Yixin Yan

By using in-situ measurement, the change of  copper microstructure during the electromigration can be observed. And the result will be used to establish the correlation between EM degradation mechanisms and grain orientations.

MSc thesis: Effects of Varying Annealing Temperatures on the Microstructure and Electromigration Performance of Copper Interconnects
Advisor(s): Yaqian Zhang, Sten Vollebregt

Program: MSc Materials Science