MSc Zhenhua Zhang

Zhenhua was born in Sichuan, China. He joined the Electronic Components, Technology, and Materials(ECTM) group in 2022, starting with an internship project focusing on through-polymer via (TPV) process optimization. Then, he did a master’s thesis project from Oct 2022 to Oct 2023 about SiC Inductively coupled plasma(ICP) Reactive Ion etching(RIE) process development and optimization in ECTM and received his M.Sc degree in Electrical Engineering from Delft University of Technology. Since Nov 2023, he has worked as a Ph.D. candidate at ECTM. His main research includes the development of SiC devices and processes.

Last updated: 12 Dec 2023