ET4391 Advanced microelectronics packaging

Topics: Basics and state-of-the-art of semiconductor packaging

As the bridge between devices and various multi-funcational electronics systems, microelectronic system integration and packaging control more than 90% of the size and 60% of the cost of microelectronic devices, and largely the system performance and reliability. Microelectronic system integration and packaging is moreover one of the most fascinating and rapid developing technology and business fields of semiconductors, and playing a dominant role in the development of future micro/nanoelectronics and systems.

Advanced microelectronics packaging is a multi-diciplinary course dealing with scientifically challenging and economically important technology issues. MSc students from electrical engineering, mechanical engineering, material science and physics are encouraged to attend.

Course Contents

  1. Introduction of micro/nanoelectronics
    • Basics and the state of the art of advanced front-end and back-end technologies
    • International roadmaps and strategic research agenda
    • Major application trends
  2. Simulation and optimization for package design and reliability
  3. Interconnect technology and sensor packaging
  4. Heterogeneous systems packaging by self-assembly
  5. 3D and wafer-level system integration
In addition the course offers supervised mini-projects where the students have the opportunity to get first-hand experience in developing packaging applications.


prof.dr. GuoQi Zhang

Heterogenous system integration, 2D materials and devices, wide bandgap semiconductor sensors, digital twin and reliability, multi-scale and multi-physics modeling

dr. Massimo Mastrangeli

Organ-on-chip technology, micro/nanosystems assembly, capillary manipulation, wetting Henk van Zeijl

dr. Willem van Driel


Last modified: 2020-01-29


Credits: 3 EC
Period: 0/0/2/0
Contact: GuoQi Zhang