researcher profile

Publications

  1. Horizontally aligned carbon nanotube scaffolds for freestanding structures with enhanced conductivity
    Cinzia Silvestri; Federico Marciano; Bruno Morana; Violeta Podranovic; Sten Vollebregt; Kouchi Zhang; Pasqualina M Sarro;
    In Micro Electro Mechanical Systems (MEMS), 2017 IEEE 30th International Conference on,
    pp. 266-269, 2017.

  2. Smart Systems Integration in the era of Solid State Lighting
    Kouchi Zhang; H. van Zeijl; W.D. van Driel; R. Poelma; Z.K. Esfahani; M. R.Venkatesh; L. Middelburg; B. El Mansouri;
    In Smart System Integration conference (SSI),
    2017.

  3. Effects of Nanostructure and Coating on the Mechanics of Carbon Nanotube Arrays
    R. H. Poelma; X. J. Fan; Z. Y. Hu; G. van Tendeloo; H.W. van Zeijl; Kouchi Zhang;
    Advanced Functional Materials,
    Volume 26, Issue 8, pp. 1233-1242, 2016.

  4. A review of small heat pipes for electronics
    Xianping Chen; Huaiyu Ye; Xuejun Fan; Tianling Ren; Kouchi Zhang;
    Applied Thermal Engineering,
    Volume 96, 2016.

  5. Stretchable Binary Fresnel Lens for Focus Tuning
    Xueming Li; Lei Wei; René H. Poelma; Sten Vollebregt; Jia Wei; Hendrik Paul Urbach; Pasqualina M. Sarro; Kouchi Zhang;
    Scientific Reports,
    Volume 6, pp. 25348, 2016.

  6. Thermal characterization of carbon nanotube foam using MEMS microhotplates and thermographic analysis
    Cinzia Silvestri; Michele Riccio; Rene Poelma; Bruno Morana; Sten Vollebregt; Fabio Santagata; Andrea Irace; Kouchi Zhang; Pasqualina M. Sarro;
    Nanoscale,
    Volume 8, pp. 8266-8275, 2016.
    document

  7. Thermally induced oxidative growth of copper oxide nanowire on dendritic micropowder and reductive conversion to copper nanowire
    A. M. Gheitaghy; S.H. Tabatabaie; H. Saffari; Kouchi Zhang;
    Micro and Nano Letters,
    Volume 11, Issue 8, pp. 412, 2016.

  8. Output blue light evaluation for phosphor based smart white LED wafer level packages
    Z. Kolahdouz; A. Rostamian; M. Kolahdouz; T. Ma; H. van Zeijl; Kouchi Zhang;
    Optics Express,
    Volume 24, Issue 4, pp. 174-177, 2016.

  9. Silicon microfabrication based particulate matter sensor
    Mingzhi Dong; Elina Iervolino; Fabio Santagata; Guoyi Zhang; Kouchi Zhang;
    Sensors and Actuators A: Physical,
    Volume 247, pp. 115-124, 2016.

  10. Colour shift and mechanism investigation on the PMMA diffuser used in LED based luminaires
    Guangjun Lu; W.D. van Driel; Xuejun Fan; M. Yazdan Mehr; Jiajie Fan; Cheng Qian; K.M.B. Jansen; Kouchi Zhang;
    Optical Materials,
    Volume 54, pp. 282-287, 2016.

  11. Degradation Mechanism Decoupling of Mid-Power White-Light LEDs by SPD Simulation
    Jianlin Huang; D. S. Golubović; S. Koh; D. Yang; X. Li; X. Fan; Kouchi Zhang;
    IEEE Transactions on Electron Devices,
    Volume 63, pp. 2807-2814, 2016.

  12. PoF-Simulation Assisted Reliability Prediction for Electrolytic Capacitor in LED Drivers
    Bo Sun; Xuejun Fan; Cheng Qian; Kouchi Zhang;
    IEEE Transactions on Industrial Electronics,
    pp. 99, 2016.

  13. A review of small heat pipes for electronics
    Xianping Chen; Huaiyu Ye; Xuejun Fan; Tianling Ren; Kouchi Zhang;
    Applied Thermal Engineering,
    Volume 96, pp. 1-17, 2016.

  14. An accelerated test method of luminous flux depreciation for LED luminaires and lamps
    C. Qian; X.J.Fan; J.J.Fan; C.A.Yuan; Kouchi Zhang;
    Reliability Engineering and System Safety,
    Volume 147, pp. 84-92, 2016.

  15. A CMOS-Compatible Hybrid Plasmonic Slot Waveguide With Enhanced Field Confinement
    Jing Xiao; Qi-Qin Wei; Dao-Guo Yang; Ping Zhang; Ning He; Kouchi Zhang;
    IEEE Electron Device Letters,
    Volume 37, Issue 4, 2016.

  16. Solving the Nonlinear Heat Conduction in a Spherical Coordinate with Electrical Simulation
    A. M. Gheitaghy; H. Saffari; Kouchi Zhang;
    In 18th International Conference on Thermal Engineering,
    2016.

  17. Precision recess of AlGaN/GaN with controllable etching rate using ICP-RIE oxidation and wet etching
    R. Sokolovskij; J. Sun; F. Santagata; E. Iervolino; S. Li; G.Y. Zhang; P.M.Sarro; Kouchi Zhang;
    In Procedia Engineering: Proceedings of the 30th anniversary Eurosensors Conference,
    pp. 1094-1097, 2016.

  18. 3D interconnect technology based on low temperature copper nanoparticle sintering
    Boyao Zhang; Y. C. P. Carisey; A. Damian; R. H. Poelma; Kouchi Zhang; H. W. v. Zeijl;
    In 17th International Conference on Electronic Packaging Technology (ICEPT),
    2016.
    document

  19. Metallic Nanoparticle Based Interconnect for Heterogeneous 3D Integration
    Zeijl, H. W. V.; Y. Carisey; A. Damian; R. H. Poelma; A. Zinn; Kouchi Zhang;
    In IEEE 66th Electronic Components and Technology Conference (ECTC),
    2016.
    document

  20. Tailoring material properties for 3D microfabrication: In-situ experimentation and multi-scale modelling
    Poelma, R. H.; X. J. Fan; E. Schlangen; H. W. v. Zeijl; Kouchi Zhang;
    In 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2016.
    document

  21. 3D system-in-package design using stacked silicon submount technology
    Mingzhi Dong; Fabio Santagata; Robert Sokolovskij; Jia Wei; Cadmus Yuan; Kouchi Zhang;
    Microelectronics International,
    Volume 32, Issue 2, pp. 63-72, 2015.

  22. Color shift investigations for LED secondary optical designs: Comparison between BPA-PC and PMMA
    Guangjun Lu; M. Yazdan Mehr; W.D. van Driel; Xuejun Fan; Jiajie Fan; K.M.B. Jansen; Kouchi Zhang;
    Optical Materials,
    Volume 45, pp. 37-41, 2015.

  23. Degradation of Microcellular PET Reflective Materials Used in LED-based Products
    Guangjun Lu; W.D. van Driel; Xuejun Fan; M. Yazdan Mehr; Jiajie Fan; K.M.B. Jansen; Kouchi Zhang;
    Optical Materials,
    Volume 49, pp. 79-84, 2015.

  24. Highly selective and responsive ultra-violet detection using an improved phototransistor
    R. Soleimanzadeh; M. Kolahdouz; M. A. Charsooghi; Z. Kolahdouz; Kouchi Zhang;
    Applied Physics Letters,
    Volume 106, Issue 23, pp. 231102, 2015.

  25. Degradation Mechanisms of Mid-power White-light LEDs under High Temperature-Humidity Conditions
    Jianlin Huang; D.S. Golubović; S. Koh; D. Yang; X. Li; X. Fan; Kouchi Zhang;
    IEEE Transactions on Device and Materials Reliability,
    Volume 15, Issue 2, pp. 220-228, 2015.

  26. Degradation modeling of mid-power white-light LEDs by using Wiener process
    Jianlin Huang; D. S. Golubović; S. Koh; D. Yang; X. Li; X. Fan; Kouchi Zhang;
    Optics Express,
    Volume 23, pp. A966-A978, 2015.

  27. Optical degradation mechanisms of mid-power white-light LEDs in LM-80-08 tests
    Jianlin Huang, D. S. Golubović, S. Koh, D. Yang, X. Li, X. Fan,; Kouchi Zhang;
    Microelectronics Reliability,
    Volume 55, Issue 2654-2662, 2015.

  28. Rapid degradation of mid-power white-light LEDs in saturated moisture conditions
    Jianlin Huang, D. S. Golubovic, S. Koh, D. Yang, X. Li, X. Fan,; Kouchi Zhang;
    IEEE Transactions on Device and Materials Reliability,
    Volume 15, Issue 4, pp. 478-485, 2015.

  29. Light-Emitting n-ZnO Nanotube/n+-GaAs Heterostructures Processed at Low Temperatures
    F. Karegar; M. Kolahdouz; F. D. Nayeri; R. Soleimanzadeh; M. Hosseini; Z Kolahdouz; Kouchi Zhang;
    IEEE Photonics Technology Letters,
    Volume 27, Issue 13, pp. 1430-1433, 2015.

  30. Sequential microwave-assisted ultra-fast ZnO nanorod growth on optimized sol–gel seedlayers
    R. Soleimanzadeh; M. S. S. Mousavi; A. Mehrfar; Z. Kolahdouz; M. Kolahdouz; Kouchi Zhang;
    Journal of Crystal Growth,
    Volume 426, pp. 228-233, 2015.

  31. Design and fabrication of a foldable 3D silicon based package for solid state lighting applications
    R. Sokolovskij; Pan Liu; H.W. van Zeijl; B. Mimoun; Kouchi Zhang;
    Journal of Micromechanics and Microengineering,
    Volume 25, Issue 5, pp. 055017, 2015.

  32. Optimization of LED light spectrum to enhance colorfulness of illuminated objects with white light constraints
    H. Wu; J. Dong; G. Qi; Kouchi Zhang;
    Journal of the Optical Society of America A,
    Volume 32, Issue 7, pp. 1262-1270, 2015.

  33. Optimal Design of Life Testing for High Brightness White LEDs Using the Six Sigma DMAIC Approach
    Chuen Yung; Xuejun Fan; Kouchi Zhang; Michael Pecht;
    IEEE Transactions on Device and Materials Reliability,
    Volume 15, Issue 4, pp. 576-587, 2015.

  34. Ab Initio Study of Temperature, Humidity, and Covalent Functionalization-Induced Bandgap Change of Single-Walled Carbon Nanotubes
    Xian-Ping Chen; Ning Yang; Jun-Ke Jiang; Qiu-Hua Liang; Dao-Guo Yang; Kouchi Zhang;
    IEEE Electron Device Letters,
    Volume 36, Issue 6, 2015.

  35. Mechanics of graphene and carbon nanotubes under uniaxial compression and tension
    R. H. Poelma; Kouchi Zhang;
    In Molecular Modeling and Multiscaling Issues for Electronic Materials Applications,
    Springer, 2015.

  36. Tunable binary fresnel lens based on stretchable PDMS/CNT compsite
    Xueming Li; L. Wei; S. Vollebregt; R. Poelma; Y. Shen; Jia Wei; P. Urbach; P.M. Sarro; Kouchi Zhang;
    In Transducers,
    pp. 2041-2044, 2015.

  37. Modelling of Carbon Nanotube Arrays with Analytical and Numerical Methods
    X. J. Fan; R. H. Poelma; L. Chen; Kouchi Zhang;
    In ASME International Mechanical Engineering Congress and Exposition,
    2015.

  38. Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging
    Yang Liu; Joost Meerwijk; Liangliang Luo; Honglin Zhang; Fenglian Sun; Cadmus A. Yuan; Kouchi Zhang;
    Journal of Materials Science: Materials in Electronics,
    Volume 25, Issue 11, pp. 4954-4959, 2014.

  39. Fracture toughness of Cu-EMC interfaces in pressurized steam
    Sadeghinia, M; Jansen, KMB amd Ernst, LJ; Pape, H; Maus, I; van Driel, WD; Kouchi Zhang;
    International Journal of Adhesion and Adhesives,
    Volume 49, pp. 73-79, 2014.

  40. Multi-physics reliability simulation for solid state lighting drivers
    Tarashioon, S; van Driel, WD; Kouchi Zhang;
    Microelectronics Reliability,
    Volume 54, Issue 6-7, pp. 1212-1222, 2014.

  41. Accelerated life time testing and optical degradation of remote phosphor plates
    Maryam Yazdan Mehr; van Driel, WD; Kouchi Zhang;
    Microelectronics Reliability,
    Volume 54, Issue 8, pp. 1544-1548, 2014.

  42. Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products
    Maryam Yazdan Mehr; van Driel, WD; Jansen, KMB; Deeben, P; Kouchi Zhang;
    Microelectronics Reliability,
    Volume 54, Issue 1, pp. 138-142, 2014.

  43. Reliability and optical properties of LED lens plates under high temperature stress
    Maryam Yazdan Mehr; van Driel, WD; Koh, SW; Kouchi Zhang;
    Microelectronics Reliability,
    2014.

  44. A polymer based miniature loop heat pipe with silicon substrate and temperature sensors for high brightness light-emitting
    Huaiyu Ye; Sokolovskij, R; van Zeijl, HW; Gielen, AWJ; Kouchi Zhang;
    Microelectronics Reliability,
    Volume 54, Issue 6-7, pp. 1355-1362, 2014.

  45. Fabrication and application of temperature triggered MEMS switch for active cooling control in solid state lighting system
    Huaiyu Ye; Jai Wei; van Zeijl, HW; Sarro, PM; Kouchi Zhang;
    Microelectronics Reliability,
    Volume 54, Issue 6-7, pp. 1338-1343, 2014.

  46. Tailoring the Mechanical Properties of High-Aspect-Ratio Carbon Nanotube Arrays using Amorphous Silicon Carbide Coatings
    Poelma, RH; Morana, Bruno; Vollebregt, Sten; Schlangen, Erik; van Zeijl, HW; Fan, Xuejun; Zhang, Kouchi;
    Advanced Functional Materials,
    Volume 24, Issue 36, pp. 5737-5744, 2014.
    document

  47. Thermal and mechanical effects of voids within flip chip soldering in LED packages
    Yang Liu; Stanley Y.Y. Leung; Jia Zhao; Cell K.Y. Wong; Cadmus A. Yuan; Kouchi Zhang; Fenglian Sun; Liangliang Luo;
    Microelectronics Reliability,
    Volume 54, Issue 9-10, pp. 2028-2033, 2014.

  48. Electrical-thermal-luminous-chromatic model of phosphor-converted white light-emitting diodes
    Huaiyu Ye; Sau Wee Koh; Cadmus Yuan; Henk van Zeijl; Alexander W.J. Gielen; Shi-Wei Ricky Lee; Kouchi Zhang;
    Applied Thermal Engineering,
    Volume 63, Issue 2, pp. 588-597, 2014.

  49. Surface aspects of discolouration in Bisphenol A Polycarbonate (BPA-PC), used as lens in LED-based products
    Maryam Yazdan Mehr; W. D. van Driel; H. Udono; Kouchi Zhang;
    Optical Materials,
    Volume 37, pp. 155-159, 2014.

  50. Establishment of the Mesoscale Parameters for Separation: A Nonequilibrium Molecular Dynamics Model
    Cell K. Y. Wong; S. Y. Y. Leung; R. H. Poelma; K. M. B. Jansen; C. C. A. Yuan; W. D. van Driel; Kouchi Zhang;
    In Molecular Modeling and Multiscaling Issues for Electronic Material Applications,
    Springer, 2014.

  51. Numerical modeling of flexible actuator for dynamic lighting
    Teng Ma; Xueming Li; Jia Wei; Kouchi Zhang; P. M. Sarro;
    In 15th International Conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems,
    2014.

  52. Novel system-in-package design and packaging solution for solid state lighting systems
    Mingzhi Dong; Santagata, F; Jia Wei; Yuan, C; Kouchi Zhang;
    In Proceedings - 64th Electronic Components and Technology Conference,
    pp. 1192-1197, 2014.

  53. High aspect ratio lithography for litho-defined wire bonding
    Esfahani, ZK; van Zeijl, HW; Kouchi Zhang;
    In Proceedings - 64th Electronic Components and Technology Conference,
    pp. 1556-1561, 2014.

  54. Investigation of color shift of LEDs-based lighting products
    Koh, SW; Huaiyu Ye; Maryam Yazdan Mehr; Jia Wei; van Driel, WD; Zhao, LB; Kouchi Zhang;
    In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
    pp. 1-5, 2014.

  55. CNT bundles growth on microhotplates for direct measurement of their thermal properties
    C. Silvestri; B. Morana; G. Fiorentino; S. Vollebregt; G. Pandraud; F. Santagata; Kouchi Zhang; P.M. Sarro;
    In 27th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2014),
    San Francisco, USA, Jan. 2014.
    document

  56. A lifetime prediction method for Solid State Lighting power converters based on SPICE models and finite element thermal simulations
    Bo Sun; Fan, X; Zhao, L; Yuan, CA; Koh, SW; Kouchi Zhang;
    In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
    pp. 1-4, 2014.

  57. Thermal performance of embedded heat pipe in high power density LED streetlight module
    Tang, H; Zhao, J; Li, B; Leung, SYY; Yuan, CCA; Kouchi Zhang;
    In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
    pp. 1-6, 2014.

  58. Modeling and simulation of monolithic integration of rectifiers for solid state lighting applications
    Venkatesh, MR; Liu, P; van Zeijl, HW; Kouchi Zhang;
    In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
    pp. 1-6, 2014.

  59. A model in predicting color of LED packages with different phosphor layer dimensions
    Wong, CKY; Leung, SYY; Xiong, YJ; Yuan, CCA; Kouchi Zhang;
    In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
    pp. 1-5, 2014.

  60. Reliability and accelerated test methods for plastic materials in LED-based products
    Maryam Yazdan Mehr; van Driel, WD; Kouchi Zhang;
    In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
    pp. 1-5, 2014.

  61. Investigation of lumen degradation mechanisms of mid-power LED by HAST
    Jianlin Huang; Koh, SW; Xueming Li; Kouchi Zhang;
    In Proceedings of the 15th International Conference on Electronic Packaging Technology,
    pp. 1437-1441, 2014.

  62. Numerical modeling of flexible actuator for dynamic lighting
    Ma, T; Xueming Li; Jia Wei; Kouchi Zhang; Sarro, PM;
    In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
    pp. 01-Apr, 2014.

  63. Influences of viscoelasticity of polybutylene terephthalate (PBT) on the thermal interface contact of LED spotlight module
    Tang, H; Yu, Y; Jia, M; Leung, SYY; Qian, C; Cadmus Yuan; Zhou, X; Kouchi Zhang;
    In Proceedings of the 15th International Conference on Electronic Packaging Technology,
    pp. 1198-1201, 2014.

  64. Colour shift in remote phosphor based LED products
    Maryam Yazdan Mehr; Driel, WD van; Kouchi Zhang;
    In Proceedings - 64th Electronic Components and Technology Conference,
    pp. 1477-1481, 2014.

  65. Electro-thermal simulation and characterization of vertically aligned CNTs directly grown on a suspended microhoplate for thermal management applications
    C. Silvestri; P. Piacciafoco; B. Morana; F. Santagata; Kouchi Zhang; P.M. Sarro;
    In IEEE Sensors,
    pp. 827-830, 2014.
    document

  66. Miniaturized particulate matter sensor for portable air quality monitoring devices
    Xueming Li; E Iervolino; F Santagata; Jia Wei; Cadmus Yuan; PM Sarro; Kouchi Zhang;
    In IEEE Sensors,
    pp. 2151-2154, 2014.

  67. Adapting LED lighting to compensate the influence of ambient light on the light color
    J.D.H. Wu; Kouchi Zhang;
    In 11th China SSL conference,
    2014.

  68. A novel design of heatsink-less LED base fluorescent lamp retrofit
    Y. L. Jia Zhao; Hongyu Tang; Stanley Y Y Leung; Cadmus C A Yuan; Kouchi Zhang;
    In ICEPT2014,
    2014.

  69. Blue Selective Photodiodes for Optical Feedback in LED Wafer Level Packages
    Z. Kolahdouz; A. Rostamian; M. Kolahdouz; T. Ma; H. V. Zeijl; Kouchi Zhang;
    In Solid-State Device Research Conference (ESSDERC), 2014 Proceedings of the European,
    pp. 174-177, 2014.

  70. High Accelerated Optical Remote Phosphor Aging Studies for LED Luminaire Applications
    W. D. v. Driel; Maryam Yazdan Mehr; Kouchi Zhang;
    In 11th China SSL conference,
    2014.

  71. Vertical Interconnect technology for Wafer-Level-Packaging and 3D Integration
    H. W. v. Zeijl; R. H. Poelma; L. Wang; E. Boschman; F. Boschman; Kouchi Zhang;
    In nanoFIS 2014 - Functional Integrated nanoSystems,,
    2014.

  72. Reliability of LED-based Products is a Matter of Balancing Temperatures
    Maryam Yazdan Mehr; W.D. van Driel; Kouchi Zhang;
    In Therminic Conference,
    2014.

  73. Correlation of activation energy between LEDs and luminaires in the lumen depreciation test
    Guangjun Lu; Yuan, C; Fan, X; Kouchi Zhang;
    In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
    pp. 1-3, 2014.

  74. Through-polymer via (TPV) and method to manufacture such a via
    H.W. van Zeijl; R.H. Poelma; Kouchi Zhang;
    Dutch patent, 2014.

  75. Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems
    F. Santagata; C. Farriciello; G. Fiorentino; H.W. van Zeijl; C. Silvestri; Kouchi Zhang; P.M. Sarro;
    Journal of Micromechanics and Microengineering,
    2013.

  76. Photodegradation of bisphenol A polycarbonate under blue light radiation and its effect on optical properties
    Maryam Yazdan Mehr; W. D. van Driel; K. M. B. Jansen; P. Deeben; M. Boutelje; Kouchi Zhang;
    Optical Materials,
    Volume 35, pp. 504-508, 2013.

  77. Thermal Analysis of Remote Phosphor in LED Modules
    Mingzhi Dong; Jia Wei; Huaiyu Ye; Cadmus Yuan; Kouchi Zhang;
    Journal of Semiconductors,
    Volume 34, Issue 5, pp. 053007-1-3, 2013.

  78. Carbon Nanotube based heat-sink for solid state lighting
    F. Santagata; G. Almanno; S. Vollebregt; C Silvestri; Kouchi Zhang; P.M. Sarro;
    In 8th IEEE Int. Conf. Nano/Micro Engineered and Molecular Systems (NEMS),
    pp. 1214-1217, Apr 2013. DOI 10.1109/NEMS.2013.6559937.

  79. Thermal Analysis for Silicon-based Integration of LED Systems
    Mingzhi Dong; Fabio Santagata; Jia Wei; Cadmus Yuan; Kouchi Zhang;
    In 10th China International Forum on Solid State Lighting,
    2013.

  80. Cause analysis on highly depreciated indoor LED product in CSA020
    Guangjun Lu; Yuan C; Tang H; Wong C; Fan XJ; Kouchi Zhang;
    In Proceedings of China Solid State Lighting Forum,
    2013.

  81. Validation of the methodology of lumen depreciation acceleration of LED lighting
    Guangjun Lu; Yuan C; Sun B; Li B; Fan XJ; Kouchi Zhang;
    In Proceedings of China Solid State Lighting Forum,
    2013.

  82. Diagnosing lumen depreciation in LED lighting systems: An estimation approach
    J. Dong; A. Pandharipande; W. van Driel; Kouchi Zhang;
    IEEE Transactions on Signal Processing,
    Volume 60, Issue 7, pp. 3796-3808, Jul. 2012. DOI 10.1109/TSP.2012.2192114.

  83. Analytical large deflection method for carbon nanotube youngÕs modulus determination
    N. Tolou; A. Khiat; Kouchi Zhang; J.L. Herder;
    International Journal of Nonlinear Sciences and Numerical Simulation,
    Volume 12, Issue 1-8, pp. 51-58, Feb. 2012. DOI 10.1515/ijnsns.2011.300.

  84. Establishment of the coarse grained parameters for epoxy-copper interfacial separation
    C.K.Y. Wong; S.Y.Y. Leung; R.H. Poelma; K.M.B. Jansen; C.C.A. Yuan; W.D. van Driel; Kouchi Zhang;
    Journal of Applied Physics,
    Volume 111, Issue 9, pp. 094906/1-094906, May 2012. DOI 10.1063/1.4712060.

  85. Mechanical characterization of individual polycrystalline carbon tubes for use in electrical nano-interconnects
    A. Khiat; R.H. Poelma; Kouchi Zhang; F. Heuck; F.D. Tichelaar; M. Sarno; P. Ciambelli; S. Fontorbes; L. Arurault; U. Staufer;
    Microelectronic Engineering,
    Volume 98, pp. 317-320, Oct. 2012. DOI 10.1016/j.mee.2012.07.087.

  86. Effects of single vacancy defect position on the stability of carbon nanotubes
    R.H. Poelma; H. Sadeghian; S. Koh; Kouchi Zhang;
    Microelectronics Reliability Journal,
    Volume 52, Issue 7, pp. 1279-1284, Jul. 2012. DOI 10.1016/j.microrel.2012.03.015.

  87. An approach to ÒDesign for ReliabilityÓ in solid state lighting systems at high temperatures
    S. Tarashioon; A. Baiano; H. van Zeijl; C. Guo; S.W. Koh; W.D. van Driel; Kouchi Zhang;
    Microelectronics Reliability,
    Volume 52, Issue 5, pp. 783-793, May 2012. DOI 10.1016/j.microrel.2011.06.029.

  88. Molecular modeling of protonic acid doping of emeraldine base polyaniline for chemical sensors
    X.P. Chen; C. Yuan; C.K.Y. Wong; H. Ye; S.Y.Y. Leung; Kouchi Zhang;
    Sensors and Actuators B: Chemical,
    Volume 174, pp. 210-216., 2012. DOI 10.1016/j.snb.2012.08.042.

  89. Photodegradation of bisphenol A polycarbonate under blue light radiation and its effect on optical properties
    Maryam Yazdan Mehr; W.D. van Driel; K.M.B. Jansen; P. Deeben; M. Boutelje; Kouchi Zhang;
    Optical Materials Journal,
    Volume 35, Issue 3, pp. 504-508, 2012. DOI 10.1016/j.optmat.2012.10.001.

  90. The mechanical properties modeling of nano-scale materials by molecular dynamics
    C. Yuan; W.D. Driel; R.H Poelma; Kouchi Zhang;
    In Molecular Modeling and Multiscaling for Electronic Material Applications,
    Springer, 2012. DOI 10.1007/978-1-4614-1728-6_8.

  91. Semi empirical low cycle fatigue crack growth analysis of nanostructure chip-to-package copper interconnect using molecular simulation
    S. Koh; A. Saxena; W.D. van Driel; Kouchi Zhang; R. Tummala;
    In Molecular Modeling and Multiscaling for Electronic Material Applications,
    Springer, 2012. DOI 10.1007/978-1-4614-1728-6_5.

  92. Molecular modeling of the conductivity changes of the emeraldine base polyaniline due to protonic acid doping
    X. Chen; C. Yuan; C. Wong; Kouchi Zhang;
    In 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
    Cascais, Portugal, Apr. 2012. ISBN 978-1-4673-1511-1; DOI 10.1109/ESimE.2012.6191741.

  93. Thermal and moisture degradation in SSL system
    S. Koh; W.D. van Driel; Kouchi Zhang;
    In 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
    Lisbon, Portugal, pp. 1-6, Apr. 2012. DOI 10.1109/ESimE.2012.6191806.

  94. Dynamic thermal simulation of high brightness LEDs with unsteady driver power output
    H. Ye; S. Koh; J. Wei; H.W. van Zeijl; Kouchi Zhang;
    In 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
    Lisbon, Portugal, Apr. 2012. DOI 10.1109/ESimE.2012.6191768.

  95. Establishment of the mesoscale parameters for epoxy-copper interfacial separation
    C.K.Y. Wong; S.Y.Y. Leung; R.H. Poelma; K.M.B. Jansen; C.C.A. Yuan; W.D. van Driel; Kouchi Zhang;
    In 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
    Lisbon, Portugal, Apr. 2012. DOI 10.1109/ESimE.2012.6191737.

  96. System approach for reliability of low-power power electronics: How to break down into their constructed parts
    S. Tarashioon; W.D. van Driel; Kouchi Zhang;
    In 7th International Conference on Integrated Power Electronics Systems (CIPS 2012),
    Nuremberg, Germany, pp. 1-5, Mar. 2012.

  97. Monitoring of meniscus motion at nozzle orifice with capacitive sensor for inkjet applications
    J. Wei; C. Yue; Kouchi Zhang; J.F. Dijksman; P.M. Sarro;
    In Proc. 11th IEEE Sensors Conference,
    Taipei, Taiwan, pp. 2172-2175, Oct 2012.

  98. Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems
    F. Santagata; G. Fiorentino; M. Nie; C. Farriciello; R. Poelma; Kouchi Zhang; P.M. Sarro;
    In Proc. 11th IEEE Sensors Conference,
    Taipei, Taiwan, pp. 668-671, Oct 2012.

  99. Simulation and qualification of a system-in-package (SiP) based solid state lighting (SSL) module
    D.M. Farley; F. Boschman; J.E. Bullema; A.W.J. Gielen; P. Hesen; J.P.H.M. Krugers; F. Swartjes; H.W. van Zeijl; Kouchi Zhang;
    In Proc. 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
    Cascais, Portugal, pp. 1-3, Apr 2012. ISBN 978-1-4673-1511-1; DOI 10.1109/ESimE.2012.6191780.

  100. Single-mask fabrication of temperature triggered MEMS switch for cooling control in SSL system
    J. Wei; H. Ye; H.W. van Zeijl; P.M Sarro; Kouchi Zhang;
    In R. Walczak; J. Dziuban (Ed.), Proc. Eurosensors XXVI,
    Krakow, Poland, Procedia Engineering, pp. 849-852, Sep 2012. DOI 10.1016/j.proeng.2012.09.280.

  101. A numerical experimental approach for characterizing the elastic properties of thin films: Application of nanocantilevers
    R.H. Poelma; H. Sadeghian; S.P.M. Noijen; J.J.M. Zaal; Kouchi Zhang;
    Journal of Micromechanics and Microengineering,
    Volume 21, Issue 6, pp. 1-11, 2011. DOI 10.1088/0960-1317/21/6/065003.

  102. Molecular modeling of temperature dependence of solubility parameters for amorphous polymers
    X.P. Chen; C.A. Yuan; C.K.. Wong; Kouchi Zhang;
    Journal of Molecular Modeling,
    pp. 1-9, Oct. 2011. DOI 10.1007/s00894-011-1249-3.

  103. A review of passive thermal management of LED module
    H. Ye; S. Koh; H. Zeijl; A.W.J. Gielen; Kouchi Zhang;
    Journal of Semiconductors,
    Volume 32, Issue 1, pp. 1-4, 2011. DOI 10.1088/1674-4926/32/1/014008.

  104. Validation of forcefields in predicting the physical and thermophysical properties of emeraldine base polyaniline
    X.P. Chen; C.A. Yuan; C.K.Y. Wong; S.W. Koh; Kouchi Zhang;
    Molecular Simulation,
    Volume 37, Issue 12, pp. 990-996, Oct. 2011. DOI 10.1080/08927022.2011.562503.

  105. Molecular Dynamics study of the traction-displacement relations of epoxy-copper interfaces
    C.K.Y. Wong; S.Y.Y. Leung; R.H. Poelma; K.M.B. Jansen; C.A. Yuan; W.D. van Driel; Kouchi Zhang;
    In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
    Linz, Austria, pp. 1-5, Apr. 2011. ISBN 978-1-4577-0106-1; DOI 10.1109/ESIME.2011.5765785.

  106. Degradation of epoxy lens materials in LED systems
    S. Koh; W.D. van Driel; Kouchi Zhang;
    In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
    Linz, Austria, pp. 1-5, Apr. 2011. ISBN 978-1-4577-0106-1; DOI 10.1109/ESIME.2011.5765850.

  107. Numerical modeling of thermal performance: Natural convection and radiation of solid state lighting
    H. Ye; A.W.J. Gielen; H.W. vanZeijl; R.J. Werkhoven; Kouchi Zhang;
    In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
    Linz, Austria, pp. 1-6, Apr. 2011. ISBN 978-1-4577-0106-1; DOI 10.1109/ESIME.2011.5765845.

  108. Co-design of wafer level thin film package assembly
    J.J.M. Zaal; F. Santagata; W.D. van Driel; Kouchi Zhang; J.F. Creemer; P.M. Sarro;
    In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
    Linz, Austria, pp. 1-6, Apr. 2011. ISBN 978-1-4577-0106-1.
    document

  109. Buckling analysis of carbon nanotubes and the influence of defect position
    R.H. Poelma; H. Sadeghian; S.W. Koh; Kouchi Zhang;
    In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
    Linz, Austria, pp. 1-7, Apr. 2011. ISBN 978-1-4577-0106-1; DOI 10.1109/ESIME.2011.5765864.

  110. Thermal analysis of HB LED packages and advanced materials
    H. Ye; A.W.J. Gielen; H.W. vanZeijl; Kouchi Zhang;
    In ChinaSSL 2012, China,
    2011.

  111. Evaluation and selection of sensing materials for carbon dioxide (CO2) sensor by molecular modeling
    X.P. Chen; C.K.Y. Wong; C.A. Yuan; Kouchi Zhang;
    In C. Tsamis; G. Kaltas (Ed.), Proc. Eurosensors XXV,
    Athens, Greece, Procedia Engineering, pp. 379-382, Sep. 2011. DOI 10.1016/j.proeng.2011.12.094.

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