MSc thesis project proposal

Low-temperature interconnects: Soft-to-Hard device interconnection

In recent years, flexible and stretchable electronic products have been highly developed in the electronics industry and play an increasingly important role in the medical field. The packaging issues of flexible electronic products still needs to be studied.

Signals from the stretchable electronics will be collected and analyzed by readout circuitry on the silicon substrate. Therefore, interconnections between stretchable electronic devices and silicon substrates are essential. Furthermore, with regard to the reliability of the integrated samples, the mechanical properties of the interconnects should also be guaranteed. Due to the poor temperature tolerance of stretchable materials, low temperature interconnects can provide opportunities


This project aims to integrate the flexible sample on a silicon substrate. There should be interconnection between stretchable device and silicon substrate. Furthermore, the stretchable device should be bonded on the silicon substrate. The nanometallic particle is a candidate for the bonding/interconnecting materials.

The student will perform the assignment at ECTM:

  • Duration: 9 ~ 12 months.
  • Location: EKL cleanrooms and facilities.


The expected activities to be carried out by the student are:

  • Literature review on the state-of-arts of flexible and stretchable electronics interconnection.
  • Sample design and bonding materials determination.
  • Fabrication of the design in EKL facilities.
  • Modelling and characterization of the resistive, thermal and mechanical properties of the fabricated samples.


You are an ambitious master student looking for a challenging thesis project on a microelectronics packaging problem. You have a physics, material science or microelectronics background and an interest in micro abrication technology. Good communication skills in English and a pro-active attitude are expected.


MSc Xinrui Ji

Electronic Components, Technology and Materials Group

Department of Microelectronics

Last modified: 2023-12-15