Kouchi Zhang

Publications

  1. Effects of Conformal Nanoscale Coatings on Thermal Performance of Vertically Aligned Carbon Nanotubes
    Cinzia Silvestri; Michele Riccio; René H. Poelma; Aleksandar Jovic; Bruno Morana; Sten Vollebregt; Andrea Irace; Kouchi Zhang; Pasqualina M. Sarro;
    Small,
    2018. DOI: 10.1002/smll.201800614
    document

  2. Reliability and Lifetime Assessment of Optical Materials in LED-Based Products
    Maryam Yazdan Mehr; Willem Dirk van Driel; Kouchi Zhang;
    In Solid State Lighting Reliability Part 2,
    Springer, 2018.

  3. Color shift acceleration on mid-power LED packages
    Guangjun Lu; Driel, W.D. van; Xuejun Fan; Jiajie Fan; Cheng Qian; Kouchi Zhang;
    Microelectronics Reliability,
    Volume 78, Issue Supplement C, pp. 294 -- 298, 11 2017. DOI: 10.1016/j.microrel.2017.09.014
    Keywords: ... Color shift, Mid-power LED package, Temperature stress, Current stress, Humidity stress.

  4. Reliability and diffusion-controlled through thickness oxidation of optical materials in LED-based products
    Yazdan Mehr, M.; M.R. Toroghinejad; F. Karimzadeh; van Driel, W.D.; Kouchi Zhang;
    Microelectronics Reliability,
    Volume 78, pp. 143--147, 2017. DOI: 10.1016/j.microrel.2017.08.014
    Keywords: ... BPA-PC, LED-based products, Optics, Oxidation, Yellowing.

  5. Effects of Graphene Monolayer Coating on the Optical Performance of Remote Phosphors
    Maryam Yazdan Mehr; S. Vollebregt; W. D. van Driel; Kouchi Zhang;
    Journal of Electronic Materials,
    Volume 46, Issue 10, pp. 5866--5872, 2017. DOI: 10.1007/s11664-017-5592-8
    Keywords: ... graphene, Light-emitting diode, reliability, remote phosphor.

  6. Microstructure, hardness, and shear behavior of the as-soldered SnBi–SAC composite solder pastes
    Y Liu; H Fu; H Zhang; F Sun; X Wang; Kouchi Zhang;
    Journal of Materials Science: Materials in Electronics,
    Volume 28, Issue 24, pp. 19113-19120, 2017.

  7. Phosphor–silicone interaction effects in high power white light emitting diode packages
    J Fan; M Zhang; X Luo; C Qian; X Fan; A Ji; Kouchi Zhang;
    Journal of Materials Science: Materials in Electronics,
    Volume 28, Issue 23, pp. 17557-17569, 2017.

  8. Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component
    H Tang; H Ye; CKY Wong; SYY Leung; J Fan; X Chen; X Fan; Kouchi Zhang;
    Microelectronics Reliability,
    Volume 78, pp. 197-204, 2017.

  9. Photometric and Colorimetric Assessment of LED Chip Scale Packages by Using a Step-Stress Accelerated Degradation Test (SSADT) Method
    C Qian; J Fan; J Fang; C Yu; Y Ren; X Fan; Kouchi Zhang;
    Materials,
    Volume 10, Issue 10, pp. 1181, 2017.

  10. Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package
    F Hou; T Lin; L Cao; F Liu; J Li; X Fan; Kouchi Zhang;
    IEEE Transactions on Components, Packaging and Manufacturing Technology,
    Volume 7, Issue 10, pp. 1721-1728, 2017.

  11. Silicon-based multi-functional wafer-level-package for LEDs in 7-mask BiCMOS process
    Zahra Kolahdouz; T Ma; H Abdy; M Kolahdouz; H van Zeijl; Kouchi Zhang;
    Sensors and Actuators A: Physical,
    Volume 263, pp. 622-632, 2017.

  12. Sensitive and Reversible Detection of Methanol and Water Vapor by In Situ Electrochemically Grown CuBTC MOFs on Interdigitated Electrodes
    Sumit Sachdeva; Manjunath R. Venkatesh; Brahim El Mansouri; Jia Wei; Andre Bossche; Freek Kapteijn; Kouchi Zhang; Jorge Gascon; Louis C. P. M. de Smet; Ernst J. R. Sudhölter;
    Small,
    Volume 13, Issue 29, pp. 1604150, 2017.

  13. Modeling nonlinear moisture diffusion in inhomogeneous media
    L Chen; J Zhou; H Chu; Kouchi Zhang; X Fan;
    Microelectronics Reliability,
    Volume 75, pp. 162-170, 2017.

  14. Humidity sensor based on the ionic polymer metal composite
    E Esmaeli; M Ganjian; H Rastegar; M Kolahdouz; Z Kolahdouz; Kouchi Zhang;
    Sensors and Actuators B: Chemical,
    Volume 247, pp. 498-504, 2017.

  15. First-Principles Study of Nitric Oxide Sensor Based on Blue Phosphorus Monolayer
    HC Luo; RS Meng; H Gao; X Sun; J Xiao; HY Ye; Kouchi Zhang; XP Chen;
    IEEE Electron Device Letters,
    Volume 38, Issue 8, pp. 1139-1142, 2017.

  16. Color shift failure prediction for phosphor-converted white LEDs by modeling features of spectral power distribution with a nonlinear filter approach
    J Fan; MG Mohamed; C Qian; X Fan; Kouchi Zhang; M Pecht;
    Materials 10,
    Volume 7, pp. 819, 2017.

  17. Hybrid plasmonics slot THz waveguide for subwavelength field confinement and crosstalk between two waveguides
    J Xiao; QQ Wei; DG Yang; P Zhang; N He; Kouchi Zhang; XP Chen;
    IEEE Journal of Selected Topics in Quantum Electronics,
    Volume 23, Issue 4, 2017.

  18. Nitrogen Dioxide Gas Sensor Based on Monolayer SnS: A First-Principle Study
    FF Hu; HY Tang; CJ Tan; HY Ye; XP Chen; Kouchi Zhang;
    IEEE Electron Device Letters,
    Volume 38, Issue 7, pp. 983-986, 2017.

  19. Thermal/luminescence characterization and degradation mechanism analysis on phosphor-converted white LED chip scale packages
    J Fan; C Yu; C Qian; X Fan; Kouchi Zhang;
    Microelectronics Reliability,
    Volume 74, pp. 179-185, 2017.

  20. Studies of the light output properties for a GaN based blue LED using an electro-optical simulation method
    C Qian; Y Li; J Fan; X Fan; J Fu; L Zhao; Kouchi Zhang;
    Microelectronics Reliability,
    Volume 74, pp. 173-178, 2017.

  21. A Reliability Prediction for Integrated LED Lamp With Electrolytic Capacitor-Free Driver
    Bo Sun; X Fan; L Li; H Ye; W van Driel; Kouchi Zhang;
    IEEE Transactions on Components and Packaging and Manufacturing Technology,
    Volume 7, Issue 7, pp. 1081-1088, 2017.

  22. A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation
    Bo Sun; X Fan; H Ye; J Fan; C Qian; W van Driel; Kouchi Zhang;
    Reliability Engineering & System Safety,
    Volume 163, pp. 14-21, 2017.

  23. Sulfur Dioxide and Nitrogen Dioxide Gas Sensor Based on Arsenene: A First-Principle Study
    XP Chen; LM Wang; X Sun; RS Meng; J Xiao; HY Ye; Kouchi Zhang;
    IEEE Electron Device Letters,
    Volume 38, Issue 5, pp. 661-664, 2017.

  24. Integrated virtual impactor enabled PM 2.5 sensor
    Mingzhi Dong; E Iervolino; F Santagata; G Zhang; Kouchi Zhang;
    IEEE Sensors Journal,
    Volume 17, Issue 9, pp. 2814-2821, 2017.

  25. Monolithically integrated light feedback control circuit for blue/UV LED smart package
    Zahra K Esfahani; M Tohidian; H van Zeijl; M Kolahdouz; Kouchi Zhang;
    IEEE Photonics Journal,
    Volume 9, Issue 2, pp. 1-13, 2017.

  26. Identification and robust control of the nonlinear photoelectrothermal dynamics of LED systems
    J Dong; Kouchi Zhang;
    IEEE Transactions on Industrial Electronics,
    Volume 64, Issue 3, pp. 2215-2225, 2017.

  27. Color shift modeling of light-emitting diode lamps in step-loaded stress testing
    M Cai; D Yang; J Huang; M Zhang; X Chen; C Liang; S Koh; Kouchi Zhang;
    IEEE Photonics Journal,
    Volume 9, Issue 1, pp. 1-14, 2017.

  28. Numerical Thermal Analysis and Optimization of Multi-Chip LED Module Using Response Surface Methodology and Genetic Algorithm
    HY Tang; HY Ye; XP Chen; C Qian; XJ Fan; Kouchi Zhang;
    IEEE Access,
    Volume 5, pp. 16459-16468, 2017.

  29. Prediction of lumen depreciation and color shift for phosphor-converted white light-emitting diodes based on a spectral power distribution analysis method
    C Qian; J Fan; X Fan; Kouchi Zhang;
    IEEE Access,
    Volume 5, pp. 24054-24061, 2017.

  30. Solid State Lighting Reliability Part 2: Components to Systems
    WD Van Driel; X Fan; Kouchi Zhang (Ed.);
    Springer, , 2017.

  31. An AlAs/germanene heterostructure with outstanding tunability of electronic properties
    C Tan; Q Yang; H Ye; X Chen; Kouchi Zhang;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  32. Smart Systems Integration in the era of Solid State Lighting
    Kouchi Zhang; H. van Zeijl; W.D. van Driel; R. Poelma; Z.K. Esfahani; M. R.Venkatesh; L. Middelburg; B. El Mansouri;
    In Smart System Integration conference (SSI),
    2017.

  33. Horizontally aligned carbon nanotube scaffolds for freestanding structures with enhanced conductivity
    Cinzia Silvestri; Federico Marciano; Bruno Morana; Violeta Podranovic; Sten Vollebregt; Kouchi Zhang; Pasqualina M Sarro;
    In Micro Electro Mechanical Systems (MEMS), 2017 IEEE 30th International Conference on,
    pp. 266-269, 2017.

  34. Luminous flux modeling for high power LED automotive headlamp module
    C Yu; J Fan; C Qian; X Fan; Kouchi Zhang;
    In Electronic Packaging Technology (ICEPT), 2017 18th International Conference on,
    2017.

  35. Optimization of reflow soldering process for white LED chip-scale-packages on substrate
    C Jiang; W Guo; J Fan; C Qian; X Fan; Kouchi Zhang;
    In Electronic Packaging Technology (ICEPT), 2017 18th International Conference on,
    2017.

  36. Pt-AlGaN/GaN HEMT-Sensor for Hydrogen Sulfide (H2S) Detection
    R Sokolovskij; E Iervolino; C Zhao; F Santagata; F Wang; H Yu; PM Sarro; Kouchi Zhang;
    In Proceedings of Eurosensors,
    pp. 463, 2017.

  37. Condition monitoring algorithm for piezoresistive silicon-based stress sensor data obtained from electronic control units
    A Prisacaru; A Palczynska; PJ Gromala; B Han; Kouchi Zhang;
    In Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th,
    2017.

  38. A PoF and statistics combined reliability prediction for LED arrays in lamps
    B Sun; X Fan; J Fan; C Qian; Kouchi Zhang;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  39. Electrical and optical properties of NO and H2S adsorption on Arsenic Phosphorus
    Y Zhang; K Zheng; X Chen; Kouchi Zhang; C Tan; Q Yang; J Jiang; H Ye;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  40. SnS monolayer as gas sensors: Insights from a first-principles investigation
    F Hu; C Tan; H Ye; X Chen; Kouchi Zhang;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  41. In-situ characterization of moisture absorption and hygroscopic swelling of silicone/phosphor composite film and epoxy mold compound in LED packaging
    I Khalilullah; T Reza; L Chen; AKMMH Mazumder; J Fan; C Qian; Kouchi Zhang; X Fan;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  42. First principle design of CdS/germanene heterostructures with tunable electronic and transport properties
    K Zheng; H Ye; Kouchi Zhang; Y Zhang; L Liu; J Jiang; Q Yang; C Tan; X Chen;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  43. The intriguing electronic and optical properties modulation in blue phosphorene/g-III-nitrides heterostructures
    Q Yang; C Tan; H Ye; X Chen; Kouchi Zhang;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  44. Adsorption of gases on monolayer GeSe: A first principle study
    L Liu; Q Yang; H Ye; X Chen; Kouchi Zhang;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  45. Luminescence mechanism analysis on high power tunable color temperature Chip-on-Board white LED modules
    J Fan; C Xie; C Qian; X Fan; Kouchi Zhang;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  46. Effects of phosphor dispersion on optical characteristics of LED Chip Scale Package LEDs
    C Qian; LL Luo; JJ Fan; XQ Li; XJ Fan; Kouchi Zhang;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  47. Prognostics and health monitoring of electronic system: A review
    A Prisacaru; PJ Gromala; MB Jeronimo; B Han; Kouchi Zhang;
    In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
    2017.

  48. A CMOS-Compatible Hybrid Plasmonic Slot Waveguide With Enhanced Field Confinement
    Jing Xiao; Qi-Qin Wei; Dao-Guo Yang; Ping Zhang; Ning He; Kouchi Zhang;
    IEEE Electron Device Letters,
    Volume 37, Issue 4, 2016.

  49. An accelerated test method of luminous flux depreciation for LED luminaires and lamps
    C. Qian; X.J.Fan; J.J.Fan; C.A.Yuan; Kouchi Zhang;
    Reliability Engineering and System Safety,
    Volume 147, pp. 84-92, 2016.

  50. PoF-Simulation Assisted Reliability Prediction for Electrolytic Capacitor in LED Drivers
    Bo Sun; Xuejun Fan; Cheng Qian; Kouchi Zhang;
    IEEE Transactions on Industrial Electronics,
    pp. 99, 2016.

  51. Degradation Mechanism Decoupling of Mid-Power White-Light LEDs by SPD Simulation
    Jianlin Huang; D. S. Golubović; S. Koh; D. Yang; X. Li; X. Fan; Kouchi Zhang;
    IEEE Transactions on Electron Devices,
    Volume 63, pp. 2807-2814, 2016.

  52. Silicon microfabrication based particulate matter sensor
    Mingzhi Dong; Elina Iervolino; Fabio Santagata; Kouchi Zhang;
    Sensors and Actuators A: Physical,
    Volume 247, pp. 115-124, 2016.

  53. Output blue light evaluation for phosphor based smart white LED wafer level packages
    Z. Kolahdouz; A. Rostamian; M. Kolahdouz; T. Ma; H. van Zeijl; Kouchi Zhang;
    Optics Express,
    Volume 24, Issue 4, pp. 174-177, 2016.

  54. Thermally induced oxidative growth of copper oxide nanowire on dendritic micropowder and reductive conversion to copper nanowire
    A. M. Gheitaghy; S.H. Tabatabaie; H. Saffari; Kouchi Zhang;
    Micro and Nano Letters,
    Volume 11, Issue 8, pp. 412, 2016.

  55. Thermal characterization of carbon nanotube foam using MEMS microhotplates and thermographic analysis
    Cinzia Silvestri; Michele Riccio; Rene Poelma; Bruno Morana; Sten Vollebregt; Fabio Santagata; Andrea Irace; Kouchi Zhang; Pasqualina M. Sarro;
    Nanoscale,
    Volume 8, pp. 8266-8275, 2016.
    document

  56. Stretchable Binary Fresnel Lens for Focus Tuning
    Xueming Li; Lei Wei; Ren H. Poelma; Sten Vollebregt; Jia Wei; Hendrik Paul Urbach; Pasqualina M. Sarro; Kouchi Zhang;
    Scientific Reports,
    Volume 6, pp. 25348, 2016.

  57. Effects of Nanostructure and Coating on the Mechanics of Carbon Nanotube Arrays
    R. H. Poelma; X. J. Fan; Z. Y. Hu; G. van Tendeloo; H.W. van Zeijl; Kouchi Zhang;
    Advanced Functional Materials,
    Volume 26, Issue 8, pp. 1233-1242, 2016.

  58. A review of small heat pipes for electronics
    Xianping Chen; Huaiyu Ye; Xuejun Fan; Tianling Ren; Kouchi Zhang;
    Applied Thermal Engineering,
    Volume 96, pp. 1-17, 2016.

  59. A Systematic Approach for Reliability Assessment of Electrolytic Capacitor-Free LED Drivers
    Bo Sun; Xuejun Fan; van Driel, Willem; Kouchi Zhang;
    United States: IEEE, , pp. 1--5, 4 2016. DOI: 10.1109/EuroSimE.2016.7463387
    Keywords: ... Reliability, MOSFET, Electrolytic Capacitor-Free LED Driver.

  60. Lumen Decay Prediction in LED Lamps
    Bo Sun; Xuejun Fan; van Driel, Willem; Thomas Michel; Jiang Zhou; Kouchi Zhang;
    United States: IEEE, , pp. 1--5, 4 2016. DOI: 10.1109/EuroSimE.2016.7463391
    Keywords: ... Reliability, LED Lamp, Lumen Decay Prediction.

  61. Metallic Nanoparticle Based Interconnect for Heterogeneous 3D Integration
    Zeijl, H. W. V.; Y. Carisey; A. Damian; R. H. Poelma; A. Zinn; Kouchi Zhang;
    In IEEE 66th Electronic Components and Technology Conference (ECTC),
    2016.
    document

  62. Tailoring material properties for 3D microfabrication: In-situ experimentation and multi-scale modelling
    Poelma, R. H.; X. J. Fan; E. Schlangen; H. W. v. Zeijl; Kouchi Zhang;
    In 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2016.
    document

  63. 3D interconnect technology based on low temperature copper nanoparticle sintering
    Boyao Zhang; Y. C. P. Carisey; A. Damian; R. H. Poelma; Kouchi Zhang; H. W. v. Zeijl;
    In 17th International Conference on Electronic Packaging Technology (ICEPT),
    2016.
    document

  64. Precision recess of AlGaN/GaN with controllable etching rate using ICP-RIE oxidation and wet etching
    R. Sokolovskij; J. Sun; F. Santagata; E. Iervolino; S. Li; G.Y. Zhang; P.M.Sarro; Kouchi Zhang;
    In Procedia Engineering: Proceedings of the 30th anniversary Eurosensors Conference,
    pp. 1094-1097, 2016.

  65. Solving the Nonlinear Heat Conduction in a Spherical Coordinate with Electrical Simulation
    A. M. Gheitaghy; H. Saffari; Kouchi Zhang;
    In 18th International Conference on Thermal Engineering,
    2016.

  66. Ab Initio Study of Temperature, Humidity, and Covalent Functionalization-Induced Bandgap Change of Single-Walled Carbon Nanotubes
    Xian-Ping Chen; Ning Yang; Jun-Ke Jiang; Qiu-Hua Liang; Dao-Guo Yang; Kouchi Zhang;
    IEEE Electron Device Letters,
    Volume 36, Issue 6, 2015.

  67. Optimal Design of Life Testing for High Brightness White LEDs Using the Six Sigma DMAIC Approach
    Chuen Yung; Xuejun Fan; Kouchi Zhang; Michael Pecht;
    IEEE Transactions on Device and Materials Reliability,
    Volume 15, Issue 4, pp. 576-587, 2015.

  68. Optimization of LED light spectrum to enhance colorfulness of illuminated objects with white light constraints
    H. Wu; J. Dong; G. Qi; Kouchi Zhang;
    Journal of the Optical Society of America A,
    Volume 32, Issue 7, pp. 1262-1270, 2015.

  69. Design and fabrication of a foldable 3D silicon based package for solid state lighting applications
    R. Sokolovskij; Pan Liu; H.W. van Zeijl; B. Mimoun; Kouchi Zhang;
    Journal of Micromechanics and Microengineering,
    Volume 25, Issue 5, pp. 055017, 2015.

  70. Sequential microwave-assisted ultra-fast ZnO nanorod growth on optimized sol–gel seedlayers
    R. Soleimanzadeh; M. S. S. Mousavi; A. Mehrfar; Z. Kolahdouz; M. Kolahdouz; Kouchi Zhang;
    Journal of Crystal Growth,
    Volume 426, pp. 228-233, 2015.

  71. Light-Emitting n-ZnO Nanotube/n+-GaAs Heterostructures Processed at Low Temperatures
    F. Karegar; M. Kolahdouz; F. D. Nayeri; R. Soleimanzadeh; M. Hosseini; Z Kolahdouz; Kouchi Zhang;
    IEEE Photonics Technology Letters,
    Volume 27, Issue 13, pp. 1430-1433, 2015.

  72. Rapid degradation of mid-power white-light LEDs in saturated moisture conditions
    Jianlin Huang, D. S. Golubovic, S. Koh, D. Yang, X. Li, X. Fan,; Kouchi Zhang;
    IEEE Transactions on Device and Materials Reliability,
    Volume 15, Issue 4, pp. 478-485, 2015.

  73. Optical degradation mechanisms of mid-power white-light LEDs in LM-80-08 tests
    Jianlin Huang, D. S. Golubović, S. Koh, D. Yang, X. Li, X. Fan,; Kouchi Zhang;
    Microelectronics Reliability,
    Volume 55, Issue 2654-2662, 2015.

  74. Degradation modeling of mid-power white-light LEDs by using Wiener process
    Jianlin Huang; D. S. Golubović; S. Koh; D. Yang; X. Li; X. Fan; Kouchi Zhang;
    Optics Express,
    Volume 23, pp. A966-A978, 2015.

  75. Degradation Mechanisms of Mid-power White-light LEDs under High Temperature-Humidity Conditions
    Jianlin Huang; D.S. Golubović; S. Koh; D. Yang; X. Li; X. Fan; Kouchi Zhang;
    IEEE Transactions on Device and Materials Reliability,
    Volume 15, Issue 2, pp. 220-228, 2015.

  76. Highly selective and responsive ultra-violet detection using an improved phototransistor
    R. Soleimanzadeh; M. Kolahdouz; M. A. Charsooghi; Z. Kolahdouz; Kouchi Zhang;
    Applied Physics Letters,
    Volume 106, Issue 23, pp. 231102, 2015.

  77. Degradation of Microcellular PET Reflective Materials Used in LED-based Products
    Guangjun Lu; W.D. van Driel; Xuejun Fan; M. Yazdan Mehr; Jiajie Fan; K.M.B. Jansen; Kouchi Zhang;
    Optical Materials,
    Volume 49, pp. 79-84, 2015.

  78. 3D system-in-package design using stacked silicon submount technology
    Mingzhi Dong; Fabio Santagata; Robert Sokolovskij; Jia Wei; Cadmus Yuan; Kouchi Zhang;
    Microelectronics International,
    Volume 32, Issue 2, pp. 63-72, 2015.

  79. Color shift investigations for LED secondary optical designs: Comparison between BPA-PC and PMMA
    Guangjun Lu; M. Yazdan Mehr; W.D. van Driel; Xuejun Fan; Jiajie Fan; K.M.B. Jansen; Kouchi Zhang;
    Optical Materials,
    Volume 45, pp. 37-41, 2015.

  80. Mechanics of graphene and carbon nanotubes under uniaxial compression and tension
    R. H. Poelma; Kouchi Zhang;
    In Molecular Modeling and Multiscaling Issues for Electronic Materials Applications,
    Springer, 2015.

  81. Modelling of Carbon Nanotube Arrays with Analytical and Numerical Methods
    X. J. Fan; R. H. Poelma; L. Chen; Kouchi Zhang;
    In ASME International Mechanical Engineering Congress and Exposition,
    2015.

  82. Tunable binary fresnel lens based on stretchable PDMS/CNT compsite
    Xueming Li; L. Wei; S. Vollebregt; R. Poelma; Y. Shen; Jia Wei; P. Urbach; P.M. Sarro; Kouchi Zhang;
    In Transducers,
    pp. 2041-2044, 2015.

  83. Surface aspects of discolouration in Bisphenol A Polycarbonate (BPA-PC), used as lens in LED-based products
    Maryam Yazdan Mehr; W. D. van Driel; H. Udono; Kouchi Zhang;
    Optical Materials,
    Volume 37, pp. 155-159, 2014.

  84. Electrical-thermal-luminous-chromatic model of phosphor-converted white light-emitting diodes
    Huaiyu Ye; Sau Wee Koh; Cadmus Yuan; Henk van Zeijl; Alexander W.J. Gielen; Shi-Wei Ricky Lee; Kouchi Zhang;
    Applied Thermal Engineering,
    Volume 63, Issue 2, pp. 588-597, 2014.

  85. Thermal and mechanical effects of voids within flip chip soldering in LED packages
    Yang Liu; Stanley Y.Y. Leung; Jia Zhao; Cell K.Y. Wong; Cadmus A. Yuan; Kouchi Zhang; Fenglian Sun; Liangliang Luo;
    Microelectronics Reliability,
    Volume 54, Issue 9-10, pp. 2028-2033, 2014.

  86. Tailoring the Mechanical Properties of High-Aspect-Ratio Carbon Nanotube Arrays using Amorphous Silicon Carbide Coatings
    Poelma, RH; Morana, Bruno; Vollebregt, Sten; Schlangen, Erik; van Zeijl, HW; Fan, Xuejun; Zhang, Kouchi;
    Advanced Functional Materials,
    Volume 24, Issue 36, pp. 5737-5744, 2014.
    document

  87. Fabrication and application of temperature triggered MEMS switch for active cooling control in solid state lighting system
    Huaiyu Ye; Jai Wei; van Zeijl, HW; Sarro, PM; Kouchi Zhang;
    Microelectronics Reliability,
    Volume 54, Issue 6-7, pp. 1338-1343, 2014.

  88. A polymer based miniature loop heat pipe with silicon substrate and temperature sensors for high brightness light-emitting
    Huaiyu Ye; Sokolovskij, R; van Zeijl, HW; Gielen, AWJ; Kouchi Zhang;
    Microelectronics Reliability,
    Volume 54, Issue 6-7, pp. 1355-1362, 2014.

  89. Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products
    Maryam Yazdan Mehr; van Driel, WD; Jansen, KMB; Deeben, P; Kouchi Zhang;
    Microelectronics Reliability,
    Volume 54, Issue 1, pp. 138-142, 2014.

  90. Reliability and optical properties of LED lens plates under high temperature stress
    Maryam Yazdan Mehr; van Driel, WD; Koh, SW; Kouchi Zhang;
    Microelectronics Reliability,
    2014.

  91. Accelerated life time testing and optical degradation of remote phosphor plates
    Maryam Yazdan Mehr; van Driel, WD; Kouchi Zhang;
    Microelectronics Reliability,
    Volume 54, Issue 8, pp. 1544-1548, 2014.

  92. Multi-physics reliability simulation for solid state lighting drivers
    Tarashioon, S; van Driel, WD; Kouchi Zhang;
    Microelectronics Reliability,
    Volume 54, Issue 6-7, pp. 1212-1222, 2014.

  93. Fracture toughness of Cu-EMC interfaces in pressurized steam
    Sadeghinia, M; Jansen, KMB amd Ernst, LJ; Pape, H; Maus, I; van Driel, WD; Kouchi Zhang;
    International Journal of Adhesion and Adhesives,
    Volume 49, pp. 73-79, 2014.

  94. Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging
    Yang Liu; Joost Meerwijk; Liangliang Luo; Honglin Zhang; Fenglian Sun; Cadmus A. Yuan; Kouchi Zhang;
    Journal of Materials Science: Materials in Electronics,
    Volume 25, Issue 11, pp. 4954-4959, 2014.

  95. Establishment of the Mesoscale Parameters for Separation: A Nonequilibrium Molecular Dynamics Model
    Cell K. Y. Wong; S. Y. Y. Leung; R. H. Poelma; K. M. B. Jansen; C. C. A. Yuan; W. D. van Driel; Kouchi Zhang;
    In Molecular Modeling and Multiscaling Issues for Electronic Material Applications,
    Springer, 2014.

  96. Correlation of activation energy between LEDs and luminaires in the lumen depreciation test
    Guangjun Lu; Yuan, C; Fan, X; Kouchi Zhang;
    In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
    pp. 1-3, 2014.

  97. Reliability of LED-based Products is a Matter of Balancing Temperatures
    Maryam Yazdan Mehr; W.D. van Driel; Kouchi Zhang;
    In Therminic Conference,
    2014.

  98. Vertical Interconnect technology for Wafer-Level-Packaging and 3D Integration
    H. W. v. Zeijl; R. H. Poelma; L. Wang; E. Boschman; F. Boschman; Kouchi Zhang;
    In nanoFIS 2014 - Functional Integrated nanoSystems,,
    2014.

  99. High Accelerated Optical Remote Phosphor Aging Studies for LED Luminaire Applications
    W. D. v. Driel; Maryam Yazdan Mehr; Kouchi Zhang;
    In 11th China SSL conference,
    2014.

  100. Blue Selective Photodiodes for Optical Feedback in LED Wafer Level Packages
    Z. Kolahdouz; A. Rostamian; M. Kolahdouz; T. Ma; H. V. Zeijl; Kouchi Zhang;
    In Solid-State Device Research Conference (ESSDERC), 2014 Proceedings of the European,
    pp. 174-177, 2014.

  101. A novel design of heatsink-less LED base fluorescent lamp retrofit
    Y. L. Jia Zhao; Hongyu Tang; Stanley Y Y Leung; Cadmus C A Yuan; Kouchi Zhang;
    In ICEPT2014,
    2014.

  102. Adapting LED lighting to compensate the influence of ambient light on the light color
    J.D.H. Wu; Kouchi Zhang;
    In 11th China SSL conference,
    2014.

  103. Miniaturized particulate matter sensor for portable air quality monitoring devices
    Xueming Li; E Iervolino; F Santagata; Jia Wei; Cadmus Yuan; PM Sarro; Kouchi Zhang;
    In IEEE Sensors,
    pp. 2151-2154, 2014.

  104. Electro-thermal simulation and characterization of vertically aligned CNTs directly grown on a suspended microhoplate for thermal management applications
    C. Silvestri; P. Piacciafoco; B. Morana; F. Santagata; Kouchi Zhang; P.M. Sarro;
    In IEEE Sensors,
    pp. 827-830, 2014.
    document

  105. Colour shift in remote phosphor based LED products
    Maryam Yazdan Mehr; Driel, WD van; Kouchi Zhang;
    In Proceedings - 64th Electronic Components and Technology Conference,
    pp. 1477-1481, 2014.

  106. Influences of viscoelasticity of polybutylene terephthalate (PBT) on the thermal interface contact of LED spotlight module
    Tang, H; Yu, Y; Jia, M; Leung, SYY; Qian, C; Cadmus Yuan; Zhou, X; Kouchi Zhang;
    In Proceedings of the 15th International Conference on Electronic Packaging Technology,
    pp. 1198-1201, 2014.

  107. Investigation of lumen degradation mechanisms of mid-power LED by HAST
    Jianlin Huang; Koh, SW; Xueming Li; Kouchi Zhang;
    In Proceedings of the 15th International Conference on Electronic Packaging Technology,
    pp. 1437-1441, 2014.

  108. A model in predicting color of LED packages with different phosphor layer dimensions
    Wong, CKY; Leung, SYY; Xiong, YJ; Yuan, CCA; Kouchi Zhang;
    In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
    pp. 1-5, 2014.

  109. Reliability and accelerated test methods for plastic materials in LED-based products
    Maryam Yazdan Mehr; van Driel, WD; Kouchi Zhang;
    In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
    pp. 1-5, 2014.

  110. Modeling and simulation of monolithic integration of rectifiers for solid state lighting applications
    Venkatesh, MR; Liu, P; van Zeijl, HW; Kouchi Zhang;
    In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
    pp. 1-6, 2014.

  111. Thermal performance of embedded heat pipe in high power density LED streetlight module
    Tang, H; Zhao, J; Li, B; Leung, SYY; Yuan, CCA; Kouchi Zhang;
    In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
    pp. 1-6, 2014.

  112. A lifetime prediction method for Solid State Lighting power converters based on SPICE models and finite element thermal simulations
    Bo Sun; Fan, X; Zhao, L; Yuan, CA; Koh, SW; Kouchi Zhang;
    In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
    pp. 1-4, 2014.

  113. CNT bundles growth on microhotplates for direct measurement of their thermal properties
    C. Silvestri; B. Morana; G. Fiorentino; S. Vollebregt; G. Pandraud; F. Santagata; Kouchi Zhang; P.M. Sarro;
    In 27th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2014),
    San Francisco, USA, Jan. 2014.
    document

  114. High aspect ratio lithography for litho-defined wire bonding
    Esfahani, ZK; van Zeijl, HW; Kouchi Zhang;
    In Proceedings - 64th Electronic Components and Technology Conference,
    pp. 1556-1561, 2014.

  115. Investigation of color shift of LEDs-based lighting products
    Koh, SW; Huaiyu Ye; Maryam Yazdan Mehr; Jia Wei; van Driel, WD; Zhao, LB; Kouchi Zhang;
    In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
    pp. 1-5, 2014.

  116. Novel system-in-package design and packaging solution for solid state lighting systems
    Mingzhi Dong; Santagata, F; Jia Wei; Yuan, C; Kouchi Zhang;
    In Proceedings - 64th Electronic Components and Technology Conference,
    pp. 1192-1197, 2014.

  117. Numerical modeling of flexible actuator for dynamic lighting
    Teng Ma; Xueming Li; Jia Wei; Kouchi Zhang; P. M. Sarro;
    In 15th International Conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems,
    2014.

  118. Through-polymer via (TPV) and method to manufacture such a via
    H.W. van Zeijl; R.H. Poelma; Kouchi Zhang;
    Dutch patent, 2014.

  119. Thermal Analysis of Remote Phosphor in LED Modules
    Mingzhi Dong; Jia Wei; Huaiyu Ye; Cadmus Yuan; Kouchi Zhang;
    Journal of Semiconductors,
    Volume 34, Issue 5, pp. 053007-1-3, 2013.

  120. Photodegradation of bisphenol A polycarbonate under blue light radiation and its effect on optical properties
    Maryam Yazdan Mehr; W. D. van Driel; K. M. B. Jansen; P. Deeben; M. Boutelje; Kouchi Zhang;
    Optical Materials,
    Volume 35, pp. 504-508, 2013.

  121. Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems
    F. Santagata; C. Farriciello; G. Fiorentino; H.W. van Zeijl; C. Silvestri; Kouchi Zhang; P.M. Sarro;
    Journal of Micromechanics and Microengineering,
    2013.

  122. Cause analysis on highly depreciated indoor LED product in CSA020
    Guangjun Lu; Yuan C; Tang H; Wong C; Fan XJ; Kouchi Zhang;
    In Proceedings of China Solid State Lighting Forum,
    2013.

  123. Validation of the methodology of lumen depreciation acceleration of LED lighting
    Guangjun Lu; Yuan C; Sun B; Li B; Fan XJ; Kouchi Zhang;
    In Proceedings of China Solid State Lighting Forum,
    2013.

  124. Thermal Analysis for Silicon-based Integration of LED Systems
    Mingzhi Dong; Fabio Santagata; Jia Wei; Cadmus Yuan; Kouchi Zhang;
    In 10th China International Forum on Solid State Lighting,
    2013.

  125. Carbon Nanotube based heat-sink for solid state lighting
    F. Santagata; G. Almanno; S. Vollebregt; C Silvestri; Kouchi Zhang; P.M. Sarro;
    In 8th IEEE Int. Conf. Nano/Micro Engineered and Molecular Systems (NEMS),
    pp. 1214-1217, Apr 2013. DOI 10.1109/NEMS.2013.6559937.

  126. Molecular modeling of protonic acid doping of emeraldine base polyaniline for chemical sensors
    X.P. Chen; C. Yuan; C.K.Y. Wong; H. Ye; S.Y.Y. Leung; Kouchi Zhang;
    Sensors and Actuators B: Chemical,
    Volume 174, pp. 210-216., 2012. DOI 10.1016/j.snb.2012.08.042.

  127. An approach to Design for Reliability in solid state lighting systems at high temperatures
    S. Tarashioon; A. Baiano; H. van Zeijl; C. Guo; S.W. Koh; W.D. van Driel; Kouchi Zhang;
    Microelectronics Reliability,
    Volume 52, Issue 5, pp. 783-793, May 2012. DOI 10.1016/j.microrel.2011.06.029.

  128. Effects of single vacancy defect position on the stability of carbon nanotubes
    R.H. Poelma; H. Sadeghian; S. Koh; Kouchi Zhang;
    Microelectronics Reliability Journal,
    Volume 52, Issue 7, pp. 1279-1284, Jul. 2012. DOI 10.1016/j.microrel.2012.03.015.

  129. Mechanical characterization of individual polycrystalline carbon tubes for use in electrical nano-interconnects
    A. Khiat; R.H. Poelma; Kouchi Zhang; F. Heuck; F.D. Tichelaar; M. Sarno; P. Ciambelli; S. Fontorbes; L. Arurault; U. Staufer;
    Microelectronic Engineering,
    Volume 98, pp. 317-320, Oct. 2012. DOI 10.1016/j.mee.2012.07.087.

  130. Establishment of the coarse grained parameters for epoxy-copper interfacial separation
    C.K.Y. Wong; S.Y.Y. Leung; R.H. Poelma; K.M.B. Jansen; C.C.A. Yuan; W.D. van Driel; Kouchi Zhang;
    Journal of Applied Physics,
    Volume 111, Issue 9, pp. 094906/1-094906, May 2012. DOI 10.1063/1.4712060.

  131. Analytical large deflection method for carbon nanotube youngs modulus determination
    N. Tolou; A. Khiat; Kouchi Zhang; J.L. Herder;
    International Journal of Nonlinear Sciences and Numerical Simulation,
    Volume 12, Issue 1-8, pp. 51-58, Feb. 2012. DOI 10.1515/ijnsns.2011.300.

  132. Diagnosing lumen depreciation in LED lighting systems: An estimation approach
    J. Dong; A. Pandharipande; W. van Driel; Kouchi Zhang;
    IEEE Transactions on Signal Processing,
    Volume 60, Issue 7, pp. 3796-3808, Jul. 2012. DOI 10.1109/TSP.2012.2192114.

  133. Semi empirical low cycle fatigue crack growth analysis of nanostructure chip-to-package copper interconnect using molecular simulation
    S. Koh; A. Saxena; W.D. van Driel; Kouchi Zhang; R. Tummala;
    In Molecular Modeling and Multiscaling for Electronic Material Applications,
    Springer, 2012. DOI 10.1007/978-1-4614-1728-6_5.

  134. The mechanical properties modeling of nano-scale materials by molecular dynamics
    C. Yuan; W.D. Driel; R.H Poelma; Kouchi Zhang;
    In Molecular Modeling and Multiscaling for Electronic Material Applications,
    Springer, 2012. DOI 10.1007/978-1-4614-1728-6_8.

  135. Single-mask fabrication of temperature triggered MEMS switch for cooling control in SSL system
    J. Wei; H. Ye; H.W. van Zeijl; P.M Sarro; Kouchi Zhang;
    In R. Walczak; J. Dziuban (Ed.), Proc. Eurosensors XXVI,
    Krakow, Poland, Procedia Engineering, pp. 849-852, Sep 2012. DOI 10.1016/j.proeng.2012.09.280.

  136. Simulation and qualification of a system-in-package (SiP) based solid state lighting (SSL) module
    D.M. Farley; F. Boschman; J.E. Bullema; A.W.J. Gielen; P. Hesen; J.P.H.M. Krugers; F. Swartjes; H.W. van Zeijl; Kouchi Zhang;
    In Proc. 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
    Cascais, Portugal, pp. 1-3, Apr 2012. ISBN 978-1-4673-1511-1; DOI 10.1109/ESimE.2012.6191780.

  137. Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems
    F. Santagata; G. Fiorentino; M. Nie; C. Farriciello; R. Poelma; Kouchi Zhang; P.M. Sarro;
    In Proc. 11th IEEE Sensors Conference,
    Taipei, Taiwan, pp. 668-671, Oct 2012.

  138. Monitoring of meniscus motion at nozzle orifice with capacitive sensor for inkjet applications
    J. Wei; C. Yue; Kouchi Zhang; J.F. Dijksman; P.M. Sarro;
    In Proc. 11th IEEE Sensors Conference,
    Taipei, Taiwan, pp. 2172-2175, Oct 2012.

  139. System approach for reliability of low-power power electronics: How to break down into their constructed parts
    S. Tarashioon; W.D. van Driel; Kouchi Zhang;
    In 7th International Conference on Integrated Power Electronics Systems (CIPS 2012),
    Nuremberg, Germany, pp. 1-5, Mar. 2012.

  140. Establishment of the mesoscale parameters for epoxy-copper interfacial separation
    C.K.Y. Wong; S.Y.Y. Leung; R.H. Poelma; K.M.B. Jansen; C.C.A. Yuan; W.D. van Driel; Kouchi Zhang;
    In 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
    Lisbon, Portugal, Apr. 2012. DOI 10.1109/ESimE.2012.6191737.

  141. Thermal and moisture degradation in SSL system
    S. Koh; W.D. van Driel; Kouchi Zhang;
    In 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
    Lisbon, Portugal, pp. 1-6, Apr. 2012. DOI 10.1109/ESimE.2012.6191806.

  142. Dynamic thermal simulation of high brightness LEDs with unsteady driver power output
    H. Ye; S. Koh; J. Wei; H.W. van Zeijl; Kouchi Zhang;
    In 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
    Lisbon, Portugal, Apr. 2012. DOI 10.1109/ESimE.2012.6191768.

  143. Molecular modeling of the conductivity changes of the emeraldine base polyaniline due to protonic acid doping
    X. Chen; C. Yuan; C. Wong; Kouchi Zhang;
    In 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
    Cascais, Portugal, Apr. 2012. ISBN 978-1-4673-1511-1; DOI 10.1109/ESimE.2012.6191741.

  144. Validation of forcefields in predicting the physical and thermophysical properties of emeraldine base polyaniline
    X.P. Chen; C.A. Yuan; C.K.Y. Wong; S.W. Koh; Kouchi Zhang;
    Molecular Simulation,
    Volume 37, Issue 12, pp. 990-996, Oct. 2011. DOI 10.1080/08927022.2011.562503.

  145. A review of passive thermal management of LED module
    H. Ye; S. Koh; H. Zeijl; A.W.J. Gielen; Kouchi Zhang;
    Journal of Semiconductors,
    Volume 32, Issue 1, pp. 1-4, 2011. DOI 10.1088/1674-4926/32/1/014008.

  146. Molecular modeling of temperature dependence of solubility parameters for amorphous polymers
    X.P. Chen; C.A. Yuan; C.K.. Wong; Kouchi Zhang;
    Journal of Molecular Modeling,
    pp. 1-9, Oct. 2011. DOI 10.1007/s00894-011-1249-3.

  147. A numerical experimental approach for characterizing the elastic properties of thin films: Application of nanocantilevers
    R.H. Poelma; H. Sadeghian; S.P.M. Noijen; J.J.M. Zaal; Kouchi Zhang;
    Journal of Micromechanics and Microengineering,
    Volume 21, Issue 6, pp. 1-11, 2011. DOI 10.1088/0960-1317/21/6/065003.

  148. Evaluation and selection of sensing materials for carbon dioxide (CO2) sensor by molecular modeling
    X.P. Chen; C.K.Y. Wong; C.A. Yuan; Kouchi Zhang;
    In C. Tsamis; G. Kaltas (Ed.), Proc. Eurosensors XXV,
    Athens, Greece, Procedia Engineering, pp. 379-382, Sep. 2011. DOI 10.1016/j.proeng.2011.12.094.

  149. Thermal analysis of HB LED packages and advanced materials
    H. Ye; A.W.J. Gielen; H.W. vanZeijl; Kouchi Zhang;
    In ChinaSSL 2012, China,
    2011.

  150. Buckling analysis of carbon nanotubes and the influence of defect position
    R.H. Poelma; H. Sadeghian; S.W. Koh; Kouchi Zhang;
    In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
    Linz, Austria, pp. 1-7, Apr. 2011. ISBN 978-1-4577-0106-1; DOI 10.1109/ESIME.2011.5765864.

  151. Co-design of wafer level thin film package assembly
    J.J.M. Zaal; F. Santagata; W.D. van Driel; Kouchi Zhang; J.F. Creemer; P.M. Sarro;
    In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
    Linz, Austria, pp. 1-6, Apr. 2011. ISBN 978-1-4577-0106-1.
    document

  152. Numerical modeling of thermal performance: Natural convection and radiation of solid state lighting
    H. Ye; A.W.J. Gielen; H.W. vanZeijl; R.J. Werkhoven; Kouchi Zhang;
    In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
    Linz, Austria, pp. 1-6, Apr. 2011. ISBN 978-1-4577-0106-1; DOI 10.1109/ESIME.2011.5765845.

  153. Degradation of epoxy lens materials in LED systems
    S. Koh; W.D. van Driel; Kouchi Zhang;
    In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
    Linz, Austria, pp. 1-5, Apr. 2011. ISBN 978-1-4577-0106-1; DOI 10.1109/ESIME.2011.5765850.

  154. Molecular Dynamics study of the traction-displacement relations of epoxy-copper interfaces
    C.K.Y. Wong; S.Y.Y. Leung; R.H. Poelma; K.M.B. Jansen; C.A. Yuan; W.D. van Driel; Kouchi Zhang;
    In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
    Linz, Austria, pp. 1-5, Apr. 2011. ISBN 978-1-4577-0106-1; DOI 10.1109/ESIME.2011.5765785.

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