ET4391 Advanced microelectronics packaging

Topics: Basics and the state of the art of semiconductor packaging
This is a multi-diciplinary course, dealing with scientifically challenging and economically important technology issues. MSc students from electrical engineering, mechanical engineering, material science and physics are encouraged to attend.

Course Contents

  1. Introduction of micro/nanoelectronics
    • Basics and the state of the art of advanced frontend and backend technologies
    • International roadmaps and strategic research agenda
    • Major application trends
  2. Interconnect technologies
  3. MEMS & sensor packaging
  4. 3D and wafer level system integration
  5. Application specific packaging -1 (IC packaging, etc.)
  6. Application specific packaging -2 (LED, etc)
  7. Application specific packaging -3 (RF, Ppwer, automotive, healthcare, etc.)
As the bridge between devices and various multi-funcational electronics systems, microelectronic system integration and packaging control more than 90% of the size, 60% of the cost, and largely the system performance and reliability. It is one of the most fascinating and rapid developing technology and business fields of semiconductors, and playing a dominant role in the development of future micro/nanoelectronics and systems.


prof.dr. Kouchi Zhang

Solid state lighting, IC packaging, reliability

Last modified: 2014-06-12


Credits: 3 EC
Period: 0/0/2/0
Contact: Kouchi Zhang