Electronic Components, Technology and Materials
Department of Microelectronics

dr. Leiming Du

Postdoc
Electronic Components, Technology and Materials (ECTM), Department of Microelectronics

PhD thesis (Sep 2025): Sintering Fundamentals of Nano-Metallic Particle Interconnects
Promotor: GuoQi Zhang

Expertise: Advanced packaging; power electronics; in-situ mechanical test (SEM, TEM); advanced characterization (TEM, PED, X-ray synchrotron radiation); FEM simulation (Comsol, Ansys and Abaqus); Molecular dynamics simulation

Themes: Micro/Nano System Integration and Reliability

Biography

Leiming Du received his B.S. degree in Engineering Mechanics from China University of Mining and Technology in 2018. Then he received his M.Sc. degree from Harbin Institute of Technology, Shenzhen (China) in 2021. In Jul. 2021, he joined ECTM at Delft University of Technology as a PhD student. His current research interest includes in-situ mechanical tests of sintered materials for power electronics packaging, novel processing to enhance the thermal, electrical and mechanical properties of interconnects in advanced packaging, and integrated crystal plasticity–phase field model for the prediction of crack propagation.

Publications

  1. A Fully Integrated Sequential Synchronized Switch Harvesting on Capacitors Rectifier Based on Split-Electrode for Piezoelectric Energy Harvesting
    Xinling Yue; Jiarui Mo; Zhiyuan Chen; Sten Vollebregt; Guoqi Zhang; Sijun Du;
    IEEE Transactions on Power Electronics,
    Volume 39, Issue 6, pp. 7643-7653, 2024. DOI: 10.1109/TPEL.2024.3369728

  2. Measuring residual stresses in individual on-chip interconnects using synchrotron nanodiffraction
    Yaqian Zhang; Leiming Du; Olof Bäcke; Sebastian Kalbfleisch; Guoqi Zhang; Sten Vollebregt; Magnus Hörnqvist Colliander;
    Applied Physics Letters,
    Volume 124, pp. 083501-1-6, 2024. DOI: 10.1063/5.0192672

  3. Investigating Mechanical Properties of Silicon Carbide Coated Carbon Nanotube Composite at Elevated Temperatures
    Jiarui Mo; Gerald J.K. Schaffar; Leiming Du; Verena Maier-Kiener; Daniel Kiener; Sten Vollebregt; Guoqi Zhang;
    In IEEE 37th Intl. Conf. on Micro Electro Mechanical Systems (MEMS2024),
    2024. DOI: 10.1109/MEMS58180.2024.10439455

  4. Low Temperature Fine Pitch All-Copper Interconnects Combining Photopatternable Underfill Films
    Xinrui Ji; Henk Van Zeijl; Weiping Jiao; Shan He; Leiming Du; Guoqi Zhang;
    In Proc. of Electronic Components and Technology Conference (ECTC),
    2023.

  5. High-Temperature Creep Properties of a Novel Solder Material and Its Thermal Fatigue Properties Under Potting Material
    Leiming Du; Guoqi Zhang; Xiujuan Zhao; Willem Van Driel; Rene Poelma;
    In Proc. of Electronic Components and Technology Conference (ECTC),
    2023.

  6. Mass sensitivity of aluminum nitride thin film based surface acoustic wave sensors prepared for biosensing application
    Ying-ge Li; Lian-xiang Ma; P. M. Sarro; Dong-xing Du; Xue-feng Liu;
    In Symposium on Piezoelectricity, Acoustic Waves, and Device Applications (SPAWDA),
    pp. 368-370, 2016.

BibTeX support

Last updated: 24 Feb 2026

Leiming Du