Weiping Jiao
Flip-chip nanometallic interconnects with self-aligned underfill
MSc thesis: A combined vertical interconnect/underfill process for high density I/O flip chip bonding
Advisor(s): GuoQi Zhang, Xinrui Ji
Program: MSc Microelectronics
![](/shared/ECTM/MScstudents/PhotoWeiping.jpg)
Flip-chip nanometallic interconnects with self-aligned underfill
MSc thesis: A combined vertical interconnect/underfill process for high density I/O flip chip bonding
Advisor(s): GuoQi Zhang, Xinrui Ji
Program: MSc Microelectronics