Solid State Lighting reliability for automotive application (SE2A-2)

To take advantage of the excellent properties of SiC devices, a novel packaging concept is required, which allows the high-temperature operation of the SiC without any deterioration. In this project, power substrate with high dielectric strength, high thermal performance, high robustness, and low cost will be developed. The key is to acquire suitable ceramic sheet material (toughened AlN or thermally enhanced Si3N4) and come up with a low-cost solution to join the conductive layer onto the sheet, for example, improved brazing method.