dr. H. Ye

PhD student
Electronic Components, Technology and Materials (ECTM), Department of Microelectronics

PhD thesis (Sep 2014): Thermal Management of Solid State Lighting Module
Promotor: GuoQi Zhang

Themes: Micro/Nano System Integration and Reliability

Biography

Scientific aim: The major research subject is develop the means to understand and design the thermal flow from the material and interfaces up to the SSL module in order to develop thermal break-through solutions for SSL (and other high-power solid-state electronics). This includes developing and integrating new cooling concepts, new materials, new processes and new design under given application conditions and show the improved reliability it delivers. The major abovementioned deliverables should be compatible/suitable for current (retrofit lighting) and future solid state lighting module/system. In order to achieve the project expectation, it is essential to focus on optimising thermal management, including the optimization of SSL module design, heatsink material/concept selection, process development, high thermal conductivity material packaging with numerical simulation and experimental validation. The cooling concepts/solutions and materials should be compatible to current/future HB SSL applications. Notice that the selection of thermal management / cooling solutions and thermal materials will not be limited to the existing ones. Focus will be developing novel solutions such as two phase cooling method based materials and concept. Moreover, considering the manufacturing/processing imperfections, the concepts and materials are expected to perform a sufficient thermal conductivity in order to satisfy the system level thermal requirements. Virtual prototyping method is applied for the understanding and predicting of the thermal performance of the innovative thermal management concept/solution. The thermal behaviour modelling of new concepts and materials based on the multi-physics/multi-scale is focused. The thermal impact in terms of the thermal resistance (Rth) between die to PCB in various materials must be studied. The correlation between the Rth to relevant failure mode, and the reliability/lifetime prediction model should be established and validated. And, as an essential input, the material characterisation activity is also planned. Integrating the knowledge of the thermal management concept/process development and reliability modelling of various materials, the design for interconnect reliability rules can be derived for the specified high temperature power applications.

Projects history

Innovative Thermal Management Breakthrough Of Advanced Solid State Lighting Module

  1. Room temperature ppt-level NO2 gas sensor based on SnOx/SnS nanostructures with rich oxygen vacancies
    Hongyu Tang; Chenshan Gao; Huiru Yang; Leandro Nicolas Sacco; Robert Sokolovskij; Hongze Zheng; Huaiyu Ye; Sten Vollebregt; Hongyu Yu; Xuejun Fan; Guoqi Zhang;
    2D Materials,
    2021. DOI: 10.1088/2053-1583/ac13c1

  2. A DFT study of As doped WSe2: A NO2 sensing material with ultra-high selectivity in the atmospheric environment
    Zhaokun Wang; Chenshan Gao; Shuhan Hou; Huiru Yang; Ziyuan Shao; Siyuan Xu; Huaiyu Ye;
    Materials Today Communications,
    Volume 28, pp. 102654, 2021. DOI: 10.1016/j.mtcomm.2021.102654
    document

  3. Correction: The inactivation mechanism of chemical disinfection against SARS-CoV-2: from MD and DFT perspectives
    Tan, Chunjian; Gao, Chenshan; Zhou, Quan; Van Driel, Willem; Ye, Huaiyu; Zhang, GuoQi;
    RSC Adv.,
    Volume 11, pp. 3509-3509, 2021. DOI: 10.1039/D0RA90127J
    document

  4. Effects of Defect and Temperature on the Mechanical Performance of WS2: A Multiscale Analysis
    Hongyu Tang; Dong Hu; Zhen Cui; Huaiyu Ye; GuoQi Zhang;
    Journal of Physical Chemistry C,
    2021.
    document

  5. Recent advances in 2D/nanostructured metal sulfide-based gas sensors: mechanisms, applications, and perspectives
    Hongyu Tang; Leandro Sacco; Sten Vollebregt; Huaiyu Ye; Xuejun; Fan; GuoQi Zhang;
    Journal of Materials Chemistry A,
    Volume 8, pp. 24943-24976, 2020.
    document

  6. The inactivation mechanism of chemical disinfection against SARS-CoV-2: from MD and DFT perspectives
    Tan, Chunjian; Gao, Chenshan; Zhou, Quan; Van Driel, Willem; Ye, Huaiyu; Zhang, GuoQi;
    RSC Adv.,
    Volume 10, pp. 40480-40488, 2020. DOI: 10.1039/D0RA06730J
    document

  7. P-type β-Ga2O3 metal-semiconductor-metal solar-blind photodetectors with extremely high responsivity and gain-bandwidth product
    Z.X. Jiang; Z.Y. Wu; C.C. Ma; J.N. Deng; H. Zhang; Y. Xu; J.D. Ye; Z.L. Fang; GuoQi Zhang; J.Y. Kang; T.-Y. Zhang;
    Materials Today Physics,
    Volume 14, pp. 100226, 2020. DOI: 10.1016/j.mtphys.2020.100226
    document

  8. Research On FOPLP Package of multi-chip Power Module
    Jing Jiang; Jia ren Huo; Guan qiang Song; Huaiyu Ye; De Bo Liu; GuoQi Zhang; Jun Tao Jun Wang;
    In 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),
    pp. 1-6, Sep. 2020. DOI: 10.1109/ESTC48849.2020.9229816

  9. A DFT Model Study about Structure Sensitivity for Benzotriazole Adsorption on Copper Surfaces and Nano Cluster
    Weihong Zhang; Quan Zhou; Honghao Tang; Xu Liu; Huaiyu Ye; Sau Wee Koh; GuoQi Zhang;
    In 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
    Guangzhou, China, IEEE, pp. 1-4, Aug 2020. DOI: 10.1109/ICEPT50128.2020.9202975

  10. Study on the effect of mixing proportion of micro- and nano-copper particles on sintering properties
    Xu Liu; Quan Zhou; Qipeng Liu; Honghao Tang; Chenshan Gao; Bin Xie; Sau Wee Koh; Huaiyu Ye; GuoQi Zhang;
    In 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
    pp. 1-5, 2020. DOI: 10.1109/ICEPT50128.2020.9201937

  11. Tunable electronic and optical properties of the WS2/IGZO heterostructure via an external electric field and strain: A theoretical study
    Hongyu Tang; Chunjian Tan; Huiru Yang; Kai Zheng; Yutao Li; Huaiyu Ye; Xianping Chen; Xuejun Fan; Tianling Ren; Kuochi Zhang;
    Physical Chemistry Chemical Physics,
    pp. 14713-14721, 2019. DOI: 10.1039/c9cp02084e

  12. Effect of Nano-SnS and Nano-MoS2 on the corrosion protection performance of the polyvinylbutyral and zinc-rich polyvinylbutyral coatings
    Qu, Z.; Wang, L.; Hongyu Tang; Ye, H.; Li, M.;
    Nanomaterials,
    2019. DOI: 10.3390/nano9070956

  13. SnSe monolayer: A promising candidate of SO 2 sensor with high adsorption quantity
    Ye, H.; Liu, L.; Xu, Y.; Wang, L.; Chen, X.; Zhang, K.; Liu, Y.; Koh, S.; GuoQi Zhang;
    Applied Surface Science,
    2019. DOI: 10.1016/j.apsusc.2019.03.346

  14. Liquid-phase exfoliated SnS as a semiconductor coating filler to enhance corrosion protection performance
    Hongyu Tang; Qu, Z.,; Wang, L.; Ye, H.; GuoQi Zhang; Fan, X.;
    Physical Chemistry Chemical Physics,
    2019. DOI: 10.1039/c9cp03381e

  15. Ultra-High Sensitive NO2 Gas Sensor Based on Tunable Polarity Transport in CVD-WS2/IGZO p-N Heterojunction
    Hongyu Tang; Yutao Li; Robert Sokolovskij; Leandro Sacco; Hongze Zheng; Huaiyu Ye; Hongyu Yu; Xuejun Fan; He Tian; Tian-Ling Ren; GuoQi Zhang;
    ACS Applied Materials and Interfaces,
    pp. 40850-40859, 2019. DOI: 10.1021/acsami.9b13773

  16. A DFT study of In doped Tl2O: a superior NO2 gas sensor with selective adsorption and distinct optical response
    Chenshan Gao; Yingying Zhang; Huiru Yang; Yang Liu; Yufei Liu; Jihe Dua; Huaiyu Ye; GuoQi Zhang;
    Applied Surface Science,
    2019. DOI: 10.1016/j.apsusc.2019.07.067

  17. High-performance humidity sensor using Schottky-contacted SnS nanoflakes for noncontact healthcare monitoring
    Hongyu Tang; Yutao Li; Huaiyu Ye; Fafei Hu; Chenshan Gao; Luqi Tao; Tao Tu; Guangyang Gou; Xianping Chen; Xuejun Fan; Tianling Ren; GuoQi Zhang;
    Nanotechnology,
    Volume 31, Issue 5, pp. 055501, Nov 2019. DOI: 10.1088/1361-6528/ab414e
    document

  18. Electrical and optical characterization of MoS2 thin film transistors and the effect of strain on their performances
    Zuopeng Qu; Hongyu Tang; Huaiyu Ye; Xuejun Fan; GuoQi Zhang;
    In EurosimE,
    IEEE, IEEE, 2019. DOI: 10.1109/EuroSimE.2019.8724549

  19. Thermal Management on IGBT Power Electronic Devices and Modules
    Cheng Qian; Amir Mirza Gheytaghi; Jiajie Fan; Hongyu Tang; Bo Sun; Huaiyu Ye; GuoQi Zhang;
    IEEE Access,
    Volume 6, pp. 12868-12884, 2018.

  20. Germanene on single layer ZnSe substrate: Novel electronic and optical properties
    H. Y. Ye; F. F. Hu; Hongyu Tang; L. W. Yang; X. P. Chen; L. G. Wang; GuoQi Zhang;
    Physical Chemistry Chemical Physics,
    Volume 20, Issue 23, pp. 16067-16076, 2018.

  21. High Selective Gas Detection for small molecules based on Germanium selenide monolayer
    Liu, L.; Yang, Q.; Wang, Z.; Ye, H.; Chen, X.; Fan, X.; GuoQi Zhang;
    Applied Surface Science,
    pp. 575-581, 2018. DOI: 10.1016/j.apsusc.2017.10.084

  22. Promoting sensitivity and selectivity of HCHO sensor based on strained InP3 monolayer: A DFT study
    Yang, H.; Wang, Z.; Ye, H.; Zhang, K.; Chen, X.; GuoQi Zhang;
    Applied Surface Science,
    pp. 554-561, 2018. DOI: 10.1016/j.apsusc.2018.08.014

  23. Modeling of two-dimensional hyperbolic heat conduction in silicon-on-insulator transistor by equivalent RLC network
    Amir Mirza Gheytaghi; Huaiyu Ye; GuoQi Zhang;
    In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
    2018.

  24. Modulation of Gas Adsorption on SnS by strain
    Fafei Hu; Huaiyu Ye; Hongyu Tang; Xianping Chen;
    In 19th International Conference on Electronic Packaging Technology (ICEPT),
    2018.

  25. A tunable THz wave modulator based on graphene
    Feng Zhang; Xian-Ping Chen; Qi-qin Wei; Li-Bo Yuan; Miao Cai; Huai-Yu Ye; GuoQi Zhang Jing Xiao;
    In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018,
    2018.

  26. SiC MOSFET Threshold-Voltage Instability under High Temperature Aging
    Liu, Y.; Chen, X.; Zhao, Z.; Li, Z.; Lu, C.; Zhang, J.; Ye, H.; Koh, S. W.; Wang, L.; GuoQi Zhang;
    In Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018,
    2018. DOI: 10.1109/ICEPT.2018.8480781

  27. The performance of sintered nanocopper interconnections for high temperature device
    Liu, Q.; Chen, X.; Zhu, J.; Zhang, H.; Zhang, J. S.; Zhang, J. G.; Wang, L.; Ye, H.; Koh, S. W.; GuoQi Zhang;
    In 19th International Conference on Electronic Packaging Technology, ICEPT 2018,
    IEEE, 2018. DOI: 10.1109/ICEPT.2018.8480591

  28. First-Principles Study of Nitric Oxide Sensor Based on Blue Phosphorus Monolayer
    HC Luo; RS Meng; H Gao; X Sun; J Xiao; HY Ye; GuoQi Zhang; XP Chen;
    IEEE Electron Device Letters,
    Volume 38, Issue 8, pp. 1139-1142, 2017.

  29. Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component
    Hongyu Tang; H Ye; CKY Wong; SYY Leung; J Fan; X Chen; X Fan; GuoQi Zhang;
    Microelectronics Reliability,
    Volume 78, pp. 197-204, 2017.

  30. Nitrogen Dioxide Gas Sensor Based on Monolayer SnS: A First-Principle Study
    FF Hu; Hongyu Tang; CJ Tan; HY Ye; XP Chen; GuoQi Zhang;
    IEEE Electron Device Letters,
    Volume 38, Issue 7, pp. 983-986, 2017.

  31. A Reliability Prediction for Integrated LED Lamp With Electrolytic Capacitor-Free Driver
    Bo Sun; X Fan; L Li; H Ye; W van Driel; GuoQi Zhang;
    IEEE Transactions on Components and Packaging and Manufacturing Technology,
    Volume 7, Issue 7, pp. 1081-1088, 2017.

  32. A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation
    Bo Sun; X Fan; H Ye; J Fan; C Qian; W van Driel; GuoQi Zhang;
    Reliability Engineering & System Safety,
    Volume 163, pp. 14-21, 2017.

  33. Sulfur Dioxide and Nitrogen Dioxide Gas Sensor Based on Arsenene: A First-Principle Study
    XP Chen; LM Wang; X Sun; RS Meng; J Xiao; HY Ye; GuoQi Zhang;
    IEEE Electron Device Letters,
    Volume 38, Issue 5, pp. 661-664, 2017.

  34. Numerical Thermal Analysis and Optimization of Multi-Chip LED Module Using Response Surface Methodology and Genetic Algorithm
    Hongy Tang; HY Ye; XP Chen; C Qian; XJ Fan; GuoQi Zhang;
    IEEE Access,
    Volume 5, Issue 5, pp. 16459-16468, 2017.

  35. An AlAs/germanene heterostructure with outstanding tunability of electronic properties
    C Tan; Q Yang; H Ye; X Chen; GuoQi Zhang;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  36. Electrical and optical properties of NO and H2S adsorption on Arsenic Phosphorus
    Y Zhang; K Zheng; X Chen; GuoQi Zhang; C Tan; Q Yang; J Jiang; H Ye;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  37. SnS monolayer as gas sensors: Insights from a first-principles investigation
    F Hu; C Tan; H Ye; X Chen; GuoQi Zhang;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  38. Adsorption of gases on monolayer GeSe: A first principle study
    L Liu; Q Yang; H Ye; X Chen; GuoQi Zhang;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  39. First principle design of CdS/germanene heterostructures with tunable electronic and transport properties
    K Zheng; H Ye; GuoQi Zhang; Y Zhang; L Liu; J Jiang; Q Yang; C Tan; X Chen;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  40. The intriguing electronic and optical properties modulation in blue phosphorene/g-III-nitrides heterostructures
    Q Yang; C Tan; H Ye; X Chen; GuoQi Zhang;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  41. Thermal conductivity of functionalized graphene-polymer nanocomposite: A non-equilibrium molecular dynamics study
    Hongyu Tang; Huaiyu Ye; Xianping Chen; Xuejun Fan; GuoQi Zhang;
    In EurosimE,
    2017.

  42. A review of small heat pipes for electronics
    Xianping Chen; Huaiyu Ye; Xuejun Fan; Tianling Ren; GuoQi Zhang;
    Applied Thermal Engineering,
    Volume 96, pp. 1-17, 2016.

  43. Thermal analysis and optimization of IGBT power electronic module based on layout model
    Hongyu Tang; Huaiyu Ye; Mingming Wang; Xuejun Fan; GuoQi Zhang;
    In ICEPT,
    2016.

  44. First-principles study of the effect of functional groups on polyaniline backbone
    X P Chen; J K Jiang; Q H Liang; N Yang; Huaiyu Ye; M Cai; L Shen; D G Yang; T L Ren;
    Scientific Reports,
    Volume 5, pp. 16907, 2015.

  45. Fabrication and application of temperature triggered MEMS switch for active cooling control in solid state lighting system
    Huaiyu Ye; Jai Wei; van Zeijl, HW; Sarro, PM; GuoQi Zhang;
    Microelectronics Reliability,
    Volume 54, Issue 6-7, pp. 1338-1343, 2014.

  46. Electrical-thermal-luminous-chromatic model of phosphor-converted white light-emitting diodes
    Huaiyu Ye; Sau Wee Koh; Cadmus Yuan; Henk van Zeijl; Alexander W.J. Gielen; Shi-Wei Ricky Lee; GuoQi Zhang;
    Applied Thermal Engineering,
    Volume 63, Issue 2, pp. 588-597, 2014.

  47. A polymer based miniature loop heat pipe with silicon substrate and temperature sensors for high brightness light-emitting
    Huaiyu Ye; Sokolovskij, R; van Zeijl, HW; Gielen, AWJ; GuoQi Zhang;
    Microelectronics Reliability,
    Volume 54, Issue 6-7, pp. 1355-1362, 2014.

  48. Investigation of color shift of LEDs-based lighting products
    Koh, SW; Huaiyu Ye; Maryam Yazdan Mehr; Jia Wei; van Driel, WD; Zhao, LB; GuoQi Zhang;
    In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
    pp. 1-5, 2014.

  49. Thermal Management of Solid State Lighting Module
    Huaiyu Ye;
    PhD thesis, Delft University of Technology, 2014.
    document

  50. Thermal Analysis of Remote Phosphor in LED Modules
    Mingzhi Dong; Jia Wei; Huaiyu Ye; Cadmus Yuan; GuoQi Zhang;
    Journal of Semiconductors,
    Volume 34, Issue 5, pp. 053007-1-3, 2013.

  51. Molecular modeling of protonic acid doping of emeraldine base polyaniline for chemical sensors
    X.P. Chen; C. Yuan; C.K.Y. Wong; H. Ye; S.Y.Y. Leung; GuoQi Zhang;
    Sensors and Actuators B: Chemical,
    Volume 174, pp. 210-216., 2012. DOI 10.1016/j.snb.2012.08.042.

  52. Single-mask fabrication of temperature triggered MEMS switch for cooling control in SSL system
    J. Wei; H. Ye; H.W. van Zeijl; P.M Sarro; GuoQi Zhang;
    In R. Walczak; J. Dziuban (Ed.), Proc. Eurosensors XXVI,
    Krakow, Poland, Procedia Engineering, pp. 849-852, Sep 2012. DOI 10.1016/j.proeng.2012.09.280.

  53. Dynamic thermal simulation of high brightness LEDs with unsteady driver power output
    H. Ye; S. Koh; J. Wei; H.W. van Zeijl; GuoQi Zhang;
    In 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
    Lisbon, Portugal, Apr. 2012. DOI 10.1109/ESimE.2012.6191768.

  54. A review of passive thermal management of LED module
    H. Ye; S. Koh; H. Zeijl; A.W.J. Gielen; GuoQi Zhang;
    Journal of Semiconductors,
    Volume 32, Issue 1, pp. 1-4, 2011. DOI 10.1088/1674-4926/32/1/014008.

  55. Thermal analysis of HB LED packages and advanced materials
    H. Ye; A.W.J. Gielen; H.W. vanZeijl; GuoQi Zhang;
    In ChinaSSL 2012, China,
    2011.

  56. Numerical modeling of thermal performance: Natural convection and radiation of solid state lighting
    H. Ye; A.W.J. Gielen; H.W. vanZeijl; R.J. Werkhoven; GuoQi Zhang;
    In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
    Linz, Austria, pp. 1-6, Apr. 2011. ISBN 978-1-4577-0106-1; DOI 10.1109/ESIME.2011.5765845.

  57. Plasma decapsulation of plastic IC packages with copper wire bonds for failure analysis
    Jiaqi Tang; H. Ye; J.B.J. Schelen; C.I.M. Beenakker;
    In Proc. 12th International Conference on Electronics Packaging Technology & High Density Packaging (ICEPT-HDP 2011),
    Shanghai, China, pp. 888-892, Aug. 2011. ISBN 978-1-4577-1768-0; DOI 10.1109/ICEPT.2011.6066972.

BibTeX support

Last updated: 21 Jul 2020

Huaiyu Ye

Alumnus
  • Left in 2014
  • Now: SUSTech