and Manufacturing Technology,
Volume 7, Issue 7, pp. 1081-1088, 2017.
Studies of the light output properties for a GaN based blue LED using an electro-optical simulation method
C Qian; Y Li; J Fan; X Fan; J Fu; L Zhao; GuoQi Zhang;
Microelectronics Reliability,
Volume 74, pp. 173-178, 2017.
Integrated virtual impactor enabled PM 2.5 sensor
Mingzhi Dong; E Iervolino; F Santagata; G Zhang; GuoQi Zhang;
IEEE Sensors Journal,
Volume 17, Issue 9, pp. 2814-2821, 2017.
A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation
Bo Sun; X Fan; H Ye; J Fan; C Qian; W van Driel; GuoQi Zhang;
Reliability Engineering & System Safety,
Volume 163, pp. 14-21, 2017.
Sulfur Dioxide and Nitrogen Dioxide Gas Sensor Based on Arsenene: A First-Principle Study
XP Chen; LM Wang; X Sun; RS Meng; J Xiao; HY Ye; GuoQi Zhang;
IEEE Electron Device Letters,
Volume 38, Issue 5, pp. 661-664, 2017.
Color shift modeling of light-emitting diode lamps in step-loaded stress testing
M Cai; D Yang; J Huang; M Zhang; X Chen; C Liang; S Koh; GuoQi Zhang;
IEEE Photonics Journal,
Volume 9, Issue 1, pp. 1-14, 2017.
Monolithically integrated light feedback control circuit for blue/UV LED smart package
Zahra K Esfahani; M Tohidian; H van Zeijl; M Kolahdouz; GuoQi Zhang;
IEEE Photonics Journal,
Volume 9, Issue 2, pp. 1-13, 2017.
Identification and robust control of the nonlinear photoelectrothermal dynamics of LED systems
J Dong; GuoQi Zhang;
IEEE Transactions on Industrial Electronics,
Volume 64, Issue 3, pp. 2215-2225, 2017.
Prediction of lumen depreciation and color shift for phosphor-converted white light-emitting diodes based on a spectral power distribution analysis method
C Qian; J Fan; X Fan; GuoQi Zhang;
IEEE Access,
Volume 5, pp. 24054-24061, 2017.
Color shift failure prediction for phosphor-converted white LEDs by modeling features of spectral power distribution with a nonlinear filter approach
J Fan; MG Mohamed; C Qian; X Fan; GuoQi Zhang; M Pecht;
Materials 10,
Volume 7, pp. 819, 2017.
Numerical Thermal Analysis and Optimization of Multi-Chip LED Module Using Response Surface Methodology and Genetic Algorithm
Hongy Tang; HY Ye; XP Chen; C Qian; XJ Fan; GuoQi Zhang;
IEEE Access,
Volume 5, Issue 5, pp. 16459-16468, 2017.
High aspect ratio spiral resonators for process variation investigation and MEMS applications
L. Middelburg; B. El Mansouri; H. van Zeijl; GuoQi Zhang; R. H. Poelma;
In Proc. IEEE Sensors,
2017.
An AlAs/germanene heterostructure with outstanding tunability of electronic properties
C Tan; Q Yang; H Ye; X Chen; GuoQi Zhang;
In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
2017.
Smart Systems Integration in the era of Solid State Lighting
GuoQi Zhang; H. van Zeijl; W.D. van Driel; R. Poelma; Z.K. Esfahani; M.R. Venkatesh; L. Middelburg; B. El Mansouri;
In Smart System Integration conference (SSI),
2017.
Horizontally aligned carbon nanotube scaffolds for freestanding structures with enhanced conductivity
Cinzia Silvestri; Federico Marciano; Bruno Morana; Violeta Podranovic; Sten Vollebregt; GuoQi Zhang; Pasqualina M Sarro;
In Micro Electro Mechanical Systems (MEMS), 2017 IEEE 30th International Conference on,
pp. 266-269, 2017.
Optimization of reflow soldering process for white LED chip-scale-packages on substrate
C Jiang; W Guo; J Fan; C Qian; X Fan; GuoQi Zhang;
In Electronic Packaging Technology (ICEPT), 2017 18th International Conference on,
2017.
Luminous flux modeling for high power LED automotive headlamp module
C Yu; J Fan; C Qian; X Fan; GuoQi Zhang;
In Electronic Packaging Technology (ICEPT), 2017 18th International Conference on,
2017.
Condition monitoring algorithm for piezoresistive silicon-based stress sensor data obtained from electronic control units
A Prisacaru; A Palczynska; PJ Gromala; B Han; GuoQi Zhang;
In Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th,
2017.
Pt-AlGaN/GaN HEMT-Sensor for Hydrogen Sulfide (H2S) Detection
R Sokolovskij; E Iervolino; C Zhao; F Santagata; F Wang; H Yu; PM Sarro; GuoQi Zhang;
In Proceedings of Eurosensors,
pp. 463, 2017.
A PoF and statistics combined reliability prediction for LED arrays in lamps
B Sun; X Fan; J Fan; C Qian; GuoQi Zhang;
In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
2017.
Electrical and optical properties of NO and H2S adsorption on Arsenic Phosphorus
Y Zhang; K Zheng; X Chen; GuoQi Zhang; C Tan; Q Yang; J Jiang; H Ye;
In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
2017.
SnS monolayer as gas sensors: Insights from a first-principles investigation
F Hu; C Tan; H Ye; X Chen; GuoQi Zhang;
In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
2017.
In-situ characterization of moisture absorption and hygroscopic swelling of silicone/phosphor composite film and epoxy mold compound in LED packaging
I Khalilullah; T Reza; L Chen; AKMMH Mazumder; J Fan; C Qian; GuoQi Zhang; X Fan;
In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
2017.
Adsorption of gases on monolayer GeSe: A first principle study
L Liu; Q Yang; H Ye; X Chen; GuoQi Zhang;
In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
2017.
First principle design of CdS/germanene heterostructures with tunable electronic and transport properties
K Zheng; H Ye; GuoQi Zhang; Y Zhang; L Liu; J Jiang; Q Yang; C Tan; X Chen;
In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
2017.
The intriguing electronic and optical properties modulation in blue phosphorene/g-III-nitrides heterostructures
Q Yang; C Tan; H Ye; X Chen; GuoQi Zhang;
In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
2017.
Luminescence mechanism analysis on high power tunable color temperature Chip-on-Board white LED modules
J Fan; C Xie; C Qian; X Fan; GuoQi Zhang;
In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
2017.
Effects of phosphor dispersion on optical characteristics of LED Chip Scale Package LEDs
C Qian; LL Luo; JJ Fan; XQ Li; XJ Fan; GuoQi Zhang;
In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
2017.
Prognostics and health monitoring of electronic system: A review
A Prisacaru; PJ Gromala; MB Jeronimo; B Han; GuoQi Zhang;
In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
2017.
Thermal conductivity of functionalized graphene-polymer nanocomposite: A non-equilibrium molecular dynamics study
Hongyu Tang; Huaiyu Ye; Xianping Chen; Xuejun Fan; GuoQi Zhang;
In EurosimE,
2017.
An accelerated test method of luminous flux depreciation for LED luminaires and lamps
C. Qian; X.J.Fan; J.J.Fan; C.A.Yuan; GuoQi Zhang;
Reliability Engineering and System Safety,
Volume 147, pp. 84-92, 2016.
PoF-Simulation Assisted Reliability Prediction for Electrolytic Capacitor in LED Drivers
Bo Sun; Xuejun Fan; Cheng Qian; GuoQi Zhang;
IEEE Transactions on Industrial Electronics,
pp. 99, 2016.
A CMOS-Compatible Hybrid Plasmonic Slot Waveguide With Enhanced Field Confinement
Jing Xiao; Qi-Qin Wei; Dao-Guo Yang; Ping Zhang; Ning He; GuoQi Zhang;
IEEE Electron Device Letters,
Volume 37, Issue 4, 2016.
Degradation Mechanism Decoupling of Mid-Power White-Light LEDs by SPD Simulation
Jianlin Huang; D. S. Golubović; S. Koh; D. Yang; X. Li; X. Fan; GuoQi Zhang;
IEEE Transactions on Electron Devices,
Volume 63, pp. 2807-2814, 2016.
Output blue light evaluation for phosphor based smart white LED wafer level packages
Z. Kolahdouz; A. Rostamian; M. Kolahdouz; T. Ma; H. van Zeijl; GuoQi Zhang;
Optics Express,
Volume 24, Issue 4, pp. 174-177, 2016.
Silicon microfabrication based particulate matter sensor
Mingzhi Dong; Elina Iervolino; Fabio Santagata; GuoQi Zhang;
Sensors and Actuators A: Physical,
Volume 247, pp. 115-124, 2016.
Thermally induced oxidative growth of copper oxide nanowire on dendritic micropowder and reductive conversion to copper nanowire
A. M. Gheytaghi; S.H. Tabatabaie; H. Saffari; GuoQi Zhang;
Micro and Nano Letters,
Volume 11, Issue 8, pp. 412, 2016.
Thermal characterization of carbon nanotube foam using MEMS microhotplates and thermographic analysis
Cinzia Silvestri; Michele Riccio; Rene Poelma; Bruno Morana; Sten Vollebregt; Fabio Santagata; Andrea Irace; GuoQi Zhang; Pasqualina M. Sarro;
Nanoscale,
Volume 8, pp. 8266-8275, 2016.
document
Stretchable Binary Fresnel Lens for Focus Tuning
Xueming Li; Lei Wei; Ren� H. Poelma; Sten Vollebregt; Jia Wei; Hendrik Paul Urbach; Pasqualina M. Sarro; GuoQi Zhang;
Scientific Reports,
Volume 6, pp. 25348, 2016.
Effects of Nanostructure and Coating on the Mechanics of Carbon Nanotube Arrays
R. H. Poelma; X. J. Fan; Z. Y. Hu; G. van Tendeloo; H.W. van Zeijl; GuoQi Zhang;
Advanced Functional Materials,
Volume 26, Issue 8, pp. 1233-1242, 2016.
A review of small heat pipes for electronics
Xianping Chen; Huaiyu Ye; Xuejun Fan; Tianling Ren; GuoQi Zhang;
Applied Thermal Engineering,
Volume 96, pp. 1-17, 2016.
A Systematic Approach for Reliability Assessment of Electrolytic Capacitor-Free LED Drivers
Bo Sun; Xuejun Fan; van Driel, Willem; GuoQi Zhang;
United States: IEEE, , pp. 1--5, 4 2016. DOI: 10.1109/EuroSimE.2016.7463387

Keywords: ...
Reliability, MOSFET, Electrolytic Capacitor-Free LED Driver.
Lumen Decay Prediction in LED Lamps
Bo Sun; Xuejun Fan; van Driel, Willem; Thomas Michel; Jiang Zhou; GuoQi Zhang;
United States: IEEE, , pp. 1--5, 4 2016. DOI: 10.1109/EuroSimE.2016.7463391

Keywords: ...
Reliability, LED Lamp, Lumen Decay Prediction.
Reliability optimization of gold-tin eutectic die attach layer in HEMT package
Hao Zhang; Jiajie Fan; Jing Zhang; Cheng Qian; Xuejun Fan; Fenglian Sun; Guoqi Zhang;
In 13th China International Forum on Solid State Lighting (SSLChina),
2016.
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Metallic Nanoparticle Based Interconnect for Heterogeneous 3D Integration
Zeijl, H. W. V.; Y. Carisey; A. Damian; R. H. Poelma; A. Zinn; GuoQi Zhang;
In IEEE 66th Electronic Components and Technology Conference (ECTC),
2016.
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Tailoring material properties for 3D microfabrication: In-situ experimentation and multi-scale modelling
Poelma, R. H.; X. J. Fan; E. Schlangen; H. W. v. Zeijl; GuoQi Zhang;
In 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
2016.
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3D interconnect technology based on low temperature copper nanoparticle sintering
Boyao Zhang; Y. C. P. Carisey; A. Damian; R. H. Poelma; GuoQi Zhang; H. W. v. Zeijl;
In 17th International Conference on Electronic Packaging Technology (ICEPT),
2016.
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Precision recess of AlGaN/GaN with controllable etching rate using ICP-RIE oxidation and wet etching
R. Sokolovskij; J. Sun; F. Santagata; E. Iervolino; S. Li; G.Y. Zhang; P.M.Sarro; GuoQi Zhang;
In Procedia Engineering: Proceedings of the 30th anniversary Eurosensors Conference,
pp. 1094-1097, 2016.
Solving the Nonlinear Heat Conduction in a Spherical Coordinate with Electrical Simulation
A. M. Gheitaghy; H. Saffari; GuoQi Zhang;
In 18th International Conference on Thermal Engineering,
2016.
Thermal analysis and optimization of IGBT power electronic module based on layout model
Hongyu Tang; Huaiyu Ye; Mingming Wang; Xuejun Fan; GuoQi Zhang;
In ICEPT,
2016.
Design and fabrication of a foldable 3D silicon based package for solid state lighting applications
R. Sokolovskij; Pan Liu; H.W. van Zeijl; B. Mimoun; GuoQi Zhang;
Journal of Micromechanics and Microengineering,
Volume 25, Issue 5, pp. 055017, 2015.
Optimization of LED light spectrum to enhance colorfulness of illuminated objects with white light constraints
H. Wu; J. Dong; G. Qi; GuoQi Zhang;
Journal of the Optical Society of America A,
Volume 32, Issue 7, pp. 1262-1270, 2015.
Optimal Design of Life Testing for High Brightness White LEDs Using the Six Sigma DMAIC Approach
Chuen Yung; Xuejun Fan; GuoQi Zhang; Michael Pecht;
IEEE Transactions on Device and Materials Reliability,
Volume 15, Issue 4, pp. 576-587, 2015.
Ab Initio Study of Temperature, Humidity, and Covalent Functionalization-Induced Bandgap Change of Single-Walled Carbon Nanotubes
Xian-Ping Chen; Ning Yang; Jun-Ke Jiang; Qiu-Hua Liang; Dao-Guo Yang; GuoQi Zhang;
IEEE Electron Device Letters,
Volume 36, Issue 6, 2015.
Rapid degradation of mid-power white-light LEDs in saturated moisture conditions
Jianlin Huang, D. S. Golubovic, S. Koh, D. Yang, X. Li, X. Fan,; GuoQi Zhang;
IEEE Transactions on Device and Materials Reliability,
Volume 15, Issue 4, pp. 478-485, 2015.
Light-Emitting n-ZnO Nanotube/n+-GaAs Heterostructures Processed at Low Temperatures
F. Karegar; M. Kolahdouz; F. D. Nayeri; R. Soleimanzadeh; M. Hosseini; Z Kolahdouz; GuoQi Zhang;
IEEE Photonics Technology Letters,
Volume 27, Issue 13, pp. 1430-1433, 2015.
Degradation modeling of mid-power white-light LEDs by using Wiener process
Jianlin Huang; D. S. Golubović; S. Koh; D. Yang; X. Li; X. Fan; GuoQi Zhang;
Optics Express,
Volume 23, pp. A966-A978, 2015.
Sequential microwave-assisted ultra-fast ZnO nanorod growth on optimized sol–gel seedlayers
R. Soleimanzadeh; M. S. S. Mousavi; A. Mehrfar; Z. Kolahdouz; M. Kolahdouz; GuoQi Zhang;
Journal of Crystal Growth,
Volume 426, pp. 228-233, 2015.
Optical degradation mechanisms of mid-power white-light LEDs in LM-80-08 tests
Jianlin Huang, D. S. Golubović, S. Koh, D. Yang, X. Li, X. Fan,; GuoQi Zhang;
Microelectronics Reliability,
Volume 55, Issue 2654-2662, 2015.
Highly selective and responsive ultra-violet detection using an improved phototransistor
R. Soleimanzadeh; M. Kolahdouz; M. A. Charsooghi; Z. Kolahdouz; GuoQi Zhang;
Applied Physics Letters,
Volume 106, Issue 23, pp. 231102, 2015.
Degradation Mechanisms of Mid-power White-light LEDs under High Temperature-Humidity Conditions
Jianlin Huang; D.S. Golubović; S. Koh; D. Yang; X. Li; X. Fan; GuoQi Zhang;
IEEE Transactions on Device and Materials Reliability,
Volume 15, Issue 2, pp. 220-228, 2015.
Degradation of Microcellular PET Reflective Materials Used in LED-based Products
Guangjun Lu; W.D. van Driel; Xuejun Fan; M. Yazdan Mehr; Jiajie Fan; K.M.B. Jansen; GuoQi Zhang;
Optical Materials,
Volume 49, pp. 79-84, 2015.
Color shift investigations for LED secondary optical designs: Comparison between BPA-PC and PMMA
Guangjun Lu; M. Yazdan Mehr; W.D. van Driel; Xuejun Fan; Jiajie Fan; K.M.B. Jansen; GuoQi Zhang;
Optical Materials,
Volume 45, pp. 37-41, 2015.
3D system-in-package design using stacked silicon submount technology
Mingzhi Dong; Fabio Santagata; Robert Sokolovskij; Jia Wei; Cadmus Yuan; GuoQi Zhang;
Microelectronics International,
Volume 32, Issue 2, pp. 63-72, 2015.
Mechanics of graphene and carbon nanotubes under uniaxial compression and tension
R. H. Poelma; GuoQi Zhang;
In Molecular Modeling and Multiscaling Issues for Electronic Materials Applications,
Springer, 2015.
Tunable binary fresnel lens based on stretchable PDMS/CNT compsite
Xueming Li; L. Wei; S. Vollebregt; R. Poelma; Y. Shen; Jia Wei; P. Urbach; P.M. Sarro; GuoQi Zhang;
In Transducers,
pp. 2041-2044, 2015.
Modelling of Carbon Nanotube Arrays with Analytical and Numerical Methods
X. J. Fan; R. H. Poelma; L. Chen; GuoQi Zhang;
In ASME International Mechanical Engineering Congress and Exposition,
2015.
Fabrication and application of temperature triggered MEMS switch for active cooling control in solid state lighting system
Huaiyu Ye; Jai Wei; van Zeijl, HW; Sarro, PM; GuoQi Zhang;
Microelectronics Reliability,
Volume 54, Issue 6-7, pp. 1338-1343, 2014.
Surface aspects of discolouration in Bisphenol A Polycarbonate (BPA-PC), used as lens in LED-based products
Maryam Yazdan Mehr; W. D. van Driel; H. Udono; GuoQi Zhang;
Optical Materials,
Volume 37, pp. 155-159, 2014.
Electrical-thermal-luminous-chromatic model of phosphor-converted white light-emitting diodes
Huaiyu Ye; Sau Wee Koh; Cadmus Yuan; Henk van Zeijl; Alexander W.J. Gielen; Shi-Wei Ricky Lee; GuoQi Zhang;
Applied Thermal Engineering,
Volume 63, Issue 2, pp. 588-597, 2014.
Thermal and mechanical effects of voids within flip chip soldering in LED packages
Yang Liu; Stanley Y.Y. Leung; Jia Zhao; Cell K.Y. Wong; Cadmus A. Yuan; GuoQi Zhang; Fenglian Sun; Liangliang Luo;
Microelectronics Reliability,
Volume 54, Issue 9-10, pp. 2028-2033, 2014.
Reliability and optical properties of LED lens plates under high temperature stress
Maryam Yazdan Mehr; van Driel, WD; Koh, SW; GuoQi Zhang;
Microelectronics Reliability,
2014.
Tailoring the Mechanical Properties of High-Aspect-Ratio Carbon Nanotube Arrays using Amorphous Silicon Carbide Coatings
Poelma, RH; Morana, Bruno; Vollebregt, Sten; Schlangen, Erik; van Zeijl, HW; Fan, Xuejun; Zhang, GuoQi;
Advanced Functional Materials,
Volume 24, Issue 36, pp. 5737-5744, 2014.
document
Accelerated life time testing and optical degradation of remote phosphor plates
Maryam Yazdan Mehr; van Driel, WD; GuoQi Zhang;
Microelectronics Reliability,
Volume 54, Issue 8, pp. 1544-1548, 2014.
A polymer based miniature loop heat pipe with silicon substrate and temperature sensors for high brightness light-emitting
Huaiyu Ye; Sokolovskij, R; van Zeijl, HW; Gielen, AWJ; GuoQi Zhang;
Microelectronics Reliability,
Volume 54, Issue 6-7, pp. 1355-1362, 2014.
Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products
Maryam Yazdan Mehr; van Driel, WD; Jansen, KMB; Deeben, P; GuoQi Zhang;
Microelectronics Reliability,
Volume 54, Issue 1, pp. 138-142, 2014.
Multi-physics reliability simulation for solid state lighting drivers
Tarashioon, S; van Driel, WD; GuoQi Zhang;
Microelectronics Reliability,
Volume 54, Issue 6-7, pp. 1212-1222, 2014.
Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging
Yang Liu; Joost Meerwijk; Liangliang Luo; Honglin Zhang; Fenglian Sun; Cadmus A. Yuan; GuoQi Zhang;
Journal of Materials Science: Materials in Electronics,
Volume 25, Issue 11, pp. 4954-4959, 2014.
Fracture toughness of Cu-EMC interfaces in pressurized steam
Sadeghinia, M; Jansen, KMB amd Ernst, LJ; Pape, H; Maus, I; van Driel, WD; GuoQi Zhang;
International Journal of Adhesion and Adhesives,
Volume 49, pp. 73-79, 2014.
Establishment of the Mesoscale Parameters for Separation: A Nonequilibrium Molecular Dynamics Model
Cell K. Y. Wong; S. Y. Y. Leung; R. H. Poelma; K. M. B. Jansen; C. C. A. Yuan; W. D. van Driel; GuoQi Zhang;
In Molecular Modeling and Multiscaling Issues for Electronic Material Applications,
Springer, 2014.
Reliability of LED-based Products is a Matter of Balancing Temperatures
Maryam Yazdan Mehr; W.D. van Driel; GuoQi Zhang;
In Therminic Conference,
2014.
Vertical Interconnect technology for Wafer-Level-Packaging and 3D Integration
H. W. v. Zeijl; R. H. Poelma; L. Wang; E. Boschman; F. Boschman; GuoQi Zhang;
In nanoFIS 2014 - Functional Integrated nanoSystems,,
2014.
Correlation of activation energy between LEDs and luminaires in the lumen depreciation test
Guangjun Lu; Yuan, C; Fan, X; GuoQi Zhang;
In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
pp. 1-3, 2014.
A novel design of heatsink-less LED base fluorescent lamp retrofit
Y. L. Jia Zhao; Hongyu Tang; Stanley Y Y Leung; Cadmus C A Yuan; GuoQi Zhang;
In ICEPT2014,
2014.
Numerical modeling of flexible actuator for dynamic lighting
Teng Ma; Xueming Li; Jia Wei; GuoQi Zhang; P. M. Sarro;
In 15th International Conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems,
2014.
High Accelerated Optical Remote Phosphor Aging Studies for LED Luminaire Applications
W. D. v. Driel; Maryam Yazdan Mehr; GuoQi Zhang;
In 11th China SSL conference,
2014.
Blue Selective Photodiodes for Optical Feedback in LED Wafer Level Packages
Z. Kolahdouz; A. Rostamian; M. Kolahdouz; T. Ma; H. V. Zeijl; GuoQi Zhang;
In Solid-State Device Research Conference (ESSDERC), 2014 Proceedings of the European,
pp. 174-177, 2014.
Electro-thermal simulation and characterization of vertically aligned CNTs directly grown on a suspended microhoplate for thermal management applications
C. Silvestri; P. Piacciafoco; B. Morana; F. Santagata; GuoQi Zhang; P.M. Sarro;
In IEEE Sensors,
pp. 827-830, 2014.
document
Miniaturized particulate matter sensor for portable air quality monitoring devices
Xueming Li; E Iervolino; F Santagata; Jia Wei; Cadmus Yuan; PM Sarro; GuoQi Zhang;
In IEEE Sensors,
pp. 2151-2154, 2014.
Colour shift in remote phosphor based LED products
Maryam Yazdan Mehr; Driel, WD van; GuoQi Zhang;
In Proceedings - 64th Electronic Components and Technology Conference,
pp. 1477-1481, 2014.
Influences of viscoelasticity of polybutylene terephthalate (PBT) on the thermal interface contact of LED spotlight module
Hongyu Tang; Yu, Y; Jia, M; Leung, SYY; Qian, C; Cadmus Yuan; Zhou, X; GuoQi Zhang;
In Proceedings of the 15th International Conference on Electronic Packaging Technology,
pp. 1198-1201, 2014.
Investigation of lumen degradation mechanisms of mid-power LED by HAST
Jianlin Huang; Koh, SW; Xueming Li; GuoQi Zhang;
In Proceedings of the 15th International Conference on Electronic Packaging Technology,
pp. 1437-1441, 2014.
Reliability and accelerated test methods for plastic materials in LED-based products
Maryam Yazdan Mehr; van Driel, WD; GuoQi Zhang;
In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
pp. 1-5, 2014.
Modeling and simulation of monolithic integration of rectifiers for solid state lighting applications
Venkatesh, MR; Liu, P; van Zeijl, HW; GuoQi Zhang;
In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
pp. 1-6, 2014.
A lifetime prediction method for Solid State Lighting power converters based on SPICE models and finite element thermal simulations
Bo Sun; Fan, X; Zhao, L; Yuan, CA; Koh, SW; GuoQi Zhang;
In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
pp. 1-4, 2014.
Thermal performance of embedded heat pipe in high power density LED streetlight module
Hongyu Tang; Zhao, J; Li, B; Leung, SYY; Yuan, CCA; GuoQi Zhang;
In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
pp. 1-6, 2014.
High aspect ratio lithography for litho-defined wire bonding
Esfahani, ZK; van Zeijl, HW; GuoQi Zhang;
In Proceedings - 64th Electronic Components and Technology Conference,
pp. 1556-1561, 2014.
CNT bundles growth on microhotplates for direct measurement of their thermal properties
C. Silvestri; B. Morana; G. Fiorentino; S. Vollebregt; G. Pandraud; F. Santagata; GuoQi Zhang; P.M. Sarro;
In 27th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2014),
San Francisco, USA, Jan. 2014.
document
Investigation of color shift of LEDs-based lighting products
Koh, SW; Huaiyu Ye; Maryam Yazdan Mehr; Jia Wei; van Driel, WD; Zhao, LB; GuoQi Zhang;
In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
pp. 1-5, 2014.
Novel system-in-package design and packaging solution for solid state lighting systems
Mingzhi Dong; Santagata, F; Jia Wei; Yuan, C; GuoQi Zhang;
In Proceedings - 64th Electronic Components and Technology Conference,
pp. 1192-1197, 2014.
Adapting LED lighting to compensate the influence of ambient light on the light color
J.D.H. Wu; GuoQi Zhang;
In 11th China SSL conference,
2014.
Through-polymer via (TPV) and method to manufacture such a via
H.W. van Zeijl; R.H. Poelma; GuoQi Zhang;
Dutch patent, 2014.
Photodegradation of bisphenol A polycarbonate under blue light radiation and its effect on optical properties
Maryam Yazdan Mehr; W. D. van Driel; K. M. B. Jansen; P. Deeben; M. Boutelje; GuoQi Zhang;
Optical Materials,
Volume 35, pp. 504-508, 2013.
Thermal Analysis of Remote Phosphor in LED Modules
Mingzhi Dong; Jia Wei; Huaiyu Ye; Cadmus Yuan; GuoQi Zhang;
Journal of Semiconductors,
Volume 34, Issue 5, pp. 053007-1-3, 2013.
Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems
F. Santagata; C. Farriciello; G. Fiorentino; H.W. van Zeijl; C. Silvestri; GuoQi Zhang; P.M. Sarro;
Journal of Micromechanics and Microengineering,
2013.
Cause analysis on highly depreciated indoor LED product in CSA020
Guangjun Lu; Yuan C; Hongyu Tang; Wong C; Fan XJ; GuoQi Zhang;
In Proceedings of China Solid State Lighting Forum,
2013.
Validation of the methodology of lumen depreciation acceleration of LED lighting
Guangjun Lu; Yuan C; Sun B; Li B; Fan XJ; GuoQi Zhang;
In Proceedings of China Solid State Lighting Forum,
2013.
Thermal Analysis for Silicon-based Integration of LED Systems
Mingzhi Dong; Fabio Santagata; Jia Wei; Cadmus Yuan; GuoQi Zhang;
In 10th China International Forum on Solid State Lighting,
2013.
Carbon Nanotube based heat-sink for solid state lighting
F. Santagata; G. Almanno; S. Vollebregt; C Silvestri; GuoQi Zhang; P.M. Sarro;
In 8th IEEE Int. Conf. Nano/Micro Engineered and Molecular Systems (NEMS),
pp. 1214-1217, Apr 2013. DOI 10.1109/NEMS.2013.6559937.
Molecular modeling of protonic acid doping of emeraldine base polyaniline for chemical sensors
X.P. Chen; C. Yuan; C.K.Y. Wong; H. Ye; S.Y.Y. Leung; GuoQi Zhang;
Sensors and Actuators B: Chemical,
Volume 174, pp. 210-216., 2012. DOI 10.1016/j.snb.2012.08.042.
Effects of single vacancy defect position on the stability of carbon nanotubes
R.H. Poelma; H. Sadeghian; S. Koh; GuoQi Zhang;
Microelectronics Reliability Journal,
Volume 52, Issue 7, pp. 1279-1284, Jul. 2012. DOI 10.1016/j.microrel.2012.03.015.
An approach to �Design for Reliability� in solid state lighting systems at high temperatures
S. Tarashioon; A. Baiano; H. van Zeijl; C. Guo; S.W. Koh; W.D. van Driel; GuoQi Zhang;
Microelectronics Reliability,
Volume 52, Issue 5, pp. 783-793, May 2012. DOI 10.1016/j.microrel.2011.06.029.
Diagnosing lumen depreciation in LED lighting systems: An estimation approach
J. Dong; A. Pandharipande; W. van Driel; GuoQi Zhang;
IEEE Transactions on Signal Processing,
Volume 60, Issue 7, pp. 3796-3808, Jul. 2012. DOI 10.1109/TSP.2012.2192114.
Analytical large deflection method for carbon nanotube young�s modulus determination
N. Tolou; A. Khiat; GuoQi Zhang; J.L. Herder;
International Journal of Nonlinear Sciences and Numerical Simulation,
Volume 12, Issue 1-8, pp. 51-58, Feb. 2012. DOI 10.1515/ijnsns.2011.300.
Establishment of the coarse grained parameters for epoxy-copper interfacial separation
C.K.Y. Wong; S.Y.Y. Leung; R.H. Poelma; K.M.B. Jansen; C.C.A. Yuan; W.D. van Driel; GuoQi Zhang;
Journal of Applied Physics,
Volume 111, Issue 9, pp. 094906/1-094906, May 2012. DOI 10.1063/1.4712060.
Mechanical characterization of individual polycrystalline carbon tubes for use in electrical nano-interconnects
A. Khiat; R.H. Poelma; GuoQi Zhang; F. Heuck; F.D. Tichelaar; M. Sarno; P. Ciambelli; S. Fontorbes; L. Arurault; U. Staufer;
Microelectronic Engineering,
Volume 98, pp. 317-320, Oct. 2012. DOI 10.1016/j.mee.2012.07.087.
The mechanical properties modeling of nano-scale materials by molecular dynamics
C. Yuan; W.D. Driel; R.H Poelma; GuoQi Zhang;
In Molecular Modeling and Multiscaling for Electronic Material Applications,
Springer, 2012. DOI 10.1007/978-1-4614-1728-6_8.
Semi empirical low cycle fatigue crack growth analysis of nanostructure chip-to-package copper interconnect using molecular simulation
S. Koh; A. Saxena; W.D. van Driel; GuoQi Zhang; R. Tummala;
In Molecular Modeling and Multiscaling for Electronic Material Applications,
Springer, 2012. DOI 10.1007/978-1-4614-1728-6_5.
Single-mask fabrication of temperature triggered MEMS switch for cooling control in SSL system
J. Wei; H. Ye; H.W. van Zeijl; P.M Sarro; GuoQi Zhang;
In R. Walczak; J. Dziuban (Ed.), Proc. Eurosensors XXVI,
Krakow, Poland, Procedia Engineering, pp. 849-852, Sep 2012. DOI 10.1016/j.proeng.2012.09.280.
Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems
F. Santagata; G. Fiorentino; M. Nie; C. Farriciello; R. Poelma; GuoQi Zhang; P.M. Sarro;
In Proc. 11th IEEE Sensors Conference,
Taipei, Taiwan, pp. 668-671, Oct 2012.
Simulation and qualification of a system-in-package (SiP) based solid state lighting (SSL) module
D.M. Farley; F. Boschman; J.E. Bullema; A.W.J. Gielen; P. Hesen; J.P.H.M. Krugers; F. Swartjes; H.W. van Zeijl; GuoQi Zhang;
In Proc. 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
Cascais, Portugal, pp. 1-3, Apr 2012. ISBN 978-1-4673-1511-1; DOI 10.1109/ESimE.2012.6191780.
Monitoring of meniscus motion at nozzle orifice with capacitive sensor for inkjet applications
J. Wei; C. Yue; GuoQi Zhang; J.F. Dijksman; P.M. Sarro;
In Proc. 11th IEEE Sensors Conference,
Taipei, Taiwan, pp. 2172-2175, Oct 2012.
Thermal and moisture degradation in SSL system
S. Koh; W.D. van Driel; GuoQi Zhang;
In 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
Lisbon, Portugal, pp. 1-6, Apr. 2012. DOI 10.1109/ESimE.2012.6191806.
System approach for reliability of low-power power electronics: How to break down into their constructed parts
S. Tarashioon; W.D. van Driel; GuoQi Zhang;
In 7th International Conference on Integrated Power Electronics Systems (CIPS 2012),
Nuremberg, Germany, pp. 1-5, Mar. 2012.
Dynamic thermal simulation of high brightness LEDs with unsteady driver power output
H. Ye; S. Koh; J. Wei; H.W. van Zeijl; GuoQi Zhang;
In 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
Lisbon, Portugal, Apr. 2012. DOI 10.1109/ESimE.2012.6191768.
Establishment of the mesoscale parameters for epoxy-copper interfacial separation
C.K.Y. Wong; S.Y.Y. Leung; R.H. Poelma; K.M.B. Jansen; C.C.A. Yuan; W.D. van Driel; GuoQi Zhang;
In 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
Lisbon, Portugal, Apr. 2012. DOI 10.1109/ESimE.2012.6191737.
Molecular modeling of the conductivity changes of the emeraldine base polyaniline due to protonic acid doping
X. Chen; C. Yuan; C. Wong; GuoQi Zhang;
In 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
Cascais, Portugal, Apr. 2012. ISBN 978-1-4673-1511-1; DOI 10.1109/ESimE.2012.6191741.
A review of passive thermal management of LED module
H. Ye; S. Koh; H. Zeijl; A.W.J. Gielen; GuoQi Zhang;
Journal of Semiconductors,
Volume 32, Issue 1, pp. 1-4, 2011. DOI 10.1088/1674-4926/32/1/014008.
Validation of forcefields in predicting the physical and thermophysical properties of emeraldine base polyaniline
X.P. Chen; C.A. Yuan; C.K.Y. Wong; S.W. Koh; GuoQi Zhang;
Molecular Simulation,
Volume 37, Issue 12, pp. 990-996, Oct. 2011. DOI 10.1080/08927022.2011.562503.
Molecular modeling of temperature dependence of solubility parameters for amorphous polymers
X.P. Chen; C.A. Yuan; C.K.. Wong; GuoQi Zhang;
Journal of Molecular Modeling,
pp. 1-9, Oct. 2011. DOI 10.1007/s00894-011-1249-3.
A numerical experimental approach for characterizing the elastic properties of thin films: Application of nanocantilevers
R.H. Poelma; H. Sadeghian; S.P.M. Noijen; J.J.M. Zaal; GuoQi Zhang;
Journal of Micromechanics and Microengineering,
Volume 21, Issue 6, pp. 1-11, 2011. DOI 10.1088/0960-1317/21/6/065003.
Evaluation and selection of sensing materials for carbon dioxide (CO2) sensor by molecular modeling
X.P. Chen; C.K.Y. Wong; C.A. Yuan; GuoQi Zhang;
In C. Tsamis; G. Kaltas (Ed.), Proc. Eurosensors XXV,
Athens, Greece, Procedia Engineering, pp. 379-382, Sep. 2011. DOI 10.1016/j.proeng.2011.12.094.
Buckling analysis of carbon nanotubes and the influence of defect position
R.H. Poelma; H. Sadeghian; S.W. Koh; GuoQi Zhang;
In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
Linz, Austria, pp. 1-7, Apr. 2011. ISBN 978-1-4577-0106-1; DOI 10.1109/ESIME.2011.5765864.
Thermal analysis of HB LED packages and advanced materials
H. Ye; A.W.J. Gielen; H.W. vanZeijl; GuoQi Zhang;
In ChinaSSL 2012, China,
2011.
Co-design of wafer level thin film package assembly
J.J.M. Zaal; F. Santagata; W.D. van Driel; GuoQi Zhang; J.F. Creemer; P.M. Sarro;
In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
Linz, Austria, pp. 1-6, Apr. 2011. ISBN 978-1-4577-0106-1.
document
Numerical modeling of thermal performance: Natural convection and radiation of solid state lighting
H. Ye; A.W.J. Gielen; H.W. vanZeijl; R.J. Werkhoven; GuoQi Zhang;
In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
Linz, Austria, pp. 1-6, Apr. 2011. ISBN 978-1-4577-0106-1; DOI 10.1109/ESIME.2011.5765845.
Degradation of epoxy lens materials in LED systems
S. Koh; W.D. van Driel; GuoQi Zhang;
In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
Linz, Austria, pp. 1-5, Apr. 2011. ISBN 978-1-4577-0106-1; DOI 10.1109/ESIME.2011.5765850.
Molecular Dynamics study of the traction-displacement relations of epoxy-copper interfaces
C.K.Y. Wong; S.Y.Y. Leung; R.H. Poelma; K.M.B. Jansen; C.A. Yuan; W.D. van Driel; GuoQi Zhang;
In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
Linz, Austria, pp. 1-5, Apr. 2011. ISBN 978-1-4577-0106-1; DOI 10.1109/ESIME.2011.5765785.

BibTeX support

Last updated: 3 Nov 2023

prof.dr. GuoQi Zhang

Biography

ET4277 Microelectronics reliability

ET4391 Advanced microelectronics packaging

Next-generation chip assembly processes

Compact modelling of high-tech systems for health management and optimization along the supply chain

Fundamentals of backside metals system for 5G RF power modules

In-vehicle health monitoring

Restoring Cardiac Mechanical Function by Polymeric Artificial Muscular Tissue

Projects history

Challenging environments tolerant smart systems for IoT

Intelligent Reliability 4.0

Internet of Things (IoT) security through machine learning and data sharing

Power2Power

High Performance Vehicle Computer and Communication System for Autonomous Driving

Solid State Lighting reliability for automotive application

GaN-based PiN Diodes for RF Power Limiter Application

Monolithically integrated SiC sun sensor for Space

Advanced packaging technology of SiC power module

High performance devices based on advanced materials

IoSense

Superconducting Carbon Nanotubes composite as Vertical Interconnect for Qubit Integration at Cryogenic Temperature

AlGaN/GaN High Electron Mobility Transistor (HEMT) Gas Sensor Platform Development

AlGaN/GaN High Electron Mobility Transistor (HEMT) Gas Sensor Platform Development

Thermal management in 3d heterogeneous integration

2D materials-based Heat Waste Recovery of LED

Gallium nitride (GaN) on silicon system integration

LED Luminaire Colour Shift

Smart Optics

Quick reliability assessment for mid-power white-light LED packages

3D System-in-package Design Using Stacked Silicon Submount Technology

Multifuntional LED Integration and Miniaturization

3D Smart Wafer Level Package for LEDs

Material Degradation in Solid State Lightening Applications

Fast qualification of solder reliability in solid state lighting application

Solid State Lighting reliability for automotive application

Innovative Thermal Management Breakthrough Of Advanced Solid State Lighting Module

BibTeX support

GuoQi Zhang

PhD students

Alumni

MSc students

Alumni

MSc project proposals