MSc Leiming Du

PhD student
Electronic Components, Technology and Materials (ECTM), Department of Microelectronics

Expertise: Advanced packaging; power electronics; in-situ mechanical test (SEM, TEM); advanced characterization (TEM, PED, X-ray synchrotron radiation); FEM simulation (Comsol, Ansys and Abaqus); Molecular dynamics simulation

Themes: Micro/Nano System Integration and Reliability


Leiming Du received his B.S. degree in Engineering Mechanics from China University of Mining and Technology in 2018. Then he received his M.Sc. degree from Harbin Institute of Technology, Shenzhen (China) in 2021. In Jul. 2021, he joined ECTM at Delft University of Technology as a PhD student. His current research interest includes in-situ mechanical tests of sintered materials for power electronics packaging, novel processing to enhance the thermal, electrical and mechanical properties of interconnects in advanced packaging, and integrated crystal plasticity–phase field model for the prediction of crack propagation.

Last updated: 16 Apr 2024