Jiaqi Tang
Publications
- MIP Plasma Decapsulation of Copper-wired Semiconductor Devices for Failure Analysis
Jiaqi Tang;
PhD thesis, Delft University of Technology, 2014.
document - Fast etching of molding compound by an Ar/O2/CF4 plasma and process improvements for semiconductor package decapsulation
Jiaqi Tang; D. Gruber; J.B.J. Schelen; H.-J. Funke; C.I.M. Beenakker;
ECS Journal of Solid State Science and Technology,
Volume 1, Issue 4, pp. P175-P178, Aug. 2012. DOI 10.1149/2.019204jss. - Flexible system for real-time plasma decapsulation of copper wire bonded IC packages
Jiaqi Tang; J.B.J. Schelen; C.I.M. Beenakker;
In 62nd IEEE Electronic Components and Technology Conference (ECTC 2012),
San Diego, US, pp. 1764-1769, May 2012. ISBN 978-1-4673-1966-9; DOI 10.1109/ECTC.2012.6249076. - Plasma etching for failure analysis of integrated circuit packages
Jiaqi Tang; J.B.J. Schelen; C.I.M. Beenakker;
In ECS Transactions: China Semiconductor Technology International Conference 2011 (CSTIC 2011),
Shanghai, China, pp. 913-918, Mar. 2011. ISSN 1938-5862; DOI 10.1149/1.3567691. - Plasma decapsulation of plastic IC packages with copper wire bonds for failure analysis
Jiaqi Tang; H. Ye; J.B.J. Schelen; C.I.M. Beenakker;
In Proc. 12th International Conference on Electronics Packaging Technology & High Density Packaging (ICEPT-HDP 2011),
Shanghai, China, pp. 888-892, Aug. 2011. ISBN 978-1-4577-1768-0; DOI 10.1109/ICEPT.2011.6066972.