dr. Fengze Hou

1. Co-Reduction of Common Mode Noise and Loop Current of Three-Level Active Neutral Point Clamped Inverters
   Wang, Jianing; Liu, Xiaohui; Peng, Qiang; Xun, Yuanwu; Yu, Shaolin; Jiang, Nan; Wang, Wenbo; Hou, Fengze;
   IEEE Journal of Emerging and Selected Topics in Power Electronics,
   Volume 9, Issue 1, pp. 1088-1103, 2021. DOI: 10.1109/JESTPE.2020.3043018

2. Design of a Fan-Out Panel-Level SiC MOSFET Power Module Using Ant Colony Optimization-Back Propagation Neural Network
   Qian, Yichen; Hou, Fengze; Fan, Jiajie; Lv, Quanya; Fan, Xuejun; Zhang, Guoqi;
   IEEE Transactions on Electron Devices,
   Volume 68, Issue 7, pp. 3460-3467, 2021. DOI: 10.1109/TED.2021.3077209

3. Fan-out Panel-level PCB Embedded SiC Power MOSFETs Packaging
   Fengze Hou; W. Wang; R. Ma; Y. Li; Z. Han; M. Su; J. Li; Z. Yu; Y. Song; Q. Wang; M. Chen; L. Cao; GuoQi Zhang; J.A. Ferreira;
   IEEE Journal of Emerging and Selected Topics in Power Electronics,
   Volume 8, Issue 1, pp. 367-380, 2020.

4. Review of Packaging Schemes for Power Module
   Fengze Hou; W. Wang; L. Cao; M. Su; J. Li; GuoQi Zhang; J.A. Ferreira;
   IEEE Journal of Emerging and Selected Topics in Power Electronics,
   Volume 8, Issue 1, pp. 223-238, 2020.

5. Microchannel Thermal Management System with Two-Phase Flow for Power Electronics over 500 W/cm2 Heat Dissipation
   Fengze Hou; Hengyun Zhang; Dezhu Huang; Jiajie Fan; Fengman Liu; Tingyu Lin; Liqiang Cao; Xuejun Fan; Braham Ferreira; GuoQi Zhang;
   IEEE Transactions on Power Electronics,
   Volume 35, Issue 10, pp. 10592-10600, 2020. DOI: 10.1109/TPEL.2020.2985117

6. Experimental evaluation of a compact two-phase cooling system for high heat flux electronic packages
   Fengze Hou; Wang, W.; Zhang, H.; Chen, C.; Chen, C.; Lin, T.; Cao, L.; GuoQi Zhang; Ferreira, J. A.;
   Applied Thermal Engineering,
   Volume 163, pp. 114338, 2019. DOI: 10.1016/j.applthermaleng.2019.1143

7. Characterization of PCB Embedded Package Materials for SiC MOSFETs
   Fengze Hou; Wang, W.; Lin, T.; Cao, L.; GuoQi Zhang; Ferreira, J. A.;
   IEEE Transactions on Components, Packaging and Manufacturing Technology,
   Volume 9, Issue 6, pp. 1054-1061, 2019. DOI: 10.1109/TCPMT.2019.2904533

8. High Power-Density 3D Integrated Power Supply Module Based on Panel-Level PCB Embedded Technology
   Fengze Hou; Xueping Guo; Qidong Wang; Wenbo Wang; Tingyu Lin; Liqiang Cao; GuoQi Zhang; J.A. Ferreira;
   In Proc. IEEE Electronic Components and Technol. Conf. (ECTC),
   pp. 1365- 1370, 2018.

9. Compensation Method for Die Shift in Fan-Out Packaging
   Yue Sun; Fengze Hou; Chen, F.; Liu, H.; Zhang, H.; Sun, P.; Lin, T.; Cao, L.;
   In 19th International Conference on Electronic Packaging Technology, ICEPT 2018,
   2018. DOI: 10.1109/ICEPT.2018.8480551

10. Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package
    Fengze Hou; T Lin; L Cao; F Liu; J Li; X Fan; GuoQi Zhang;
    IEEE Transactions on Components, Packaging and Manufacturing Technology,
    Volume 7, Issue 10, pp. 1721-1728, 2017.

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