GuoQi Zhang

Publications

A Fully Integrated Sequential Synchronized Switch Harvesting on Capacitors Rectifier Based on Split-Electrode for Piezoelectric Energy Harvesting
Xinling Yue; Jiarui Mo; Zhiyuan Chen; Sten Vollebregt; Guoqi Zhang; Sijun Du;
IEEE Transactions on Power Electronics,
2024. DOI: 10.1109/TPEL.2024.3369728
Measuring residual stresses in individual on-chip interconnects using synchrotron nanodiffraction
Yaqian Zhang; Leiming Du; Olof Bäcke; Sebastian Kalbfleisch; Guoqi Zhang; Sten Vollebregt; Magnus Hörnqvist Colliander;
Applied Physics Letters,
Volume 124, pp. 083501-1-6, 2024. DOI: 10.1063/5.0192672
A high aspect ratio surface micromachined accelerometer based on a SiC-CNT composite material
Jiarui Mo; Shreyas Shankar; Roberto Pezone; Guoqi Zhang; Sten Vollebregt;
Microsystems & Nanoengineering,
Volume 10, Issue 42, 2024. DOI: 10.1038/s41378-024-00672-x
An Analog to Digital Converter in a SiC CMOS Technology for High-temperature Applications
Jiarui Mo; Yunfan Niu; Alexander May; Mathias Rommel; Chiara Rossi; Joost Romijn; Guoqi Zhang; Sten Vollebregt;
Applied Physics Letters,
Volume 124, Issue 15, 2024. DOI: 10.1063/5.0195013
Investigating Mechanical Properties of Silicon Carbide Coated Carbon Nanotube Composite at Elevated Temperatures
Jiarui Mo; Gerald J.K. Schaffar; Leiming Du; Verena Maier-Kiener; Daniel Kiener; Sten Vollebregt; Guoqi Zhang;
In IEEE 37th Intl. Conf. on Micro Electro Mechanical Systems (MEMS2024),
2024.
Transient thermal measurement on nano-metallic sintered die-attach joints using a thermal test chip
R. Sattari; Dong Hu; Xu Liu; H. van Zeijl; S. Vollebregt; GuoQi Zhang;
Applied Thermal Engineering,
Volume 221, pp. 119503, 2023. DOI: 10.1016/j.applthermaleng.2022.119503
Coupling Model of Electromigration and Experimental Verification – Part I: Effect of Atomic Concentration Gradient
Zhen Cui; Xuejun Fan; Yaqian Zhang; Sten Vollebregt; Jiajie Fan; Guoqi Zhang;
Journal of the Mechanics and Physics of Solids,
Volume 174, pp. 105257, 2023. DOI: 10.1016/j.jmps.2023.105257
Coupling Model of Electromigration and Experimental Verification – Part II: Impact of Thermomigration
Zhen Cui; Xuejun Fan; Yaqian Zhang; Sten Vollebregt; Jiajie Fan; Guoqi Zhang;
Journal of the Mechanics and Physics of Solids,
Volume 174, pp. 105256, 2023. DOI: 10.1016/j.jmps.2023.105256
Microfabricated albedo insensitive sun position sensor system in silicon carbide with integrated 3D optics and CMOS electronics
Joost Romijn; Sten Vollebregt; Vincent G. de Bie; Luke M. Middelburg; Brahim El Mansouri; Henk W. van Zeijl; Alexander May; Tobias Erlbacher; Johan Leijtens; Guoqi Zhang; Pasqualina M. Sarro;
Sensors and Actuators A: Physical,
Volume 354, pp. 114268, 2023. DOI: 10.1016/j.sna.2023.114268
A Highly Linear Temperature Sensor Operating up to 600°C in a 4H-SiC CMOS Technology
Jiarui Mo; Jinglin Li; Yaqian Zhang; Joost Romijn; Alexander May; Tobias Erlbacher; Guoqi Zhang; Sten Vollebregt;
IEEE Electron Device Letters,
Volume 44, Issue 6, pp. 995-998, 2023. DOI: 10.1109/LED.2023.3268334
Study on the controllability of the fabrication of single-crystal silicon nanopores/nanoslits with a fast-stop ionic current-monitored TSWE method
Hao Hong; Jiangtao Wei; Xin Lei; Haiyun Chen; Pasqualina M. Sarro; Guoqi Zhang; Zewen Liu;
Microsystems & Nanoengineering,
Volume 9, pp. 63, 2023. DOI: 10.1038/s41378-023-00532-0
Nanostructured Thermoelectric Films Synthesised by Spark Ablation and Their Oxidation Behaviour
Joost van Ginkel; Lisa Mitterhuber; Marijn Willem van de Putte; Mark Huijben; Sten Vollebregt; Guoqi Zhang;
Nanomaterials,
Volume 13, Issue 11, pp. 1778, 2023. DOI: 10.3390/nano13111778
Copper Nanoparticle Sintering Enabled Hermetic Packaging With Fine Sealing Ring for MEMS Application
Dong Hu; Mustafeez Bashir Shah; Jiajie Fan; Sten Vollebregt; Guoqi Zhang;
IEEE Transactions on Electron Devices,
Volume 70, Issue 11, pp. 5818-5823, 2023. DOI: 10.1109/TED.2023.3312066
Design and Characterization of a Data Converter in a SiC CMOS Technology for Harsh Environment Sensing Applications
Yunfan Niu; Jiarui Mo; Alexander May; Mathias Rommel; Chiara Rossi; Joost Romijn; Guoqi Zhang; Sten Vollebregt;
In Proc. of IEEE Sensors,
2023.
Silicon carbide reinforced vertically aligned carbon nanotube composite for harsh environment MEMS
Jiarui Mo; Shreyas Shankar; Guoqi Zhang; Sten Vollebregt;
In IEEE 36th Intl. Conf. on Micro Electro Mechanical Systems (MEMS2023),
2023. DOI: 10.1109/MEMS49605.2023.10052162
Manufacturing of an In-Package Relative Humidity Sensor for Epoxy Molding Compound Packages
Romina Sattari; Henk van Zeijl; GuoQi Zhang;
In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
2023. DOI: 10.1109/EuroSimE56861.2023.10100771
Study on Sintering Mechanism and Mechanical Properties of Nano-Cu based on Molecular Dynamics Simulation
Cheng Qian; Dong Hu; Xu Liu; Xuejun Fan; Guoqi Zhang; Jiajie Fan;
In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
2023. DOI: 10.1109/EuroSimE56861.2023.10100810
Effect of Thermomigration on Electromigration in SWEAT Structures
Zhen Cui; Xuejun Fan; GuoQi Zhang;
In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
2023. DOI: 10.1109/EuroSimE56861.2023.10100774
Temperature Field Simulation and optimization for Horizontal 6-inch 4H-SiC Epitaxial CVD Reactor by Induction Heating
Zhuorui Tang; Jing Tian; Chaobin Mao; Nan Zhang; Jiyu Huang; Jiajie Fan; Guoqi Zhang;
In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
2023. DOI: 10.1109/EuroSimE56861.2023.10100813
Hydrolysis Mechanism Analysis of (Ca, Sr)AlSiN₃:Eu²⁺ Red Phosphor Aged Under Pressure Cooker Test and 85°C&85%RH Test: Kinetics Modeling and First-principles Calculation
Minzhen Wen; Baotong Guo; Shanghuan Chen; Xiao Hu; Xuejun Fan; Guoqi Zhang; Jiajie Fan;
In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
2023. DOI: 10.1109/EuroSimE56861.2023.10100750
Electromigration-induced local dewetting in Cu films
Yaqian Zhang; Jiarui Mo; Zhen Cui; Sten Vollebregt; GuoQi Zhang;
In Proc. of the IEEE International Interconnect Technology Conference,
2023. DOI: 10.1109/IITC/MAM57687.2023.10154761
Effect of Passivation and Mechanical Constraint on Electromigration in Interconnect
Xuejun Fan; Zhen Cui; GuoQi Zhang;
In Proc. of Electronic Components and Technology Conference (ECTC),
2023.
Low Temperature Fine Pitch All-Copper Interconnects Combining Photopatternable Underfill Films
Xinrui Ji; Henk Van Zeijl; Weiping Jiao; Shan He; Leiming Du; Guoqi Zhang;
In Proc. of Electronic Components and Technology Conference (ECTC),
2023.
Reliability Analysis on Ag and Cu Nanoparticles Sintered Discrete Power Devices with Various Frontside and Backside Interconnects
Dong Hu; Xu Liu; Sten Vollebregt; Jiajie Fan; Guoqi Zhang; Ali Roshanghias; Xing Liu; Thomas Basler; Emiel De Bruin;
In Proc. of Electronic Components and Technology Conference (ECTC),
2023.
A Thin-Film Reconfigurable SiC Thermal Test Chip for Reliability Monitoring in Harsh Environments
Romina Sattari; Henk van Zeijl; GuoQi Zhang;
In Proc. of Electronic Components and Technology Conference (ECTC),
2023.
Simulation, Prediction, and Verification of the Corrosion Behavior of Cu-Ag Composite Sintered Paste for Power Semiconductor Die-Attach Applications
Xinyue Wang; Zhoudong Yang; Pan Liu; Guoqi Zhang; Jing Zhang;
In Proc. of Electronic Components and Technology Conference (ECTC),
2023.
Thermal-Mechanical-Electrical Co-Design of Fan-Out Panel-Level SiC MOSFET Packaging with a Multi-Objective Optimization Algorithm
Wei Chen; Xuyang Yan; Jiajie Fan; Mesfin S. Ibrahim; Jing Jiang; Xuejun Fan; Guoqi Zhang;
In Proc. of Electronic Components and Technology Conference (ECTC),
2023.
Impact of Temperature Cycling Conditions on Board Level Vibration for Automotive Applications
Varun Thukral; Irene Bacquet; Michiel Soestbergen; Jeroen Zaal; Romuald Roucou; Rene Rongen; Willem van Driel; GuoQi Zhang;
In Proc. of Electronic Components and Technology Conference (ECTC),
2023.
Heterogeneous Integration of Diamond Heat Spreaders for Power Electronics Application
Henry Antony Martin; Marcia Reintjes; Xiao Tang; Dave Reijs; Sander Dorrestein; Martien Kengen; Sebastien Libon; Edsger Smits; Marco Koelink; Rene Poelma; Willem Van Driel; GuoQi Zhang;
In Proc. of Electronic Components and Technology Conference (ECTC),
2023.
High-Temperature Creep Properties of a Novel Solder Material and Its Thermal Fatigue Properties Under Potting Material
Leiming Du; Guoqi Zhang; Xiujuan Zhao; Willem Van Driel; Rene Poelma;
In Proc. of Electronic Components and Technology Conference (ECTC),
2023.
High-performance Silicon Carbide-on-insulator Thermoresistive High-temperature Sensor Up To 750 C
Baoyun Sun; Jiarui Mo; Willem D. van Driel; GuoQi Zhang;
In 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS 2023),
2023.
MOSFET-based And P-N Diode Based Temperature Sensors In A 4H-sSiC CMOS Technology
Jiarui Mo; Jinglin Li; Yaqian Zhang; Alexander May; Tobias Erlbacher; Guoqi Zhang; Sten Vollebregt;
In 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS 2023),
2023.
Silicon Carbide-on-Insulator Thermal-Piezoresistive Resonator for Harsh Environment Application
Baoyun Sun; Jiarui Mo; Hemin Zhang; Henk W. van Zeijl; Willem D. van Driel; GuoQi Zhang;
In IEEE 36th Intl. Conf. on Micro Electro Mechanical Systems (MEMS2023),
2023. DOI: 10.1109/MEMS49605.2023.10052401
Time Dependent Dielectric Breakdown of 4H-SiC MOSFETs in CMOS technology
Yaqian Zhang; Jiarui Mo; Sten Vollebregt; GuoQi Zhang;
In 24th International Conference on Electronic Packaging Technology (ICEPT),
2023.
Integrated Digital and Analog Circuit Blocks in a Scalable Silicon Carbide CMOS Technology
Joost Romijn; Sten Vollebregt; Luke M. Middelburg; Brahim El Mansouri; Henk W. van Zeijl; Alexander May; Tobias Erlbacher; Guoqi Zhang; Pasqualina M. Sarro;
IEEE Transactions on Electron Devices,
Volume 69, Issue 1, pp. 4-10, 2022. DOI: 10.1109/TED.2021.3125279
Mass and density determination of porous nanoparticle films using a quartz crystal microbalance
Hendrik Joost van Ginkel; Sten Vollebregt; GuoQi Zhang; Andreas Schmidt-Ott;
IOP Nanotechnology,
Volume 33, Issue 48, 2022. DOI: 10.1088/1361-6528/ac7811
Effects of Temperature and Grain Size on Diffusivity of Aluminium: Electromigration Experiment and Molecular Dynamic Simulation
Zhen Cui; Yaqian Zhang; Dong Hu; Sten Vollebregt; Jiajie Fan, Xuejun Fan; Guoqi Zhang;
Journal of Physics: Condensed Matter,
Volume 34, pp. 175401, 2022. DOI: 10.1088/1361-648X/ac4b7f
Angle Sensitive Optical Sensor for Light Source Tracker Miniaturization
Joost Romijn; Secil Sanseven; Guoqi Zhang; Sten Vollebregt; Pasqualina M. Sarro;
IEEE Sensors Letters,
Volume 6, Issue 6, pp. 1-4, 2022. DOI: 10.1109/LSENS.2022.3175607
Board level vibration test method of components for automotive electronics: State-of-the-art approaches and challenges
V. Thukral; M. van Soestbergen; J.J.M. Zaal; R. Roucou; R.T.H. Rongen; W.D. van Driel; GuoQi Zhang;
Microelectronics Reliability,
Volume 139, pp. 114830, 2022. DOI: 10.1016/j.microrel.2022.114830
Integrated 64 pixel UV image sensor and readout in a silicon carbide CMOS technology
Joost Romijn; Sten Vollebregt; Luke M. Middelburg; Brahim El Mansouri; Henk W. van Zeijl; Alexander May; Tobias Erlbacher; Johan Leijtens; Guoqi Zhang; Pasqualina M. Sarro;
Nature Microsystems & Nanoengineering,
Volume 8, pp. 114, 2022. DOI: 10.1038/s41378-022-00446-3
Reliability of Organic Compounds in Microelectronics and Optoelectronics
Willem Dirk van Driel; Maryam Yazdan Mehr; Xuejun Fan; GuoQi Zhang (Ed.);
Springer, , 2022. DOI: 10.1007/978-3-030-81576-9
Degradation and Failures of Polymers Used in Light-Emitting Diodes
Maryam Yazdan Mehr; W. D. van Driel; GuoQi Zhang;
Springer, , 2022. DOI: 10.1007/978-3-030-81576-9_8
Outlook: From Physics of Failure to Physics of Degradation
W. D. van Driel; Maryam Yazdan Mehr; X. J. Fan; GuoQi Zhang;
Springer, , 2022. DOI: 10.1007/978-3-030-81576-9_17
Patterning of Fine-Features in Nanoporous Films Synthesized by Spark Ablation
Xinrui Ji; Joost van Ginkel; Dong Hu; Andreas Schmidt-Ott; Henk van Zeijl; Sten Vollebregt; GuoQi Zhang;
In Proc. IEEE Nano,
pp. 238-241, 2022. DOI: 10.1109/NANO54668.2022.9928705
Visible Blind Quadrant Sun Position Sensor in a Silicon Carbide Technology
Joost Romijn; Sten Vollebregt; Alexander May; Tobias Erlbacher; Henk W. van Zeijl; Johan Leijtens; GuoQi Zhang; Pasqualina M. Sarro;
In 35th Intl. Conf. on Micro Electro Mechanical Systems (MEMS 2022),
2022. DOI: 10.1109/MEMS51670.2022.9699533
ZnO Nanoparticle Printing for UV Sensor Fabrication
Hendrik Joost van Ginkel; Mattia Orvietani; Joost Romijn; GuoQi Zhang; Sten Vollebregt;
In Proc. of IEEE Sensors,
2022. DOI: 10.1109/SENSORS52175.2022.9967053
In-situ reliability monitoring of power packages using a Thermal Test Chip
H. A. Martin; R. Sattari; E. C. P. Smits; H. W. van Zeijl; W. D. van Driel; GuoQi Zhang;
In 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
2022. DOI: 10.1109/EuroSimE54907.2022.9758913
Surface-micromachined Silicon Carbide Pirani Gauges for Harsh Environments
Jiarui Mo; Luke Middelburg; Bruno Morana; H.W. Van Zeijl; Sten Vollebregt; GuoQi Zhang;
IEEE Sensors Letters,
Volume 21, Issue 2, pp. 1350-1358, 2021. DOI: 10.1109/JSEN.2020.3019711
A Review of Modification Methods of Solid Electrolytes for All-Solid-State Sodium-Ion Batteries
Dai, Hanqing; Chen, Yuanyuan; Xu, Wenqian; Hu, Zhe; Gu, Jing; Wei, Xian; Xie, Fengxian; Zhang, Wanlu; Wei, Wei; Guo, Ruiqian; Zhang, Guoqi;
Energy Technology,
Volume 9, Issue 1, pp. 2000682, 2021. DOI: 10.1002/ente.202000682
document
Insights into the high-sulphur aging of sintered silver nanoparticles: An experimental and ReaxFF study
Dong Hu; Tijian Gu; Zhen Cui; Sten Vollebregt; Xuejun Fan; Guoqi Zhang; Jiajie Fan;
Corrosion Science,
pp. 109846, 2021. DOI: 10.1016/j.corsci.2021.109846
Optical ventricular cardioversion by local optogenetic targeting and LED implantation in a cardiomyopathic rat model
Emile C. A. Nyns; Tianyi Jin; Magda S Fontes; Titus van den Heuvel; Vincent Portero; Catilin Ramsey; Cindy I. Bart; Katja Zeppenfeld; Martin J. Schalij; Thomas J. van Brakel; Arti A. Ramkisoensing; GuoQi Zhang; René H. Poelma; Balazs Ördög; Antoine A. F. de Vries; Daniël A. Pijnappels;
Cardiovascular Research,
September 2021. DOI: 10.1093/cvr/cvab294
Enhanced Sensitivity Pt/AlGaN/GaN Heterostructure NO₂ Sensor Using a Two-Step Gate Recess Technique
Jianwen Sun; Teng Zhan; Robert Sokolovskij; Zewen Liu; Pasqualina M. Sarro; Guoqi Zhang;
IEEE Sensors Journal,
Volume 21, Issue 15, pp. 16475-16483, 2021. DOI: 10.1109/JSEN.2021.3082205
Design of a Fan-Out Panel-Level SiC MOSFET Power Module Using Ant Colony Optimization-Back Propagation Neural Network
Qian, Yichen; Hou, Fengze; Fan, Jiajie; Lv, Quanya; Fan, Xuejun; Zhang, Guoqi;
IEEE Transactions on Electron Devices,
Volume 68, Issue 7, pp. 3460-3467, 2021. DOI: 10.1109/TED.2021.3077209
Room temperature ppt-level NO2 gas sensor based on SnOx/SnS nanostructures with rich oxygen vacancies
Hongyu Tang; Chenshan Gao; Huiru Yang; Leandro Nicolas Sacco; Robert Sokolovskij; Hongze Zheng; Huaiyu Ye; Sten Vollebregt; Hongyu Yu; Xuejun Fan; Guoqi Zhang;
2D Materials,
2021. DOI: 10.1088/2053-1583/ac13c1
System level reliability assessment for high power light-emitting diode lamp based on a Bayesian network method
Mesfin Seid Ibrahim; Jiajie Fan; Winco K.C. Yung; Zhou Jing; Xuejun Fan; Willem van Driel; Guoqi Zhang;
Measurement,
Volume 176, pp. 109191, 2021. DOI: 10.1016/j.measurement.2021.109191
document
Low Leakage and High Forward Current Density Quasi-Vertical GaN Schottky Barrier Diode With Post-Mesa Nitridation
X. Kang; Y. Sun; Y. Zheng; K. Wei; H. Wu; Y. Zhao; Xu Liu; GuoQi Zhang;
IEEE Transactions on Electron Devices,
Volume 68, Issue 3, pp. 1369-1373, 2021. DOI: 10.1109/TED.2021.3050739
Investigating the Electrochemical Performance of Smart Self-Powered Bionic Skin Fragment Based on Bioelectricity Generation
Dai, H.; Chen, Y.; Dai, W.; Hu, Z.; Xie, F.; Xu, W.; Cui, Z.; Wei, X.; Chen, Z.; Yang, B.; Zhang, W.; Wei, W.; Guo, R.; Zhang, GuoQi;
Advanced Materials Technologies,
Volume 6, Issue 3, 2021. DOI: 10.1002/admt.202000848
document
Facile Synthesis of Ag Nanowire/TiO2 and Ag Nanowire/TiO2/GO Nanocomposites for Photocatalytic Degradation of Rhodamine B
Hajipour, Pejman; Bahrami, Abbas; Mehr, Maryam Yazdan; van Driel, Willem Dirk; Zhang, GuoQi;
Materials,
Volume 14, Issue 4, 2021. DOI: 10.3390/ma14040763
document
Correction: The inactivation mechanism of chemical disinfection against SARS-CoV-2: from MD and DFT perspectives
Tan, Chunjian; Gao, Chenshan; Zhou, Quan; Van Driel, Willem; Ye, Huaiyu; Zhang, GuoQi;
RSC Adv.,
Volume 11, pp. 3509-3509, 2021. DOI: 10.1039/D0RA90127J
document
Effects of Defect and Temperature on the Mechanical Performance of WS2: A Multiscale Analysis
Hongyu Tang; Dong Hu; Zhen Cui; Huaiyu Ye; GuoQi Zhang;
Journal of Physical Chemistry C,
2021.
document
Resistive and PTAT Temperature Sensors in a Silicon Carbide CMOS Technology
Joost Romijn; Luke M. Middelburg; Sten Vollebregt; Brahim El Mansouri; Henk W. van Zeijl; Alexander May; Tobias Erlbacher; Guoqi Zhang; and Pasqualina M. Sarro;
In Proc. of IEEE Sensors,
2021.
Constitutive Modeling of Sintered Nano-silver Particles: A Variable-order Fractional Model versus an Anand Model
Fan, Jiajie; Gu, Tijian; Wang, Ping; Cai, Wei; Fan, Xuejun; Zhang, Guoqi;
In 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
pp. 1-4, 2021. DOI: 10.1109/EuroSimE52062.2021.9410807
High step coverage interconnects by printed nanoparticles
Hendrik Joost van Ginkel; Joost Romijn; Sten Vollebregt; GuoQi Zhang;
In Proc. of the 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC),
2021.
Design and Fabrication of a Multi-Functional Programmable Thermal Test Chip
R. Sattari; H. van Zeijl; GuoQi Zhang;
In 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC),
2021. DOI: 10.23919/EMPC53418.2021.9584984
Fan-out Panel-level PCB Embedded SiC Power MOSFETs Packaging
Fengze Hou; W. Wang; R. Ma; Y. Li; Z. Han; M. Su; J. Li; Z. Yu; Y. Song; Q. Wang; M. Chen; L. Cao; GuoQi Zhang; J.A. Ferreira;
IEEE Journal of Emerging and Selected Topics in Power Electronics,
Volume 8, Issue 1, pp. 367-380, 2020.
Review of Packaging Schemes for Power Module
Fengze Hou; W. Wang; L. Cao; M. Su; J. Li; GuoQi Zhang; J.A. Ferreira;
IEEE Journal of Emerging and Selected Topics in Power Electronics,
Volume 8, Issue 1, pp. 223-238, 2020.
Microchannel Thermal Management System with Two-Phase Flow for Power Electronics over 500 W/cm2 Heat Dissipation
Fengze Hou; Hengyun Zhang; Dezhu Huang; Jiajie Fan; Fengman Liu; Tingyu Lin; Liqiang Cao; Xuejun Fan; Braham Ferreira; GuoQi Zhang;
IEEE Transactions on Power Electronics,
Volume 35, Issue 10, pp. 10592-10600, 2020. DOI: 10.1109/TPEL.2020.2985117
Towards Multi-Functional SiO2@YAG:Ce Core–Shell Optical Nanoparticles for Solid State Lighting Applications
Mahdi Kiani Khouzani; Abbas Bahrami; Maryam Yazdan Mehr; Willem Dirk van Driel; GuoQi Zhang;
Nanomaterials,
Volume 10, Issue 1, pp. 153, 2020. DOI: 10.3390/nano10010153
Maintaining Transparency of a Heated MEMS Membrane for Enabling Long-Term Optical Measurements on Soot-Containing Exhaust Gas
Luke M. Middelburg; Mohammadamir Ghaderi; David Bilby; Jaco H. Visser; GuoQi Zhang; Per Lundgren; Peter Enoksson; Reinoud F. Wolffenbuttel;
MDPI Sensors,
Volume 20, 2020. DOI: 10.3390/s20010003
The interface adhesion of CaAlSiN3: Eu2+ phosphor/silicone used in light-emitting diode packaging: a first principles study
Zhen Cui; Jiajie Fan; Hendrik Joost van Ginkel; Xuejun Fan; GuoQi Zhang;
Applied Surface Science,
2020. DOI: 10.1016/j.apsusc.2020.145251
Infrared absorbance of vertically-aligned multi-walled CNT forest as a function of synthesis temperature and time
Amir Mirza Gheytaghia; Amir Ghaderi; Sten Vollebregt; Majid Ahmadic; Reinoud Wolffenbuttel; GuoQi Zhang;
Materials Research Bulletin,
2020. DOI: 10.1016/j.materresbull.2020.110821
Toward a Self-Sensing Piezoresistive Pressure Sensor for all-SiC Monolithic Integration
L.M. Middelburg; H.W. van Zeijl; S. Vollebregt; B. Morana; GuoQi Zhang;
IEEE Sensors,
Volume 20, Issue 19, pp. 11265-11274, 2020. DOI: 10.1109/JSEN.2020.2998915
Vertically-Aligned Multi-Walled Carbon Nano Tube Pillars with Various Diameters under Compression: Pristine and NbTiN Coated
Amir Mirza Gheitaghy; René H. Poelma; Leandro Sacco; Sten Vollebregt; GuoQi Zhang;
MDPI Nanomaterials,
Volume 10, Issue 6, pp. 1189, 2020. DOI: 10.3390/nano10061189
The Impact of Gate Recess on the H2 Detection Properties of Pt-AlGaN/GaN HEMT Sensors
Robert Sokolovskij; Jian Zhang; Hongze Zheng; Wenmao Li; Yang Jiang; Gaiying Yang; Hongyu Yu; Pasqualina M. Sarro; Guoqi Zhang;
IEEE Sensors,
Volume 20, Issue 16, pp. 8947-8955, 2020.
document
Low power AlGaN/GaN MEMS pressure sensor for high vacuum application
Jianwen Sun; Dong Hu; Zewen Liu; Luke Middelburg; Sten Vollebregt; Pasqualina M. Sarro; Guoqi Zhang;
Sensors and Actuators A: Physical,
Volume 314, pp. 112217, 2020.
document
Thermal kinetic and mechanical behaviors of pressure-assisted Cu nanoparticles sintering: A molecular dynamics study
Dong Hu; Zhen Cui; Jiajie Fan; Xuejun Fan; Guoqi Zhang;
Results in Physics,
2020.
document
Recent advances in 2D/nanostructured metal sulfide-based gas sensors: mechanisms, applications, and perspectives
Hongyu Tang; Leandro Sacco; Sten Vollebregt; Huaiyu Ye; Xuejun; Fan; GuoQi Zhang;
Journal of Materials Chemistry A,
Volume 8, pp. 24943-24976, 2020.
document
A high responsivity and controllable recovery ultraviolet detector based on a WO3 gate AlGaN/GaN heterostructure with an integrated micro-heater
Sun, Jianwen; Zhang, Shuo; Zhan Teng; Liu, Zewen; Wang Junxi; Yi Xiaoyan; Li Jinmin; P. M. Sarro; GuoQi Zhang;
Journal of Materials Chemistry C,
Volume 8, Issue 16, pp. 5409-5416, 2020. DOI: 10.1039/D0TC00553C
document
An effective optics-electrochemistry approach to random packing density of non-equiaxed ellipsoids
Hanqing Dai; Wenqian Xu; Zhe Hu; Yuanyuan Chen; Bobo Yang; Zhiyong Xiong; Danlu Su; Xian Wei; Shiliang Mei; Zhihao Chen; Min Li; Wanlu Zhang; Fengxian Xie; Wei Wei; Ruiqian Guo; GuoQi Zhang;
Materialia,
Volume 12, pp. 100750, 2020. DOI: 10.1016/j.mtla.2020.100750
document
Dynamic prediction of optical and chromatic performances for a light-emitting diode array based on a thermal-electrical-spectral model
Jiajie Fan; Wei Chen; Weiyi Yuan; Xuejun Fan; Guoqi Zhang;
Opt. Express,
Volume 28, Issue 9, pp. 13921--13937, Apr 2020. DOI: 10.1364/OE.387660
document
Effect of porous Cu addition on the microstructure and mechanical properties of SnBi-xAg solder joints
Yang Liu; Boqiao Ren; Min Zhou; Yuxiong Xue; Xianghua Zeng; Fenglian Sun; Xuejun Fan; GuoQi Zhang;
Applied Physics A,
Volume 126, Issue 9, pp. 735, August 2020. DOI: 10.1007/s00339-020-03926-3
document
Blue light therapy to treat candida vaginitis with comparisons of three wavelengths: An in vitro study
Tianfeng Wang; Jianfei Dong; Huancai Yin; GuoQi Zhang;
Lasers in Medical Science,
Volume 35, Issue 6, pp. 1329--1339, 2020. DOI: 10.1007/s10103-019-02928-9
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High-performance humidity sensor using Schottky-contacted SnS nanoflakes for noncontact healthcare monitoring
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MEMS Enabled Fast Time-Resolved X-Ray Diffraction Characterization Platform for Copper Nanoparticle Sintering in Heterogeneous Integration Applications
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A design and qualification of LED flip Chip-on-Board module with tunable color temperatures
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A Review on Water Vapor Pressure Model for Moisture Permeable Materials Subjected to Rapid Heating
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A new hermetic sealing method for ceramic package using nanosilver sintering technology
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Effect of Sintering Pressure on the Porosity and the Shear Strength of the Pressure-Assisted Silver Sintering Bonding
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Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages
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Germanene on single layer ZnSe substrate: Novel electronic and optical properties
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A stochastic process based reliability prediction method for LED driver
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High Selective Gas Detection for small molecules based on Germanium selenide monolayer
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Hydrogen sulfide detection properties of Pt-gated AlGaN/GaN HEMT-sensor
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In Situ Failure Detection of Electronic Control Units Using Piezoresistive Stress Sensor
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Influence of pressure on the mechanical and electronic properties of wurtzite and zinc-blende gaN crystals
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The effects of graphene stacking on the performance of methane sensor: A first-principles study on the adsorption, band gap and doping of graphene
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Study on the Degradation of Optical Silicone Exposed to Harsh Environments
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Microstructure and hardness of SAC305 and SAC305-0.3Ni solder on Cu, high temperature treated Cu, and graphene-coated Cu substrates
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Promoting sensitivity and selectivity of HCHO sensor based on strained InP3 monolayer: A DFT study
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A photovoltaic window with sun-tracking shading elements towards maximum power generation and non-glare daylighting
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Effects of Conformal Nanoscale Coatings on Thermal Performance of Vertically Aligned Carbon Nanotubes
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Reliability Prediction of Integrated LED Lamps with Electrolytic Capacitor-Less LED Drivers
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LED-Based Luminaire Color Shift Acceleration and Prediction
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Reliability and Lifetime Assessment of Optical Materials in LED-Based Products
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Designing a 100 [aF/nm] capacitive transducer
L. M. Middelburg; B. El Mansouri; R. H. Poelma; H. W. van Zeijl; Jia Wei; GuoQi Zhang; W. D. van Driel;
In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
2018.
Modeling of two-dimensional hyperbolic heat conduction in silicon-on-insulator transistor by equivalent RLC network
Amir Mirza Gheytaghi; Huaiyu Ye; GuoQi Zhang;
In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
2018.
Wafer Level Through-polymer Optical Vias (TPOV) Enabling High Throughput of Optical Windows Manufacturing
Z. Huang; R.H. Poelma; S. Vollebregt; M.H. Koelink; E. Boschman; R. Kropf; M. Gallouch; GuoQi Zhang;
In IEEE Electronics System-Integration Technology Conference (ESTC),
pp. 1-5, 2018.
Interfacial properties of Cu/SiO2 using a multiscale modelling approach in electronic packages
Zhen Cui; Xianping Chen; Xuejun Fan; GuoQi Zhang;
In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
2018.
A probabilistic physics-of-failure reliability assessment approach for integrated LED lamps
Bo Sun; Jiajie Fan; Xuejun Fan; GuoQi Zhang;
In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
2018.
SiC MOSFET Threshold-Voltage Instability under High Temperature Aging
Liu, Y.; Chen, X.; Zhao, Z.; Li, Z.; Lu, C.; Zhang, J.; Ye, H.; Koh, S. W.; Wang, L.; GuoQi Zhang;
In Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018,
2018. DOI: 10.1109/ICEPT.2018.8480781
The performance of sintered nanocopper interconnections for high temperature device
Liu, Q.; Chen, X.; Zhu, J.; Zhang, H.; Zhang, J. S.; Zhang, J. G.; Wang, L.; Ye, H.; Koh, S. W.; GuoQi Zhang;
In 19th International Conference on Electronic Packaging Technology, ICEPT 2018,
IEEE, 2018. DOI: 10.1109/ICEPT.2018.8480591
Non-Linear Bulk Micromachined Accelerometer for High Sensitivity Applications
Middelburg, L. M.; Mansouri, B. E.; Poelma, R.; GuoQi Zhang; Van Zeijl, H.; Wei, J.;
In Proc. IEEE Sensors,
2018. DOI: 10.1109/ICSENS.2018.8589630
Study of ultraviolet assisted cure mechanism of the phosphor/silicone composites used in White LEDs
Wang, Z.; Fan, J.; Liu, J.; Hu, A.; Qian, C.; Fan, X.; GuoQi Zhang;
In 19th International Conference on Electronic Packaging Technology, ICEPT 2018,
IEEE, pp. 525-530, 2018. DOI: 10.1109/ICEPT.2018.8480566
Interfacial Failure Characterization of Electronic Packaging Component Using a Multiscale Modelling Approach
Zhen Cui; Yingying Zhang; Qun Yang; GuoQi Zhang; Xianping Chen;
In IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM),
2018. DOI: 10.1109/EDTM.2018.8421434
Shining light on cardiac tachyarrhythmias
Nyns E CA; Bingen B O; Bart C I; Kip A; Poelma R H; Volkers L; Plomp J J; Jangsangthong W; Engels M C; Schalij M J; GuoQi Zhang; de Vries A AF; Pijnappels D A;
In Changing the Face of Modern Medicine: Stem Cell and Gene Therapy,
2018. DOI: 10.1089/hum.2018.29077.abstracts
Internal stress state of TQFP subjected to liquid thermal shock using piezoresistive silicon stress sensor
Prisacaru, A.; Sun, Y.; Gromala, P. J.; Han, B.; GuoQi Zhang;
In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE,
IEEE, pp. 1-3, 2018. DOI: 10.1109/EuroSimE.2018.8369955
Fatigue Damage Assessment of LED Chip Scale Packages with Finite Element Simulation
Fan, J.; Hu, A.; Pecht, M.; Chen, W.; Fan, X.; Xu, D.; GuoQi Zhang;
In 19th International Conference on Electronic Packaging Technology, ICEPT 2018,
IEEE, pp. pp. 1642-1648, 2018. DOI: 10.1109/ICEPT.2018.8480748
Three dimensional thermoacoustic device composed of nanoporous material and the method to fabricate such a device
Poelma, R.; GuoQi Zhang, G. Q.; Yi, H.; van Zeijl, H.;
Patent, NL 2017268, 2018. IPC No. H04R, Priority date 1 Aug 2016, Priority No. NL 2017268.
First-Principles Study of Nitric Oxide Sensor Based on Blue Phosphorus Monolayer
HC Luo; RS Meng; H Gao; X Sun; J Xiao; HY Ye; GuoQi Zhang; XP Chen;
IEEE Electron Device Letters,
Volume 38, Issue 8, pp. 1139-1142, 2017.
Effects of Graphene Monolayer Coating on the Optical Performance of Remote Phosphors
Maryam Yazdan Mehr; S. Vollebregt; W. D. van Driel; GuoQi Zhang;
Journal of Electronic Materials,
Volume 46, Issue 10, pp. 5866--5872, 2017. DOI: 10.1007/s11664-017-5592-8

Keywords: ...
graphene, Light-emitting diode, reliability, remote phosphor.
Color shift acceleration on mid-power LED packages
Guangjun Lu; Driel, W.D. van; Xuejun Fan; Jiajie Fan; Cheng Qian; GuoQi Zhang;
Microelectronics Reliability,
Volume 78, Issue Supplement C, pp. 294 -- 298, 11 2017. DOI: 10.1016/j.microrel.2017.09.014

Keywords: ...
Color shift, Mid-power LED package, Temperature stress, Current stress, Humidity stress.
Reliability and diffusion-controlled through thickness oxidation of optical materials in LED-based products
Yazdan Mehr, M.; M.R. Toroghinejad; F. Karimzadeh; van Driel, W.D.; GuoQi Zhang;
Microelectronics Reliability,
Volume 78, pp. 143--147, 2017. DOI: 10.1016/j.microrel.2017.08.014

Keywords: ...
BPA-PC, LED-based products, Optics, Oxidation, Yellowing.
Microstructure, hardness, and shear behavior of the as-soldered SnBi–SAC composite solder pastes
Y Liu; H Fu; H Zhang; F Sun; X Wang; GuoQi Zhang;
Journal of Materials Science: Materials in Electronics,
Volume 28, Issue 24, pp. 19113-19120, 2017.
Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component
Hongyu Tang; H Ye; CKY Wong; SYY Leung; J Fan; X Chen; X Fan; GuoQi Zhang;
Microelectronics Reliability,
Volume 78, pp. 197-204, 2017.
Phosphor–silicone interaction effects in high power white light emitting diode packages
J Fan; M Zhang; X Luo; C Qian; X Fan; A Ji; GuoQi Zhang;
Journal of Materials Science: Materials in Electronics,
Volume 28, Issue 23, pp. 17557-17569, 2017.
Photometric and Colorimetric Assessment of LED Chip Scale Packages by Using a Step-Stress Accelerated Degradation Test (SSADT) Method
C Qian; J Fan; J Fang; C Yu; Y Ren; X Fan; GuoQi Zhang;
Materials,
Volume 10, Issue 10, pp. 1181, 2017.
Modeling nonlinear moisture diffusion in inhomogeneous media
L Chen; J Zhou; H Chu; GuoQi Zhang; X Fan;
Microelectronics Reliability,
Volume 75, pp. 162-170, 2017.
Humidity sensor based on the ionic polymer metal composite
E Esmaeli; M Ganjian; H Rastegar; M Kolahdouz; Z Kolahdouz; GuoQi Zhang;
Sensors and Actuators B: Chemical,
Volume 247, pp. 498-504, 2017.
Silicon-based multi-functional wafer-level-package for LEDs in 7-mask BiCMOS process
Zahra Kolahdouz; T Ma; H Abdy; M Kolahdouz; H van Zeijl; GuoQi Zhang;
Sensors and Actuators A: Physical,
Volume 263, pp. 622-632, 2017.
Sensitive and Reversible Detection of Methanol and Water Vapor by In Situ Electrochemically Grown CuBTC MOFs on Interdigitated Electrodes
Sumit Sachdeva; Manjunath R. Venkatesh; Brahim El Mansouri; Jia Wei; Andre Bossche; Freek Kapteijn; GuoQi Zhang; Jorge Gascon; Louis C. P. M. de Smet; Ernst J. R. Sudhölter;
Small,
Volume 13, Issue 29, pp. 1604150, 2017.
Hybrid plasmonics slot THz waveguide for subwavelength field confinement and crosstalk between two waveguides
J Xiao; QQ Wei; DG Yang; P Zhang; N He; GuoQi Zhang; XP Chen;
IEEE Journal of Selected Topics in Quantum Electronics,
Volume 23, Issue 4, 2017.
Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package
Fengze Hou; T Lin; L Cao; F Liu; J Li; X Fan; GuoQi Zhang;
IEEE Transactions on Components, Packaging and Manufacturing Technology,
Volume 7, Issue 10, pp. 1721-1728, 2017.
Nitrogen Dioxide Gas Sensor Based on Monolayer SnS: A First-Principle Study
FF Hu; Hongyu Tang; CJ Tan; HY Ye; XP Chen; GuoQi Zhang;
IEEE Electron Device Letters,
Volume 38, Issue 7, pp. 983-986, 2017.
Thermal/luminescence characterization and degradation mechanism analysis on phosphor-converted white LED chip scale packages
J Fan; C Yu; C Qian; X Fan; GuoQi Zhang;
Microelectronics Reliability,
Volume 74, pp. 179-185, 2017.
A Reliability Prediction for Integrated LED Lamp With Electrolytic Capacitor-Free Driver
Bo Sun; X Fan; L Li; H Ye; W van Driel; GuoQi Zhang;
IEEE Transactions on Components and Packaging and Manufacturing Technology,
Volume 7, Issue 7, pp. 1081-1088, 2017.
Studies of the light output properties for a GaN based blue LED using an electro-optical simulation method
C Qian; Y Li; J Fan; X Fan; J Fu; L Zhao; GuoQi Zhang;
Microelectronics Reliability,
Volume 74, pp. 173-178, 2017.
Integrated virtual impactor enabled PM 2.5 sensor
Mingzhi Dong; E Iervolino; F Santagata; G Zhang; GuoQi Zhang;
IEEE Sensors Journal,
Volume 17, Issue 9, pp. 2814-2821, 2017.
A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation
Bo Sun; X Fan; H Ye; J Fan; C Qian; W van Driel; GuoQi Zhang;
Reliability Engineering & System Safety,
Volume 163, pp. 14-21, 2017.
Sulfur Dioxide and Nitrogen Dioxide Gas Sensor Based on Arsenene: A First-Principle Study
XP Chen; LM Wang; X Sun; RS Meng; J Xiao; HY Ye; GuoQi Zhang;
IEEE Electron Device Letters,
Volume 38, Issue 5, pp. 661-664, 2017.
Color shift modeling of light-emitting diode lamps in step-loaded stress testing
M Cai; D Yang; J Huang; M Zhang; X Chen; C Liang; S Koh; GuoQi Zhang;
IEEE Photonics Journal,
Volume 9, Issue 1, pp. 1-14, 2017.
Monolithically integrated light feedback control circuit for blue/UV LED smart package
Zahra K Esfahani; M Tohidian; H van Zeijl; M Kolahdouz; GuoQi Zhang;
IEEE Photonics Journal,
Volume 9, Issue 2, pp. 1-13, 2017.
Identification and robust control of the nonlinear photoelectrothermal dynamics of LED systems
J Dong; GuoQi Zhang;
IEEE Transactions on Industrial Electronics,
Volume 64, Issue 3, pp. 2215-2225, 2017.
Prediction of lumen depreciation and color shift for phosphor-converted white light-emitting diodes based on a spectral power distribution analysis method
C Qian; J Fan; X Fan; GuoQi Zhang;
IEEE Access,
Volume 5, pp. 24054-24061, 2017.
Color shift failure prediction for phosphor-converted white LEDs by modeling features of spectral power distribution with a nonlinear filter approach
J Fan; MG Mohamed; C Qian; X Fan; GuoQi Zhang; M Pecht;
Materials 10,
Volume 7, pp. 819, 2017.
Numerical Thermal Analysis and Optimization of Multi-Chip LED Module Using Response Surface Methodology and Genetic Algorithm
Hongy Tang; HY Ye; XP Chen; C Qian; XJ Fan; GuoQi Zhang;
IEEE Access,
Volume 5, Issue 5, pp. 16459-16468, 2017.
High aspect ratio spiral resonators for process variation investigation and MEMS applications
L. Middelburg; B. El Mansouri; H. van Zeijl; GuoQi Zhang; R. H. Poelma;
In Proc. IEEE Sensors,
2017.
An AlAs/germanene heterostructure with outstanding tunability of electronic properties
C Tan; Q Yang; H Ye; X Chen; GuoQi Zhang;
In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
2017.
Smart Systems Integration in the era of Solid State Lighting
GuoQi Zhang; H. van Zeijl; W.D. van Driel; R. Poelma; Z.K. Esfahani; M.R. Venkatesh; L. Middelburg; B. El Mansouri;
In Smart System Integration conference (SSI),
2017.
Horizontally aligned carbon nanotube scaffolds for freestanding structures with enhanced conductivity
Cinzia Silvestri; Federico Marciano; Bruno Morana; Violeta Podranovic; Sten Vollebregt; GuoQi Zhang; Pasqualina M Sarro;
In Micro Electro Mechanical Systems (MEMS), 2017 IEEE 30th International Conference on,
pp. 266-269, 2017.
Optimization of reflow soldering process for white LED chip-scale-packages on substrate
C Jiang; W Guo; J Fan; C Qian; X Fan; GuoQi Zhang;
In Electronic Packaging Technology (ICEPT), 2017 18th International Conference on,
2017.
Luminous flux modeling for high power LED automotive headlamp module
C Yu; J Fan; C Qian; X Fan; GuoQi Zhang;
In Electronic Packaging Technology (ICEPT), 2017 18th International Conference on,
2017.
Condition monitoring algorithm for piezoresistive silicon-based stress sensor data obtained from electronic control units
A Prisacaru; A Palczynska; PJ Gromala; B Han; GuoQi Zhang;
In Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th,
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Pt-AlGaN/GaN HEMT-Sensor for Hydrogen Sulfide (H2S) Detection
R Sokolovskij; E Iervolino; C Zhao; F Santagata; F Wang; H Yu; PM Sarro; GuoQi Zhang;
In Proceedings of Eurosensors,
pp. 463, 2017.
A PoF and statistics combined reliability prediction for LED arrays in lamps
B Sun; X Fan; J Fan; C Qian; GuoQi Zhang;
In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
2017.
Electrical and optical properties of NO and H2S adsorption on Arsenic Phosphorus
Y Zhang; K Zheng; X Chen; GuoQi Zhang; C Tan; Q Yang; J Jiang; H Ye;
In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
2017.
SnS monolayer as gas sensors: Insights from a first-principles investigation
F Hu; C Tan; H Ye; X Chen; GuoQi Zhang;
In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
2017.
In-situ characterization of moisture absorption and hygroscopic swelling of silicone/phosphor composite film and epoxy mold compound in LED packaging
I Khalilullah; T Reza; L Chen; AKMMH Mazumder; J Fan; C Qian; GuoQi Zhang; X Fan;
In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
2017.
Adsorption of gases on monolayer GeSe: A first principle study
L Liu; Q Yang; H Ye; X Chen; GuoQi Zhang;
In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
2017.
First principle design of CdS/germanene heterostructures with tunable electronic and transport properties
K Zheng; H Ye; GuoQi Zhang; Y Zhang; L Liu; J Jiang; Q Yang; C Tan; X Chen;
In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
2017.
The intriguing electronic and optical properties modulation in blue phosphorene/g-III-nitrides heterostructures
Q Yang; C Tan; H Ye; X Chen; GuoQi Zhang;
In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
2017.
Luminescence mechanism analysis on high power tunable color temperature Chip-on-Board white LED modules
J Fan; C Xie; C Qian; X Fan; GuoQi Zhang;
In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
2017.
Effects of phosphor dispersion on optical characteristics of LED Chip Scale Package LEDs
C Qian; LL Luo; JJ Fan; XQ Li; XJ Fan; GuoQi Zhang;
In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
2017.
Prognostics and health monitoring of electronic system: A review
A Prisacaru; PJ Gromala; MB Jeronimo; B Han; GuoQi Zhang;
In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on,
2017.
Thermal conductivity of functionalized graphene-polymer nanocomposite: A non-equilibrium molecular dynamics study
Hongyu Tang; Huaiyu Ye; Xianping Chen; Xuejun Fan; GuoQi Zhang;
In EurosimE,
2017.
An accelerated test method of luminous flux depreciation for LED luminaires and lamps
C. Qian; X.J.Fan; J.J.Fan; C.A.Yuan; GuoQi Zhang;
Reliability Engineering and System Safety,
Volume 147, pp. 84-92, 2016.
PoF-Simulation Assisted Reliability Prediction for Electrolytic Capacitor in LED Drivers
Bo Sun; Xuejun Fan; Cheng Qian; GuoQi Zhang;
IEEE Transactions on Industrial Electronics,
pp. 99, 2016.
A CMOS-Compatible Hybrid Plasmonic Slot Waveguide With Enhanced Field Confinement
Jing Xiao; Qi-Qin Wei; Dao-Guo Yang; Ping Zhang; Ning He; GuoQi Zhang;
IEEE Electron Device Letters,
Volume 37, Issue 4, 2016.
Degradation Mechanism Decoupling of Mid-Power White-Light LEDs by SPD Simulation
Jianlin Huang; D. S. Golubović; S. Koh; D. Yang; X. Li; X. Fan; GuoQi Zhang;
IEEE Transactions on Electron Devices,
Volume 63, pp. 2807-2814, 2016.
Output blue light evaluation for phosphor based smart white LED wafer level packages
Z. Kolahdouz; A. Rostamian; M. Kolahdouz; T. Ma; H. van Zeijl; GuoQi Zhang;
Optics Express,
Volume 24, Issue 4, pp. 174-177, 2016.
Silicon microfabrication based particulate matter sensor
Mingzhi Dong; Elina Iervolino; Fabio Santagata; GuoQi Zhang;
Sensors and Actuators A: Physical,
Volume 247, pp. 115-124, 2016.
Thermally induced oxidative growth of copper oxide nanowire on dendritic micropowder and reductive conversion to copper nanowire
A. M. Gheytaghi; S.H. Tabatabaie; H. Saffari; GuoQi Zhang;
Micro and Nano Letters,
Volume 11, Issue 8, pp. 412, 2016.
Thermal characterization of carbon nanotube foam using MEMS microhotplates and thermographic analysis
Cinzia Silvestri; Michele Riccio; Rene Poelma; Bruno Morana; Sten Vollebregt; Fabio Santagata; Andrea Irace; GuoQi Zhang; Pasqualina M. Sarro;
Nanoscale,
Volume 8, pp. 8266-8275, 2016.
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Stretchable Binary Fresnel Lens for Focus Tuning
Xueming Li; Lei Wei; Ren� H. Poelma; Sten Vollebregt; Jia Wei; Hendrik Paul Urbach; Pasqualina M. Sarro; GuoQi Zhang;
Scientific Reports,
Volume 6, pp. 25348, 2016.
Effects of Nanostructure and Coating on the Mechanics of Carbon Nanotube Arrays
R. H. Poelma; X. J. Fan; Z. Y. Hu; G. van Tendeloo; H.W. van Zeijl; GuoQi Zhang;
Advanced Functional Materials,
Volume 26, Issue 8, pp. 1233-1242, 2016.
A review of small heat pipes for electronics
Xianping Chen; Huaiyu Ye; Xuejun Fan; Tianling Ren; GuoQi Zhang;
Applied Thermal Engineering,
Volume 96, pp. 1-17, 2016.
A Systematic Approach for Reliability Assessment of Electrolytic Capacitor-Free LED Drivers
Bo Sun; Xuejun Fan; van Driel, Willem; GuoQi Zhang;
United States: IEEE, , pp. 1--5, 4 2016. DOI: 10.1109/EuroSimE.2016.7463387

Keywords: ...
Reliability, MOSFET, Electrolytic Capacitor-Free LED Driver.
Lumen Decay Prediction in LED Lamps
Bo Sun; Xuejun Fan; van Driel, Willem; Thomas Michel; Jiang Zhou; GuoQi Zhang;
United States: IEEE, , pp. 1--5, 4 2016. DOI: 10.1109/EuroSimE.2016.7463391

Keywords: ...
Reliability, LED Lamp, Lumen Decay Prediction.
Reliability optimization of gold-tin eutectic die attach layer in HEMT package
Hao Zhang; Jiajie Fan; Jing Zhang; Cheng Qian; Xuejun Fan; Fenglian Sun; Guoqi Zhang;
In 13th China International Forum on Solid State Lighting (SSLChina),
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Metallic Nanoparticle Based Interconnect for Heterogeneous 3D Integration
Zeijl, H. W. V.; Y. Carisey; A. Damian; R. H. Poelma; A. Zinn; GuoQi Zhang;
In IEEE 66th Electronic Components and Technology Conference (ECTC),
2016.
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Tailoring material properties for 3D microfabrication: In-situ experimentation and multi-scale modelling
Poelma, R. H.; X. J. Fan; E. Schlangen; H. W. v. Zeijl; GuoQi Zhang;
In 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
2016.
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3D interconnect technology based on low temperature copper nanoparticle sintering
Boyao Zhang; Y. C. P. Carisey; A. Damian; R. H. Poelma; GuoQi Zhang; H. W. v. Zeijl;
In 17th International Conference on Electronic Packaging Technology (ICEPT),
2016.
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Precision recess of AlGaN/GaN with controllable etching rate using ICP-RIE oxidation and wet etching
R. Sokolovskij; J. Sun; F. Santagata; E. Iervolino; S. Li; G.Y. Zhang; P.M.Sarro; GuoQi Zhang;
In Procedia Engineering: Proceedings of the 30th anniversary Eurosensors Conference,
pp. 1094-1097, 2016.
Solving the Nonlinear Heat Conduction in a Spherical Coordinate with Electrical Simulation
A. M. Gheitaghy; H. Saffari; GuoQi Zhang;
In 18th International Conference on Thermal Engineering,
2016.
Thermal analysis and optimization of IGBT power electronic module based on layout model
Hongyu Tang; Huaiyu Ye; Mingming Wang; Xuejun Fan; GuoQi Zhang;
In ICEPT,
2016.
Design and fabrication of a foldable 3D silicon based package for solid state lighting applications
R. Sokolovskij; Pan Liu; H.W. van Zeijl; B. Mimoun; GuoQi Zhang;
Journal of Micromechanics and Microengineering,
Volume 25, Issue 5, pp. 055017, 2015.
Optimization of LED light spectrum to enhance colorfulness of illuminated objects with white light constraints
H. Wu; J. Dong; G. Qi; GuoQi Zhang;
Journal of the Optical Society of America A,
Volume 32, Issue 7, pp. 1262-1270, 2015.
Optimal Design of Life Testing for High Brightness White LEDs Using the Six Sigma DMAIC Approach
Chuen Yung; Xuejun Fan; GuoQi Zhang; Michael Pecht;
IEEE Transactions on Device and Materials Reliability,
Volume 15, Issue 4, pp. 576-587, 2015.
Ab Initio Study of Temperature, Humidity, and Covalent Functionalization-Induced Bandgap Change of Single-Walled Carbon Nanotubes
Xian-Ping Chen; Ning Yang; Jun-Ke Jiang; Qiu-Hua Liang; Dao-Guo Yang; GuoQi Zhang;
IEEE Electron Device Letters,
Volume 36, Issue 6, 2015.
Rapid degradation of mid-power white-light LEDs in saturated moisture conditions
Jianlin Huang, D. S. Golubovic, S. Koh, D. Yang, X. Li, X. Fan,; GuoQi Zhang;
IEEE Transactions on Device and Materials Reliability,
Volume 15, Issue 4, pp. 478-485, 2015.
Light-Emitting n-ZnO Nanotube/n+-GaAs Heterostructures Processed at Low Temperatures
F. Karegar; M. Kolahdouz; F. D. Nayeri; R. Soleimanzadeh; M. Hosseini; Z Kolahdouz; GuoQi Zhang;
IEEE Photonics Technology Letters,
Volume 27, Issue 13, pp. 1430-1433, 2015.
Degradation modeling of mid-power white-light LEDs by using Wiener process
Jianlin Huang; D. S. Golubović; S. Koh; D. Yang; X. Li; X. Fan; GuoQi Zhang;
Optics Express,
Volume 23, pp. A966-A978, 2015.
Sequential microwave-assisted ultra-fast ZnO nanorod growth on optimized sol–gel seedlayers
R. Soleimanzadeh; M. S. S. Mousavi; A. Mehrfar; Z. Kolahdouz; M. Kolahdouz; GuoQi Zhang;
Journal of Crystal Growth,
Volume 426, pp. 228-233, 2015.
Optical degradation mechanisms of mid-power white-light LEDs in LM-80-08 tests
Jianlin Huang, D. S. Golubović, S. Koh, D. Yang, X. Li, X. Fan,; GuoQi Zhang;
Microelectronics Reliability,
Volume 55, Issue 2654-2662, 2015.
Highly selective and responsive ultra-violet detection using an improved phototransistor
R. Soleimanzadeh; M. Kolahdouz; M. A. Charsooghi; Z. Kolahdouz; GuoQi Zhang;
Applied Physics Letters,
Volume 106, Issue 23, pp. 231102, 2015.
Degradation Mechanisms of Mid-power White-light LEDs under High Temperature-Humidity Conditions
Jianlin Huang; D.S. Golubović; S. Koh; D. Yang; X. Li; X. Fan; GuoQi Zhang;
IEEE Transactions on Device and Materials Reliability,
Volume 15, Issue 2, pp. 220-228, 2015.
Degradation of Microcellular PET Reflective Materials Used in LED-based Products
Guangjun Lu; W.D. van Driel; Xuejun Fan; M. Yazdan Mehr; Jiajie Fan; K.M.B. Jansen; GuoQi Zhang;
Optical Materials,
Volume 49, pp. 79-84, 2015.
Color shift investigations for LED secondary optical designs: Comparison between BPA-PC and PMMA
Guangjun Lu; M. Yazdan Mehr; W.D. van Driel; Xuejun Fan; Jiajie Fan; K.M.B. Jansen; GuoQi Zhang;
Optical Materials,
Volume 45, pp. 37-41, 2015.
3D system-in-package design using stacked silicon submount technology
Mingzhi Dong; Fabio Santagata; Robert Sokolovskij; Jia Wei; Cadmus Yuan; GuoQi Zhang;
Microelectronics International,
Volume 32, Issue 2, pp. 63-72, 2015.
Mechanics of graphene and carbon nanotubes under uniaxial compression and tension
R. H. Poelma; GuoQi Zhang;
In Molecular Modeling and Multiscaling Issues for Electronic Materials Applications,
Springer, 2015.
Tunable binary fresnel lens based on stretchable PDMS/CNT compsite
Xueming Li; L. Wei; S. Vollebregt; R. Poelma; Y. Shen; Jia Wei; P. Urbach; P.M. Sarro; GuoQi Zhang;
In Transducers,
pp. 2041-2044, 2015.
Modelling of Carbon Nanotube Arrays with Analytical and Numerical Methods
X. J. Fan; R. H. Poelma; L. Chen; GuoQi Zhang;
In ASME International Mechanical Engineering Congress and Exposition,
2015.
Fabrication and application of temperature triggered MEMS switch for active cooling control in solid state lighting system
Huaiyu Ye; Jai Wei; van Zeijl, HW; Sarro, PM; GuoQi Zhang;
Microelectronics Reliability,
Volume 54, Issue 6-7, pp. 1338-1343, 2014.
Surface aspects of discolouration in Bisphenol A Polycarbonate (BPA-PC), used as lens in LED-based products
Maryam Yazdan Mehr; W. D. van Driel; H. Udono; GuoQi Zhang;
Optical Materials,
Volume 37, pp. 155-159, 2014.
Electrical-thermal-luminous-chromatic model of phosphor-converted white light-emitting diodes
Huaiyu Ye; Sau Wee Koh; Cadmus Yuan; Henk van Zeijl; Alexander W.J. Gielen; Shi-Wei Ricky Lee; GuoQi Zhang;
Applied Thermal Engineering,
Volume 63, Issue 2, pp. 588-597, 2014.
Thermal and mechanical effects of voids within flip chip soldering in LED packages
Yang Liu; Stanley Y.Y. Leung; Jia Zhao; Cell K.Y. Wong; Cadmus A. Yuan; GuoQi Zhang; Fenglian Sun; Liangliang Luo;
Microelectronics Reliability,
Volume 54, Issue 9-10, pp. 2028-2033, 2014.
Reliability and optical properties of LED lens plates under high temperature stress
Maryam Yazdan Mehr; van Driel, WD; Koh, SW; GuoQi Zhang;
Microelectronics Reliability,
2014.
Tailoring the Mechanical Properties of High-Aspect-Ratio Carbon Nanotube Arrays using Amorphous Silicon Carbide Coatings
Poelma, RH; Morana, Bruno; Vollebregt, Sten; Schlangen, Erik; van Zeijl, HW; Fan, Xuejun; Zhang, GuoQi;
Advanced Functional Materials,
Volume 24, Issue 36, pp. 5737-5744, 2014.
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Accelerated life time testing and optical degradation of remote phosphor plates
Maryam Yazdan Mehr; van Driel, WD; GuoQi Zhang;
Microelectronics Reliability,
Volume 54, Issue 8, pp. 1544-1548, 2014.
A polymer based miniature loop heat pipe with silicon substrate and temperature sensors for high brightness light-emitting
Huaiyu Ye; Sokolovskij, R; van Zeijl, HW; Gielen, AWJ; GuoQi Zhang;
Microelectronics Reliability,
Volume 54, Issue 6-7, pp. 1355-1362, 2014.
Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products
Maryam Yazdan Mehr; van Driel, WD; Jansen, KMB; Deeben, P; GuoQi Zhang;
Microelectronics Reliability,
Volume 54, Issue 1, pp. 138-142, 2014.
Multi-physics reliability simulation for solid state lighting drivers
Tarashioon, S; van Driel, WD; GuoQi Zhang;
Microelectronics Reliability,
Volume 54, Issue 6-7, pp. 1212-1222, 2014.
Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging
Yang Liu; Joost Meerwijk; Liangliang Luo; Honglin Zhang; Fenglian Sun; Cadmus A. Yuan; GuoQi Zhang;
Journal of Materials Science: Materials in Electronics,
Volume 25, Issue 11, pp. 4954-4959, 2014.
Fracture toughness of Cu-EMC interfaces in pressurized steam
Sadeghinia, M; Jansen, KMB amd Ernst, LJ; Pape, H; Maus, I; van Driel, WD; GuoQi Zhang;
International Journal of Adhesion and Adhesives,
Volume 49, pp. 73-79, 2014.
Establishment of the Mesoscale Parameters for Separation: A Nonequilibrium Molecular Dynamics Model
Cell K. Y. Wong; S. Y. Y. Leung; R. H. Poelma; K. M. B. Jansen; C. C. A. Yuan; W. D. van Driel; GuoQi Zhang;
In Molecular Modeling and Multiscaling Issues for Electronic Material Applications,
Springer, 2014.
Reliability of LED-based Products is a Matter of Balancing Temperatures
Maryam Yazdan Mehr; W.D. van Driel; GuoQi Zhang;
In Therminic Conference,
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Vertical Interconnect technology for Wafer-Level-Packaging and 3D Integration
H. W. v. Zeijl; R. H. Poelma; L. Wang; E. Boschman; F. Boschman; GuoQi Zhang;
In nanoFIS 2014 - Functional Integrated nanoSystems,,
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Correlation of activation energy between LEDs and luminaires in the lumen depreciation test
Guangjun Lu; Yuan, C; Fan, X; GuoQi Zhang;
In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
pp. 1-3, 2014.
A novel design of heatsink-less LED base fluorescent lamp retrofit
Y. L. Jia Zhao; Hongyu Tang; Stanley Y Y Leung; Cadmus C A Yuan; GuoQi Zhang;
In ICEPT2014,
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Numerical modeling of flexible actuator for dynamic lighting
Teng Ma; Xueming Li; Jia Wei; GuoQi Zhang; P. M. Sarro;
In 15th International Conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems,
2014.
High Accelerated Optical Remote Phosphor Aging Studies for LED Luminaire Applications
W. D. v. Driel; Maryam Yazdan Mehr; GuoQi Zhang;
In 11th China SSL conference,
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Blue Selective Photodiodes for Optical Feedback in LED Wafer Level Packages
Z. Kolahdouz; A. Rostamian; M. Kolahdouz; T. Ma; H. V. Zeijl; GuoQi Zhang;
In Solid-State Device Research Conference (ESSDERC), 2014 Proceedings of the European,
pp. 174-177, 2014.
Electro-thermal simulation and characterization of vertically aligned CNTs directly grown on a suspended microhoplate for thermal management applications
C. Silvestri; P. Piacciafoco; B. Morana; F. Santagata; GuoQi Zhang; P.M. Sarro;
In IEEE Sensors,
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Miniaturized particulate matter sensor for portable air quality monitoring devices
Xueming Li; E Iervolino; F Santagata; Jia Wei; Cadmus Yuan; PM Sarro; GuoQi Zhang;
In IEEE Sensors,
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Colour shift in remote phosphor based LED products
Maryam Yazdan Mehr; Driel, WD van; GuoQi Zhang;
In Proceedings - 64th Electronic Components and Technology Conference,
pp. 1477-1481, 2014.
Influences of viscoelasticity of polybutylene terephthalate (PBT) on the thermal interface contact of LED spotlight module
Hongyu Tang; Yu, Y; Jia, M; Leung, SYY; Qian, C; Cadmus Yuan; Zhou, X; GuoQi Zhang;
In Proceedings of the 15th International Conference on Electronic Packaging Technology,
pp. 1198-1201, 2014.
Investigation of lumen degradation mechanisms of mid-power LED by HAST
Jianlin Huang; Koh, SW; Xueming Li; GuoQi Zhang;
In Proceedings of the 15th International Conference on Electronic Packaging Technology,
pp. 1437-1441, 2014.
Reliability and accelerated test methods for plastic materials in LED-based products
Maryam Yazdan Mehr; van Driel, WD; GuoQi Zhang;
In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
pp. 1-5, 2014.
Modeling and simulation of monolithic integration of rectifiers for solid state lighting applications
Venkatesh, MR; Liu, P; van Zeijl, HW; GuoQi Zhang;
In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
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A lifetime prediction method for Solid State Lighting power converters based on SPICE models and finite element thermal simulations
Bo Sun; Fan, X; Zhao, L; Yuan, CA; Koh, SW; GuoQi Zhang;
In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
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Thermal performance of embedded heat pipe in high power density LED streetlight module
Hongyu Tang; Zhao, J; Li, B; Leung, SYY; Yuan, CCA; GuoQi Zhang;
In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
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High aspect ratio lithography for litho-defined wire bonding
Esfahani, ZK; van Zeijl, HW; GuoQi Zhang;
In Proceedings - 64th Electronic Components and Technology Conference,
pp. 1556-1561, 2014.
CNT bundles growth on microhotplates for direct measurement of their thermal properties
C. Silvestri; B. Morana; G. Fiorentino; S. Vollebregt; G. Pandraud; F. Santagata; GuoQi Zhang; P.M. Sarro;
In 27th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2014),
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Investigation of color shift of LEDs-based lighting products
Koh, SW; Huaiyu Ye; Maryam Yazdan Mehr; Jia Wei; van Driel, WD; Zhao, LB; GuoQi Zhang;
In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
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Novel system-in-package design and packaging solution for solid state lighting systems
Mingzhi Dong; Santagata, F; Jia Wei; Yuan, C; GuoQi Zhang;
In Proceedings - 64th Electronic Components and Technology Conference,
pp. 1192-1197, 2014.
Adapting LED lighting to compensate the influence of ambient light on the light color
J.D.H. Wu; GuoQi Zhang;
In 11th China SSL conference,
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Through-polymer via (TPV) and method to manufacture such a via
H.W. van Zeijl; R.H. Poelma; GuoQi Zhang;
Dutch patent, 2014.
Photodegradation of bisphenol A polycarbonate under blue light radiation and its effect on optical properties
Maryam Yazdan Mehr; W. D. van Driel; K. M. B. Jansen; P. Deeben; M. Boutelje; GuoQi Zhang;
Optical Materials,
Volume 35, pp. 504-508, 2013.
Thermal Analysis of Remote Phosphor in LED Modules
Mingzhi Dong; Jia Wei; Huaiyu Ye; Cadmus Yuan; GuoQi Zhang;
Journal of Semiconductors,
Volume 34, Issue 5, pp. 053007-1-3, 2013.
Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems
F. Santagata; C. Farriciello; G. Fiorentino; H.W. van Zeijl; C. Silvestri; GuoQi Zhang; P.M. Sarro;
Journal of Micromechanics and Microengineering,
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Cause analysis on highly depreciated indoor LED product in CSA020
Guangjun Lu; Yuan C; Hongyu Tang; Wong C; Fan XJ; GuoQi Zhang;
In Proceedings of China Solid State Lighting Forum,
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Validation of the methodology of lumen depreciation acceleration of LED lighting
Guangjun Lu; Yuan C; Sun B; Li B; Fan XJ; GuoQi Zhang;
In Proceedings of China Solid State Lighting Forum,
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Thermal Analysis for Silicon-based Integration of LED Systems
Mingzhi Dong; Fabio Santagata; Jia Wei; Cadmus Yuan; GuoQi Zhang;
In 10th China International Forum on Solid State Lighting,
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Carbon Nanotube based heat-sink for solid state lighting
F. Santagata; G. Almanno; S. Vollebregt; C Silvestri; GuoQi Zhang; P.M. Sarro;
In 8th IEEE Int. Conf. Nano/Micro Engineered and Molecular Systems (NEMS),
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Molecular modeling of protonic acid doping of emeraldine base polyaniline for chemical sensors
X.P. Chen; C. Yuan; C.K.Y. Wong; H. Ye; S.Y.Y. Leung; GuoQi Zhang;
Sensors and Actuators B: Chemical,
Volume 174, pp. 210-216., 2012. DOI 10.1016/j.snb.2012.08.042.
Effects of single vacancy defect position on the stability of carbon nanotubes
R.H. Poelma; H. Sadeghian; S. Koh; GuoQi Zhang;
Microelectronics Reliability Journal,
Volume 52, Issue 7, pp. 1279-1284, Jul. 2012. DOI 10.1016/j.microrel.2012.03.015.
An approach to �Design for Reliability� in solid state lighting systems at high temperatures
S. Tarashioon; A. Baiano; H. van Zeijl; C. Guo; S.W. Koh; W.D. van Driel; GuoQi Zhang;
Microelectronics Reliability,
Volume 52, Issue 5, pp. 783-793, May 2012. DOI 10.1016/j.microrel.2011.06.029.
Diagnosing lumen depreciation in LED lighting systems: An estimation approach
J. Dong; A. Pandharipande; W. van Driel; GuoQi Zhang;
IEEE Transactions on Signal Processing,
Volume 60, Issue 7, pp. 3796-3808, Jul. 2012. DOI 10.1109/TSP.2012.2192114.
Analytical large deflection method for carbon nanotube young�s modulus determination
N. Tolou; A. Khiat; GuoQi Zhang; J.L. Herder;
International Journal of Nonlinear Sciences and Numerical Simulation,
Volume 12, Issue 1-8, pp. 51-58, Feb. 2012. DOI 10.1515/ijnsns.2011.300.
Establishment of the coarse grained parameters for epoxy-copper interfacial separation
C.K.Y. Wong; S.Y.Y. Leung; R.H. Poelma; K.M.B. Jansen; C.C.A. Yuan; W.D. van Driel; GuoQi Zhang;
Journal of Applied Physics,
Volume 111, Issue 9, pp. 094906/1-094906, May 2012. DOI 10.1063/1.4712060.
Mechanical characterization of individual polycrystalline carbon tubes for use in electrical nano-interconnects
A. Khiat; R.H. Poelma; GuoQi Zhang; F. Heuck; F.D. Tichelaar; M. Sarno; P. Ciambelli; S. Fontorbes; L. Arurault; U. Staufer;
Microelectronic Engineering,
Volume 98, pp. 317-320, Oct. 2012. DOI 10.1016/j.mee.2012.07.087.
The mechanical properties modeling of nano-scale materials by molecular dynamics
C. Yuan; W.D. Driel; R.H Poelma; GuoQi Zhang;
In Molecular Modeling and Multiscaling for Electronic Material Applications,
Springer, 2012. DOI 10.1007/978-1-4614-1728-6_8.
Semi empirical low cycle fatigue crack growth analysis of nanostructure chip-to-package copper interconnect using molecular simulation
S. Koh; A. Saxena; W.D. van Driel; GuoQi Zhang; R. Tummala;
In Molecular Modeling and Multiscaling for Electronic Material Applications,
Springer, 2012. DOI 10.1007/978-1-4614-1728-6_5.
Single-mask fabrication of temperature triggered MEMS switch for cooling control in SSL system
J. Wei; H. Ye; H.W. van Zeijl; P.M Sarro; GuoQi Zhang;
In R. Walczak; J. Dziuban (Ed.), Proc. Eurosensors XXVI,
Krakow, Poland, Procedia Engineering, pp. 849-852, Sep 2012. DOI 10.1016/j.proeng.2012.09.280.
Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems
F. Santagata; G. Fiorentino; M. Nie; C. Farriciello; R. Poelma; GuoQi Zhang; P.M. Sarro;
In Proc. 11th IEEE Sensors Conference,
Taipei, Taiwan, pp. 668-671, Oct 2012.
Simulation and qualification of a system-in-package (SiP) based solid state lighting (SSL) module
D.M. Farley; F. Boschman; J.E. Bullema; A.W.J. Gielen; P. Hesen; J.P.H.M. Krugers; F. Swartjes; H.W. van Zeijl; GuoQi Zhang;
In Proc. 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
Cascais, Portugal, pp. 1-3, Apr 2012. ISBN 978-1-4673-1511-1; DOI 10.1109/ESimE.2012.6191780.
Monitoring of meniscus motion at nozzle orifice with capacitive sensor for inkjet applications
J. Wei; C. Yue; GuoQi Zhang; J.F. Dijksman; P.M. Sarro;
In Proc. 11th IEEE Sensors Conference,
Taipei, Taiwan, pp. 2172-2175, Oct 2012.
Thermal and moisture degradation in SSL system
S. Koh; W.D. van Driel; GuoQi Zhang;
In 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
Lisbon, Portugal, pp. 1-6, Apr. 2012. DOI 10.1109/ESimE.2012.6191806.
System approach for reliability of low-power power electronics: How to break down into their constructed parts
S. Tarashioon; W.D. van Driel; GuoQi Zhang;
In 7th International Conference on Integrated Power Electronics Systems (CIPS 2012),
Nuremberg, Germany, pp. 1-5, Mar. 2012.
Dynamic thermal simulation of high brightness LEDs with unsteady driver power output
H. Ye; S. Koh; J. Wei; H.W. van Zeijl; GuoQi Zhang;
In 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
Lisbon, Portugal, Apr. 2012. DOI 10.1109/ESimE.2012.6191768.
Establishment of the mesoscale parameters for epoxy-copper interfacial separation
C.K.Y. Wong; S.Y.Y. Leung; R.H. Poelma; K.M.B. Jansen; C.C.A. Yuan; W.D. van Driel; GuoQi Zhang;
In 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
Lisbon, Portugal, Apr. 2012. DOI 10.1109/ESimE.2012.6191737.
Molecular modeling of the conductivity changes of the emeraldine base polyaniline due to protonic acid doping
X. Chen; C. Yuan; C. Wong; GuoQi Zhang;
In 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
Cascais, Portugal, Apr. 2012. ISBN 978-1-4673-1511-1; DOI 10.1109/ESimE.2012.6191741.
A review of passive thermal management of LED module
H. Ye; S. Koh; H. Zeijl; A.W.J. Gielen; GuoQi Zhang;
Journal of Semiconductors,
Volume 32, Issue 1, pp. 1-4, 2011. DOI 10.1088/1674-4926/32/1/014008.
Validation of forcefields in predicting the physical and thermophysical properties of emeraldine base polyaniline
X.P. Chen; C.A. Yuan; C.K.Y. Wong; S.W. Koh; GuoQi Zhang;
Molecular Simulation,
Volume 37, Issue 12, pp. 990-996, Oct. 2011. DOI 10.1080/08927022.2011.562503.
Molecular modeling of temperature dependence of solubility parameters for amorphous polymers
X.P. Chen; C.A. Yuan; C.K.. Wong; GuoQi Zhang;
Journal of Molecular Modeling,
pp. 1-9, Oct. 2011. DOI 10.1007/s00894-011-1249-3.
A numerical experimental approach for characterizing the elastic properties of thin films: Application of nanocantilevers
R.H. Poelma; H. Sadeghian; S.P.M. Noijen; J.J.M. Zaal; GuoQi Zhang;
Journal of Micromechanics and Microengineering,
Volume 21, Issue 6, pp. 1-11, 2011. DOI 10.1088/0960-1317/21/6/065003.
Evaluation and selection of sensing materials for carbon dioxide (CO2) sensor by molecular modeling
X.P. Chen; C.K.Y. Wong; C.A. Yuan; GuoQi Zhang;
In C. Tsamis; G. Kaltas (Ed.), Proc. Eurosensors XXV,
Athens, Greece, Procedia Engineering, pp. 379-382, Sep. 2011. DOI 10.1016/j.proeng.2011.12.094.
Buckling analysis of carbon nanotubes and the influence of defect position
R.H. Poelma; H. Sadeghian; S.W. Koh; GuoQi Zhang;
In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
Linz, Austria, pp. 1-7, Apr. 2011. ISBN 978-1-4577-0106-1; DOI 10.1109/ESIME.2011.5765864.
Thermal analysis of HB LED packages and advanced materials
H. Ye; A.W.J. Gielen; H.W. vanZeijl; GuoQi Zhang;
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Co-design of wafer level thin film package assembly
J.J.M. Zaal; F. Santagata; W.D. van Driel; GuoQi Zhang; J.F. Creemer; P.M. Sarro;
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Numerical modeling of thermal performance: Natural convection and radiation of solid state lighting
H. Ye; A.W.J. Gielen; H.W. vanZeijl; R.J. Werkhoven; GuoQi Zhang;
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Degradation of epoxy lens materials in LED systems
S. Koh; W.D. van Driel; GuoQi Zhang;
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Linz, Austria, pp. 1-5, Apr. 2011. ISBN 978-1-4577-0106-1; DOI 10.1109/ESIME.2011.5765850.
Molecular Dynamics study of the traction-displacement relations of epoxy-copper interfaces
C.K.Y. Wong; S.Y.Y. Leung; R.H. Poelma; K.M.B. Jansen; C.A. Yuan; W.D. van Driel; GuoQi Zhang;
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