Mustafeez Bashir Shah
Thermal modelling of high density chip to board interconnects
MSc thesis: Vacuum Sealing of MEMS Cavities using Nanoparticle Sintering
Advisor(s): GuoQi Zhang, Dong Hu, Sten Vollebregt
Program: MSc Microelectronics
Thermal modelling of high density chip to board interconnects
MSc thesis: Vacuum Sealing of MEMS Cavities using Nanoparticle Sintering
Advisor(s): GuoQi Zhang, Dong Hu, Sten Vollebregt
Program: MSc Microelectronics