MSc Dong Hu

PhD student
Electronic Components, Technology and Materials (ECTM), Department of Microelectronics

Expertise: Power electronics packaging

Themes: Micro/Nano System Integration and Reliability


Dong Hu received his M.Sc degree in Nanotechnology from Kungliga Tekniska Högskolan (Sweden), and his Bachelor degree in material science and engineering from Harbin Institute of Technology (China), in 2019 and 2016 respectively.

In January 2019, he joined the Electronic Components, Technology and Materials (ECTM) group as a master thesis student. Currently, he is a PhD researcher and works with Prof. Kouchi Zhang. His main research topic is nanomaterial-based advanced power packages.

Projects history


European research project Power2Power for more efficient power semiconductors

  1. Transient thermal measurement on nano-metallic sintered die-attach joints using a thermal test chip
    R. Sattari; Dong Hu; Xu Liu; H. van Zeijl; S. Vollebregt; GuoQi Zhang;
    Applied Thermal Engineering,
    Volume 221, pp. 119503, 2023. DOI: 10.1016/j.applthermaleng.2022.119503

  2. Copper Nanoparticle Sintering Enabled Hermetic Packaging With Fine Sealing Ring for MEMS Application
    Dong Hu; Mustafeez Bashir Shah; Jiajie Fan; Sten Vollebregt; Guoqi Zhang;
    IEEE Transactions on Electron Devices,
    Volume 70, Issue 11, pp. 5818-5823, 2023. DOI: 10.1109/TED.2023.3312066

  3. Study on Sintering Mechanism and Mechanical Properties of Nano-Cu based on Molecular Dynamics Simulation
    Cheng Qian; Dong Hu; Xu Liu; Xuejun Fan; Guoqi Zhang; Jiajie Fan;
    In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2023. DOI: 10.1109/EuroSimE56861.2023.10100810

  4. Reliability Analysis on Ag and Cu Nanoparticles Sintered Discrete Power Devices with Various Frontside and Backside Interconnects
    Dong Hu; Xu Liu; Sten Vollebregt; Jiajie Fan; Guoqi Zhang; Ali Roshanghias; Xing Liu; Thomas Basler; Emiel De Bruin;
    In Proc. of Electronic Components and Technology Conference (ECTC),

  5. Effects of Temperature and Grain Size on Diffusivity of Aluminium: Electromigration Experiment and Molecular Dynamic Simulation
    Zhen Cui; Yaqian Zhang; Dong Hu; Sten Vollebregt; Jiajie Fan, Xuejun Fan; Guoqi Zhang;
    Journal of Physics: Condensed Matter,
    Volume 34, pp. 175401, 2022. DOI: 10.1088/1361-648X/ac4b7f

  6. Patterning of Fine-Features in Nanoporous Films Synthesized by Spark Ablation
    Xinrui Ji; Joost van Ginkel; Dong Hu; Andreas Schmidt-Ott; Henk van Zeijl; Sten Vollebregt; GuoQi Zhang;
    In Proc. IEEE Nano,
    pp. 238-241, 2022. DOI: 10.1109/NANO54668.2022.9928705

  7. Insights into the high-sulphur aging of sintered silver nanoparticles: An experimental and ReaxFF study
    Dong Hu; Tijian Gu; Zhen Cui; Sten Vollebregt; Xuejun Fan; Guoqi Zhang; Jiajie Fan;
    Corrosion Science,
    pp. 109846, 2021. DOI: 10.1016/j.corsci.2021.109846

  8. Effects of Defect and Temperature on the Mechanical Performance of WS2: A Multiscale Analysis
    Hongyu Tang; Dong Hu; Zhen Cui; Huaiyu Ye; GuoQi Zhang;
    Journal of Physical Chemistry C,

  9. Low power AlGaN/GaN MEMS pressure sensor for high vacuum application
    Jianwen Sun; Dong Hu; Zewen Liu; Luke Middelburg; Sten Vollebregt; Pasqualina M. Sarro; Guoqi Zhang;
    Sensors and Actuators A: Physical,
    Volume 314, pp. 112217, 2020.

  10. Thermal kinetic and mechanical behaviors of pressure-assisted Cu nanoparticles sintering: A molecular dynamics study
    Dong Hu; Zhen Cui; Jiajie Fan; Xuejun Fan; Guoqi Zhang;
    Results in Physics,

BibTeX support

Last updated: 20 May 2020