Electronic Components, Technology and Materials
Department of Microelectronics

Leiming Du

Publications

  1. A Fully Integrated Sequential Synchronized Switch Harvesting on Capacitors Rectifier Based on Split-Electrode for Piezoelectric Energy Harvesting
    Xinling Yue; Jiarui Mo; Zhiyuan Chen; Sten Vollebregt; Guoqi Zhang; Sijun Du;
    IEEE Transactions on Power Electronics,
    Volume 39, Issue 6, pp. 7643-7653, 2024. DOI: 10.1109/TPEL.2024.3369728

  2. Measuring residual stresses in individual on-chip interconnects using synchrotron nanodiffraction
    Yaqian Zhang; Leiming Du; Olof Bäcke; Sebastian Kalbfleisch; Guoqi Zhang; Sten Vollebregt; Magnus Hörnqvist Colliander;
    Applied Physics Letters,
    Volume 124, pp. 083501-1-6, 2024. DOI: 10.1063/5.0192672

  3. Investigating Mechanical Properties of Silicon Carbide Coated Carbon Nanotube Composite at Elevated Temperatures
    Jiarui Mo; Gerald J.K. Schaffar; Leiming Du; Verena Maier-Kiener; Daniel Kiener; Sten Vollebregt; Guoqi Zhang;
    In IEEE 37th Intl. Conf. on Micro Electro Mechanical Systems (MEMS2024),
    2024. DOI: 10.1109/MEMS58180.2024.10439455

  4. Low Temperature Fine Pitch All-Copper Interconnects Combining Photopatternable Underfill Films
    Xinrui Ji; Henk Van Zeijl; Weiping Jiao; Shan He; Leiming Du; Guoqi Zhang;
    In Proc. of Electronic Components and Technology Conference (ECTC),
    2023.

  5. High-Temperature Creep Properties of a Novel Solder Material and Its Thermal Fatigue Properties Under Potting Material
    Leiming Du; Guoqi Zhang; Xiujuan Zhao; Willem Van Driel; Rene Poelma;
    In Proc. of Electronic Components and Technology Conference (ECTC),
    2023.

  6. Mass sensitivity of aluminum nitride thin film based surface acoustic wave sensors prepared for biosensing application
    Ying-ge Li; Lian-xiang Ma; P. M. Sarro; Dong-xing Du; Xue-feng Liu;
    In Symposium on Piezoelectricity, Acoustic Waves, and Device Applications (SPAWDA),
    pp. 368-370, 2016.

BibTeX support