Micro/Nano System Integration and Reliability

Contact: GuoQi Zhang

We cover the research addresses the fundamentals and novel technologies of heterogeneous system integration and reliability, mainly in 4 research domains:
  • Wafer/packaging/module level system integration. Examples are advanced interconnection materials and technology; multi-functional System in Package; WBS based power electronics modules; optogenetics-electronics systems.
  • Sensor technology based on Wide Bandgap Semiconductors. Examples are GaN and SiC sensors for harsh environments and multi-functional sensor systems.
  • Designing for reliability. Examples are multi-physics and multi-scale simulation, modelling and optimization, from first principle, MD to FEM; digital twin; system diagnostics and prognostics; AI-assisted modelling.
  • Advanced 2D materials and devices: integration of 2D materials into semiconductor and packaging technology; fabrication and testing of high-performance sensors; development of scalable deposition methods

Projects under this theme

Next-generation chip assembly processes

Developing technology for ultra-high throughput and sustainable chip assembly processes.

Compact modelling of high-tech systems for health management and optimization along the supply chain

Fundamentals of backside metals system for 5G RF power modules

In-vehicle health monitoring

Restoring Cardiac Mechanical Function by Polymeric Artificial Muscular Tissue


Challenging environments tolerant smart systems for IoT

Intelligent Reliability 4.0

Internet of Things (IoT) security through machine learning and data sharing


European research project Power2Power for more efficient power semiconductors

High Performance Vehicle Computer and Communication System for Autonomous Driving

Solid State Lighting reliability for automotive application

GaN-based PiN Diodes for RF Power Limiter Application

Monolithically integrated SiC sun sensor for Space

Advanced packaging technology of SiC power module

High performance devices based on advanced materials


Superconducting Carbon Nanotubes composite as Vertical Interconnect for Qubit Integration at Cryogenic Temperature

AlGaN/GaN High Electron Mobility Transistor (HEMT) Gas Sensor Platform Development

AlGaN/GaN High Electron Mobility Transistor (HEMT) Gas Sensor Platform Development

Thermal management in 3d heterogeneous integration

2D materials-based Heat Waste Recovery of LED

Gallium nitride (GaN) on silicon system integration

LED Luminaire Colour Shift

Smart Optics

Quick reliability assessment for mid-power white-light LED packages

LED Power Supply Reliability

3D System-in-package Design Using Stacked Silicon Submount Technology

Multifuntional LED Integration and Miniaturization

3D Smart Wafer Level Package for LEDs

Material Degradation in Solid State Lightening Applications

Fast qualification of solder reliability in solid state lighting application

Solid State Lighting reliability for automotive application

The use of SiPs in all kinds of applications is only possible if its reliability can be qualified

Innovative Thermal Management Breakthrough Of Advanced Solid State Lighting Module