Micro/Nano System Integration and Reliability
Contact: GuoQi Zhang
- Wafer/packaging/module level system integration. Examples are advanced interconnection materials and technology; multi-functional System in Package; WBS based power electronics modules; optogenetics-electronics systems.
- Sensor technology based on Wide Bandgap Semiconductors. Examples are GaN and SiC sensors for harsh environments and multi-functional sensor systems.
- Designing for reliability. Examples are multi-physics and multi-scale simulation, modelling and optimization, from first principle, MD to FEM; digital twin; system diagnostics and prognostics; AI-assisted modelling.
- Advanced 2D materials and devices: integration of 2D materials into semiconductor and packaging technology; fabrication and testing of high-performance sensors; development of scalable deposition methods
Projects under this theme
Next-generation chip assembly processes
Developing technology for ultra-high throughput and sustainable chip assembly processes.
Compact modelling of high-tech systems for health management and optimization along the supply chain
Fundamentals of backside metals system for 5G RF power modules
In-vehicle health monitoring
Restoring Cardiac Mechanical Function by Polymeric Artificial Muscular Tissue
History
Challenging environments tolerant smart systems for IoT
Intelligent Reliability 4.0
Internet of Things (IoT) security through machine learning and data sharing
Power2Power
European research project Power2Power for more efficient power semiconductors
High Performance Vehicle Computer and Communication System for Autonomous Driving
Solid State Lighting reliability for automotive application
GaN-based PiN Diodes for RF Power Limiter Application
Monolithically integrated SiC sun sensor for Space
Advanced packaging technology of SiC power module
High performance devices based on advanced materials
IoSense
Superconducting Carbon Nanotubes composite as Vertical Interconnect for Qubit Integration at Cryogenic Temperature
AlGaN/GaN High Electron Mobility Transistor (HEMT) Gas Sensor Platform Development
AlGaN/GaN High Electron Mobility Transistor (HEMT) Gas Sensor Platform Development
Thermal management in 3d heterogeneous integration
2D materials-based Heat Waste Recovery of LED
Gallium nitride (GaN) on silicon system integration
LED Luminaire Colour Shift
Smart Optics
Quick reliability assessment for mid-power white-light LED packages
LED Power Supply Reliability
3D System-in-package Design Using Stacked Silicon Submount Technology
Multifuntional LED Integration and Miniaturization
3D Smart Wafer Level Package for LEDs
Material Degradation in Solid State Lightening Applications
Fast qualification of solder reliability in solid state lighting application
Solid State Lighting reliability for automotive application
The use of SiPs in all kinds of applications is only possible if its reliability can be qualified
Innovative Thermal Management Breakthrough Of Advanced Solid State Lighting Module
MSc students
- Steven Zhou
- Haoxiang Jiang
- Xavier Morales Rivero
- Bingxun Wang
- Zhoubang Du
- Yunfan Niu
- Lars Pantleon
- Qilin Xing
- Koen van Remundt
- Yuelu Li
Alumni
- Jiahui Zhang (2024)
- Yixin Yan (2024)
- Laveena Manjunath (2023)
- Bingyan Xu (2023)
- Chieh Wang (2023)
- Letian Zhang (2023)
- Rami Younis (2022)
- Mustafeez Bashir Shah (2022)
- Michaël Chengshang (2022)
- Esad Beydilli (2022)
- Nikhil Gupta (2022)
- Weiping Jiao (2022)
- Jinglin Li (2022)
- Bram den Ouden (2022)
- Hanxing Meng (2022)
- Paulus van der End (2022)
- Bart Van der Wielen (2022)
- Shuhan Yang (2021)
- Luutzen Wymenga (2021)
- Secil Sanseven (2021)
- Chinghsuan Chou (2021)
- Xinyun Xu (2021)
- Denver Desouza (2021)
- Shanliang Deng (2021)
- Yaqian Zhang (2020)
- Niccoló Bandinelli (2020)
- Jiarui Mo (2019)
- Mauricio Rosencwaig (2019)
- Roel Stortelder (2019)
- Ziqiao Huang (2019)
- Alisher Kurmanbay (2019)
- Mengxin Yu (2019)
- Himabindu Kopally (2018)