dr.ir. Yi

Electronic Components, Technology and Materials (ECTM), Department of Microelectronics

PhD thesis (Jun 2020): Through Package Via: A bottom-up approach
Promotor: GuoQi Zhang

Themes: Micro/Nano System Integration and Reliability


  1. Through Package Via: A bottom-up approach
    H. Yi;
    PhD thesis, Delft University Technology, 2020.

  2. Suspended tungsten trioxide (WO3) gate AlGaN/GaN heterostructure deep ultraviolet detectors with integrated micro-heater
    Jianwen Sun; Teng Zhan; Zewen Liu; Junxi Wang; Xiaoyan Yi; Lina Sarro; GuoQi Zhang;
    Optics Express,
    Volume 27, Issue 25, 2019.

  3. Tomorrow’s advanced packaging; for electronics and heterogeneous system integration
    H. Yi; A. M. Gheytaghi; B. El Mansouri; L.M. Middelburg; GuoQi Zhang;
    ETV Maxwell,
    Volume 21.2, 2018.

  4. Three dimensional thermoacoustic device composed of nanoporous material and the method to fabricate such a device
    Poelma, R.; GuoQi Zhang, G. Q.; Yi, H.; van Zeijl, H.;
    Patent, NL 2017268, 2018. IPC No. H04R, Priority date 1 Aug 2016, Priority No. NL 2017268.

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Last updated: 5 Jan 2021

Hengqian (Daniel) Yi

  • Left in 2020
  • Now: QuTech