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Electronic Components, Technology and Materials

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Electronic Components, Technology and Materials
Department of Microelectronics
  • TU Delft
  • EEMCS
  • Microelectronics
  • ECTM
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  • MSc Students

Mustafeez Bashir Shah

Thermal modelling of high density chip to board interconnects

MSc thesis: Vacuum Sealing of MEMS Cavities using Nanoparticle Sintering
Advisor(s): GuoQi Zhang, Dong Hu, Sten Vollebregt

Program: MSc Microelectronics

Mustafeez Bashir Shah, MSc

Electronic Components, Technology and Materials

TU Delft
Fac. EEMCS
Mekelweg 4
2628 CD Delft

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