MSc Jian Li

PhD student
Electronic Components, Technology and Materials (ECTM), Department of Microelectronics

Themes: Flexible and Stretchable Electronics

POSITION-II: innovation in smart medical instruments

  1. Wafer Scale Flexible Interconnect Transfer for Hetrogeneous Integration
    Pan Liu; Jian Li; Henk van Zeijl; GuoQi Zhang;
    In 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
    United States, IEEE, pp. 817--823, 06 2020. DOI: 10.1109/ECTC32862.2020.00133

  2. Embedded High-Density Trench Capacitors for Smart Catheters
    Jian Li; Jeroen Naaborg; Marcus Louwerse; Vincent Henneken; Carlo Eugeni; Ronald Dekker;
    In 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),
    pp. 1-5, Sep. 2020. DOI: 10.1109/ESTC48849.2020.9229800

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Last updated: 3 Aug 2018

MSc students