Electronic Components, Technology and Materials
Department of Microelectronics

Xinrui Ji

Publications

  1. Low Temperature Fine Pitch All-Copper Interconnects Combining Photopatternable Underfill Films
    Xinrui Ji; Henk Van Zeijl; Weiping Jiao; Shan He; Leiming Du; Guoqi Zhang;
    In Proc. of Electronic Components and Technology Conference (ECTC),
    2023.

  2. Patterning of Fine-Features in Nanoporous Films Synthesized by Spark Ablation
    Xinrui Ji; Joost van Ginkel; Dong Hu; Andreas Schmidt-Ott; Henk van Zeijl; Sten Vollebregt; GuoQi Zhang;
    In Proc. IEEE Nano,
    pp. 238-241, 2022. DOI: 10.1109/NANO54668.2022.9928705

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