Ronald Dekker

Publications

  1. A Platform for Mechano(-Electrical) Characterization of Free-Standing Micron-Sized Structures and Interconnects
    Angel Savov; Shivani Savov; Salman Shafqat; Johan Hoefnagels; Marcus Louwerse; Ronald Stoute; Ronald Dekker;
    Micromachines,
    Volume 9, Issue 1, pp. 39, 2018.
    document

  2. A novel method to transfer porous PDMS membranes for high throughput Organ-on-Chip and Lab-on-Chip assembly
    William.F Quirós-Solano; Nikolas Gaio; Cinzia Silvestri; Oscar M. J. A. Arik; Yusuf, B. Stassen; Andries van der Meer; Carlijn V.C. Bouten; Albert van den Berg; Ronald Dekker; P.M. Sarro;
    In 31th IEEE International Conference on Micro Electro Mechanical Systems (MEMS),
    pp. 318-321, 2018.

  3. A Multi Well Plate Organ-on-chip (Ooc) Device For In-vitro Cell Culture Stimulation And Monitoring
    N. Gaio; A. Waafi; M.L.H. Vlaming; E. Boschman; P. Dijkstra; P. Nacken; S.R. Braam; C. Boucsein; P.M. Sarro; R. Dekker;
    In 31th IEEE International Conference on Micro Electro Mechanical Systems (MEMS),
    2018.

  4. Investigation of "Fur-like" Residues Post Dry Etching of Polyimide Using Aluminum Hard Etch Mask
    Shivani Joshi; Angel Savov; Salman Shafqat; Ronald Dekker;
    Materials Science in Semiconductor Processing,
    2017.
    document

  5. Novel Method for Adhesion between PI-PDMS Using Butyl Rubber for Large Area Flexible Body Patches
    Joshi, Shivani; Bagani, Rishab; Beckers, Lucas; Dekker, Ronald;
    In Proceedings of Eurosensors,
    pp. 307, 2017.

  6. Generic platform for the miniaturization of bioelectronic implants
    M. M. Kluba; J. W. Weekamp; M. Louwerse; V. Henneken; R. Dekker;
    In Design of Medical Devices Conference (DMD Europe),
    2017.

  7. Singe-Step CMOS Compatible Fabrication of High Aspect Ratio Microchannels Embedded in Silicon
    M. Kluba; A. Arslan; R. Stoute; J. Muganda; R. Dekker;
    In Eurosensors,
    2017.
    document

  8. Next generation smart catheters
    R. Dekker;
    In Philips Research,
    2017.

  9. Towards the Next Generation Smart Catheters and implants
    R. Dekker;
    In Smart Systems Industry Summit,
    DSP Valley, 2017.
    document

  10. Towards the next generation of smart catheters and bioelectronics medicines
    R. Dekker;
    In Tyndall Technology Days 2017,
    2017.
    document

  11. Organ-on-Chip
    R. Dekker;
    In Professors in de theatre arena,
    Theatre de Veste, Technical University of Delft, 2017.
    document

  12. Next Generation smart catheters
    R. Dekker;
    In iMAPS,
    2017.

  13. A low-cost electrical read-out system for cell stiffness measurement using silicon based microfluidic device
    S. Kawasaki; M. M. Kluba; R. Dekker;
    In ICT.OPEN,
    2017.

  14. The Next Generation Smart Catheters
    R. Dekker;
    Maxwell, November 2017. "Maxwell" is a periodical of the Delft university of technology that is distributed amongst students and alumni.

  15. Cytostretch, an Organ-on-Chip Platform
    Gaio, N.; van Meer, B.; Quiros Solano, W.; Bergers, L.; van de Stolpe, A.; Mummery, C.; Sarro, P.M.; Dekker, R.;
    Micromachines,
    Volume 7, Issue 7, pp. 120, 2016.

  16. Fabrication and characterization of an Upside-down Carbon Nanotube (CNT) Microelectrode array (MEA)
    Gaio, N.; Silvestri, C.; van Meer, B.; Vollebregt, S.; Mummery, C.; Dekker, R.;
    IEEE Sensors Journal,
    Volume 16, Issue 24, pp. 8685, 2016.

  17. Adhesion Improvement of Polyimide/PDMS Interface by Polyimide Surface Modification
    Shivani Joshi; Antonie van Loona; Angel Savov; Ronald Dekker;
    MRS Advances,
    Volume 1, pp. 33-38, 2016.

  18. High Definition Flex-to-Rigid (HD F2R): an Interconnect Substrate Technology
    Ronald Stoute; Marcus C. Louwerse; Vincent A. Henneken; Ronald Dekker;
    In ICT.OPEN,
    2016.

  19. CMOS compatible embedded microchannels
    R. Stoute; J.M. Muganda; S. Dahar; A. Arslan; R.J.M Henderikx; P.C.M. van Stiphout; J.M.J. den Toonder; R. Dekker;
    In 20th International Conference on Miniaturized Systems for Chemistry and Life Sciences,
    2016.

  20. Intravascular Ultrasound at the Tip of a Guidewire: Concept and First Assembly Steps
    Ronald Stoute; Marcus C. Louwerse; Vincent A. Henneken; Ronald Dekker;
    In Procedia Engineering: Proceedings of the 30th anniversary Eurosensors Conference,
    pp. 1563-1567, 2016.

  21. High Aspect Ratio Buried Channel Fabricated Using Two Step DRIE Process
    M. M. Kluba; A. Arslan; R. Dekker;
    In ICT.OPEN,
    2016.

  22. Flexible/Stretchable Ultrasound Body Patches
    Shivani Joshi; Sourush Yazdi; Vincent Henneken; Rene Sanders; Ronald Dekker;
    In ICT.OPEN Conference,
    2016.

  23. Flexible membrane sensor for opto-mechanical force transducer
    Ronald Stoute; James Muganda; Steven Beekmans; Davide Iannuzzi; Ronald Dekker;
    In 13th International Workshop on Nanomechanical Sensing,
    2016.

  24. Origami assembly platform for smart medical instruments
    R. Stoute; M. C. Louwerse; V. A. Henneken; R. Dekker;
    In 28th Conference of the international Society for Medical Innovation and Technology (iSMIT) / 4th Design of Medical Devices Conference,
    2016.
    document

  25. Towards the Next Generation of Smart Catheters
    R. Dekker;
    In SEMICON Europa,
    2016.

  26. Flex-to-Rigid, an assembly platform for the next generation smart catheters
    R. Dekker;
    In Forum BE-FLEXIBLE,
    Fraunhofer EMFT, 2016.

  27. Meet Dr. Frankenstein
    R. Dekker;
    Guest Lecture at École Polytechnique Fédérale de Lausanne, November 2016.
    document

  28. Conformable Body Patches for Ultrasound Applications
    S. Joshi; S. Yazadi; V. Henneken; R. Sanders; R. Dekker;
    In 17th IEEE Electronics Packaging Technology Conference,
    2015.

  29. Miniaturized Optical Data Link Assembly for 360 m Guidewires
    Stoute, Ronald; Louwerse, Marcus C.; van Rens, Jeannet; Henneken, Vincent A.; Dekker, Ronald;
    In ICT.OPEN Conference,
    pp. 46-51, 2015.
    document

  30. A novel processing concept for reduction of substrate artifacts in ultrasound transducer arrays
    A.Savov; A. H. Noor; R. Dekker;
    In Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2015 10th International,,
    pp. 145-148, 2015.

  31. Upside-down Carbon Nanotube (CNT) Micro-electrode Array (MEA)
    N. Gaio; B. van Meer; C. Silvestri; Saeed Khoshfetrat Pakazad; S. Vollebregt; C.L. Mummery; R. Dekker;
    In IEEE Sensors Conference,
    2015.

  32. A novel stretchable micro-electrode array (SMEA) design for directional stretching of cells
    S Khoshfetrat Pakazad; A Savov; A van de Stolpe; R Dekker;
    Journal of Micromechanics and Microengineering,
    Volume 24, Issue 3, pp. 034003, 2014.

  33. A post processing approach for manufacturing high-density stretchable sensor arrays
    A. Savov; S. Khoshfetrat Pakazad; S. Joshi; V. Henneken; R. Dekker;
    In IEEE Sensors,
    pp. 1703-1705, 2014.

  34. Residue-free plasma etching of polyimide coatings for small pitch vias with improved step coverage
    B. Mimoun; H.T.M. Pham; V. Henneken; R. Dekker;
    Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures,
    Volume 31, Issue 2, pp. 021201-021201-6, Mar. 2013. DOI 10.1116/1.4788795.

  35. A manufacturable platform for in vito electrophysiological studies under mechanical stimulation
    S. Khoshferat Pakazad; A. Savov; R. Dekker;
    In Proceedings of the 17th international conference on miniaturized systems for chemistry and life sciences,
    pp. 1412-1414, 2013.

  36. A novel SMEA design for directional stretching of cells
    S. Khoshferat Pakazad; A. Savov and. A. van der Stolpe; R. Dekker;
    In Proceedings of the 2013 International Conference on Microtechnologies in Medicine,
    pp. 6-7, 2013.

  37. Ultra-flexible devices for 360 _m diameter guidewires
    B. Mimoun; V. Henneken; P.M. Sarro; R. Dekker;
    In 25th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2012),
    Paris, France, IEEE, pp. 472-475, Jan. 2012. ISBN: 978-978-1-4673-0325-5, DOI 10.1109/MEMSYS.2012.6170227.

  38. Thermal flow sensors on flexible substrates for minimally invasive medical instruments
    B. Mimoun; A. van der Horst; D. van der Voort; M. Rutten; R. Dekker; F. van de Vosse;
    In Proc. of IEEE Sensors Conference 2012,
    Taipei, Taiwan, pp. 1-4, Oct. 2012 2012. DOI 10.1109/ICSENS.2012.6411429.

  39. Living chips and Chips for the living
    R. Dekker; S. Braam; V. Henneken; A. van der Horst; S. Khoshfetrat Pakazad; M. Louwerse; B. van Meer; B. Mimoun; A. Savov; A. van de Stolpe;
    In Proc. of IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM 2012),
    Portland, Oregon, USA, pp. 1-9, Sep. 2012. DOI 10.1109/BCTM.2012.6352653.

  40. A platform for manufacturable stretchable micro-electrode arrays
    S. Khoshfetrat Pakazad; A. Savov; S.R. Braam; R. Dekker;
    In R. Walczak; J. Dziuban (Ed.), Proc. Eurosensors XXVI,
    Krakow, Poland, Procedia Engineering, pp. 817-820, Sep 2012. DOI 10.1016/j.proeng.2012.09.272.

  41. Flexible multipolar cuff microelectrode for FES of sacral nerve roots
    F. Rodrigues; B. Mimoun; M. Bartek; P.M. Mendes; R. Dekker;
    In Proc. 17th Annual International FES Society Conference (IFESS 2012),
    Banff, Alberta, Canada, pp. 1-4, Sept. 2012.

  42. Residue-free plasma etching of polyimide coatings
    B. Mimoun; H.T.M. Pham; V. Henneken; R. Dekker;
    In International Conference on Electronics Packaging 2012 (ICEP),
    Tokyo, Japan, pp. 265-269, Apr. 2012.

  43. Atomic-scale electron-beam sculpting of near-defect-free graphene nanostructures
    B. Song; G.F. Schneider; Q. Xu; G. Pandraud; C. Dekker; H.W. Zandbergen;
    Nano Letters,
    Volume 11, Issue 6, pp. 2247-2250, 2011. DOI 10.1021/nl200369r.

  44. A novel SOI-MEMS micro-swing time-accelerometer operating in two time-based transduction modes for high sensitivity and extended range
    V. Rajaraman; B.S. Hau; L.A. Rocha; R.A. Dias; K.A.A. Makinwa; R. Dekker;
    In 16th International Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS 2011),
    Beijing, China, pp. 2066-2069, Jun. 2011. ISBN 978-1-4577-0157-3; DOI 10.1109/TRANSDUCERS.2011.5969225.

  45. A stretchable micro-electrode array for in vitro electrophysiology
    S. Khoshfetrat Pakazad; A. Metodiev Savov; A. van de Stolpe; S. Braam; B. van Meer; R. Dekker;
    In Proc. 24th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2011),
    Cancun, Mexico, IEEE, pp. 829-832, Jan. 2011. ISBN 978-1-4244-9633-4; DOI 10.1109/MEMSYS.2011.5734553.

  46. Millimeter-wave integrated waveguides on silicon
    G. Gentile; R. Dekker; P. de Graaf; M. Spirito; L.C.N. de Vreede; B. Rejaei;
    In Proc. 2011 IEEE Topical Meeting on Silicon Monolithic Integrated Circuits RF Systems (SiRF 2011),
    Phoenix, AZ, pp. 37-40, Jan. 2011. ISBN 978-1-4244-8060-9; DOI 10.1109/SIRF.2011.5719314.

  47. Ultra-flexible devices for smart invasive medical instruments
    B. Mimoun; V. Henneken; R. Dekker;
    In 3rd Flexible and Stretchable Electronics Workshop 2011,
    Berlin, Germany, Nov. 2011.

  48. FleXss: A standalone Matlab-based graphical user interface (GUI) for stress-strain analytical modeling of multilayered structures with applied bending
    B. Mimoun; A. Vieira da Silva; R. Dekker;
    In 3rd Flexible and Stretchable Electronics Workshop 2011,
    Berlin, Germany, Nov. 2011.
    document

  49. Living chips-Chips for the living
    R. Dekker; B. Mimoun; S. Pakazaad;
    In 3rd Flexible and Stretchable Electronics Workshop 2011,
    Berlin, Germany, Nov. 2011.
    document

  50. Flex-to-Rigid (F2R): A Novel Ultra-Flexible Technology for Smart Invasive Medical Instruments
    B. Mimoun; V. Henneken; R. Dekker;
    In Stretchable Electronics and Conformal Biointerfaces,
    Mater. Res. Soc. Symp. Proc. Volume 1271E, 2010.

  51. FleSS: a Matlab Based Graphical User Interface for Stress Strain Analytical Modeling of Multilayered Structures with Applied Bending
    A. Vieira da Silva; B. Mimoun; R. Dekker;
    In Proc. of 13th Workshop on Semiconductors Advances for Future Electronics and Sensors 2010 (SAFE 2010),
    Veldhoven, The Netherlands, STW, pp. 175-179, 2010. ISBN 978-90-73461-67-3).

  52. Release and Mounting of Partially Flexible Devices Inside and Around Tubes for Smart Invasive Medical Applications
    B. Mimoun; V. Henneken; R. Dekker;
    In Proc. of 12th Electronic Packaging and Technology Conference 2010 (EPTC 2010),
    Singapore, IEEE, pp. 7-12, 2010. ISBN 978-1-4244-8561-1.

  53. High-aspect-ratio through-wafer parylene beams for stretchable silicon electronics.
    T. Zoumpoulidis; M. Bartek; P. de Graaf; R. Dekker;
    Sensors and actuators a-physical,
    Volume 156, Issue 1, pp. 257-264, 2009. ISSN 0924-4247.

  54. Stretchable array of ISFET devices for applications in biomedical imagers.
    T. Zoumpoulidis; T. Prodomakis; K. Michelakis; H.W. van Zeijl; M. Bartek; C. Toumazou; R. Dekker;
    In S.C. Mukhopadhyay (Ed.), Proc. IEEE Sensors 2009 Conference,
    Christchurch, New Zealand, IEEE, pp. 7-12, 2009. ISBN 978-1-4244-5335-1).

  55. Parylene-embedded metal interconnects for stretchable silicon electronics.
    T. Zoumpoulidis; M. Bartek; R. Dekker;
    In Proc. International Conference on Electronics Packaging (ICEP 2009),
    Kyoto, Japan, JIEP, IEEE, pp. 611-615, 2009.

  56. Fabrication of Stretchable PDMS Membrane as Substrate Material for Multi-Electrode Array Devices
    R. Li; A. van Bogaard; R. Dekker;
    In Proc. of SAFE 2009,
    Veldhoven, The Netherlands, pp. 91-94, 2009.
    document

  57. Mechanical study of silicon nitride layers on thin flexible substrates under bending
    B. Mimoun; O. Gourhant; R. Dekker;
    In Proc. of 12th Workshop on Semiconductors Advances for Future Electronics and Sensors 2009 (SAFE 2009),
    Veldhoven, The Netherlands: STW (ISBN: 978-90-73461-62-8)-Best Flash Presentation Award, pp. 95-98, 2009.

  58. Biocompatible encapsulation of CMOS based chemical sensors
    T. Prodomakis; K. Michelakis; T. Zoumpoulidis; R. Dekker; C. Toumazou;
    In Proc. IEEE Sensors 2009 Conference,
    Christchurch, New Zealand, pp. 791-794, 2009.

  59. Large-area silicon electronics using stretchable metal interconnect
    S. Sosin; T. Zoumpoulidis; M. Bartek; R. Dekker;
    In Proc. 59th Electronic Components & Technology Conference (ECTC 2009),
    San Diego, CA, pp. 1059-1064, 2009.

  60. Mechanical study of silicon nitride layers on thin flexible substrates under bending
    B. Mimoun; O. Gourhant; R. Dekker;
    In 2nd International Workshop on Flexible & Stretchable Electronics 2009,
    Ghent, Belgium, 2009.
    document

  61. Front-to back-side overlay optimization after wafer bonding for 3D integration
    L. Marinier; W. van Noort; R. Pellens; B. Sutedja; R. Dekker; H. W. van Zeijl;
    In Proc. 31st International Conference on Micro- and Nano-Engineering 2005,
    Vienna, Austria, Sep. 2005.
    document

  62. A Back-Wafer Contacted Silicon-On-Glass Integrated Bipolar Process - Part I: The Conflict Electrical Versus Thermal Isolation
    L.K. Nanver; N. Nenadovic; V. d Alessandro; H. H. Schellevis; W. van Zeijl; R. Dekker; D.B. de Mooij; V. Zieren; J.W. Slotboom;
    IEEE Trans. on Electron Devices,
    Volume 51, Issue 1, pp. 42-50, Jan. 2004.

  63. Substrate Transfer Technology
    R. Dekker;
    PhD thesis, Delft University of Technology, Jun. 2004. ISBN 90-74445-61-6; Promotors: prof. J.W. Slotboom, prof. J.N. Burghartz.

  64. Substrate Transfer for RF Technologies
    R. Dekker; P.G.M. Baltus; H.G.R. Maas;
    IEEE Transactions on Electron Devices,
    Volume 50, Issue 3, pp. 747-757, Mar. 2003.

  65. Design and characterization of integrated passive elements on high ohmic silicon
    E. Valletta; J. van Beek; A. Den Dekker; N. Pulsford; H.F.F. Jos; L.C.N. de Vreede; L.K. Nanver; J.N. Burghartz;
    In 2003 IEEE MTT-S International Microwave Symposium,
    Philadelphia, PA, USA, pp. 1235 -1238, Jun. 2003.

  66. 7781af6e4ower added efficiency surface-mounted bipolar power transistors for low-voltage wireless applications
    R. Dekker; D.M.H. Hartskeer; H.G.R. Maas; F. Van Rijs; J.W. Slotboom;
    BCTM,
    pp. 191-194, 2000.

  67. Ultra-low-temperature low-ohmic contacts for SOA applications
    L.K. Nanver; H.W. van Zeijl; H. Schellevis; R.J.M. Mallee; J. Slabbekoorn; R. Dekker; J.W. Slotboom;
    In 1999 Bipolar/BiCMOS Circuits and Technology Meeting,
    Minneapolis, pp. 137-140, Sept. 1999. ISBN 0-7803-5712-4.

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