dr.ir. Mingzhi Dong

PhD student
Electronic Components, Technology and Materials (ECTM), Department of Microelectronics

PhD thesis (Sep 2016): System in package for intelligent lighting and sensing applications
Promotor: GuoQi Zhang

Themes: Micro/Nano System Integration and Reliability

Projects history

Gallium nitride (GaN) on silicon system integration

3D System-in-package Design Using Stacked Silicon Submount Technology

  1. Integrated virtual impactor enabled PM 2.5 sensor
    Mingzhi Dong; E Iervolino; F Santagata; G Zhang; GuoQi Zhang;
    IEEE Sensors Journal,
    Volume 17, Issue 9, pp. 2814-2821, 2017.

  2. Silicon microfabrication based particulate matter sensor
    Mingzhi Dong; Elina Iervolino; Fabio Santagata; GuoQi Zhang;
    Sensors and Actuators A: Physical,
    Volume 247, pp. 115-124, 2016.

  3. System in package for intelligent lighting and sensing applications
    Mingzhi Dong;
    PhD thesis, Delft University of Technology, 2016.

  4. 3D system-in-package design using stacked silicon submount technology
    Mingzhi Dong; Fabio Santagata; Robert Sokolovskij; Jia Wei; Cadmus Yuan; GuoQi Zhang;
    Microelectronics International,
    Volume 32, Issue 2, pp. 63-72, 2015.

  5. Novel system-in-package design and packaging solution for solid state lighting systems
    Mingzhi Dong; Santagata, F; Jia Wei; Yuan, C; GuoQi Zhang;
    In Proceedings - 64th Electronic Components and Technology Conference,
    pp. 1192-1197, 2014.

  6. Thermal Analysis of Remote Phosphor in LED Modules
    Mingzhi Dong; Jia Wei; Huaiyu Ye; Cadmus Yuan; GuoQi Zhang;
    Journal of Semiconductors,
    Volume 34, Issue 5, pp. 053007-1-3, 2013.

  7. Thermal Analysis for Silicon-based Integration of LED Systems
    Mingzhi Dong; Fabio Santagata; Jia Wei; Cadmus Yuan; GuoQi Zhang;
    In 10th China International Forum on Solid State Lighting,

BibTeX support

Last updated: 14 Jan 2018

Mingzhi Dong

  • Left in 2016