dr. H. Ye

PhD student
Electronic Components, Technology and Materials (ECTM), Department of Microelectronics

PhD thesis: Thermal Management of Solid State Lighting Module

Promotor: Kouchi Zhang

Themes: Micro/Nano System Integration and Reliability


Scientific aim: The major research subject is develop the means to understand and design the thermal flow from the material and interfaces up to the SSL module in order to develop thermal break-through solutions for SSL (and other high-power solid-state electronics). This includes developing and integrating new cooling concepts, new materials, new processes and new design under given application conditions and show the improved reliability it delivers. The major abovementioned deliverables should be compatible/suitable for current (retrofit lighting) and future solid state lighting module/system. In order to achieve the project expectation, it is essential to focus on optimising thermal management, including the optimization of SSL module design, heatsink material/concept selection, process development, high thermal conductivity material packaging with numerical simulation and experimental validation. The cooling concepts/solutions and materials should be compatible to current/future HB SSL applications. Notice that the selection of thermal management / cooling solutions and thermal materials will not be limited to the existing ones. Focus will be developing novel solutions such as two phase cooling method based materials and concept. Moreover, considering the manufacturing/processing imperfections, the concepts and materials are expected to perform a sufficient thermal conductivity in order to satisfy the system level thermal requirements. Virtual prototyping method is applied for the understanding and predicting of the thermal performance of the innovative thermal management concept/solution. The thermal behaviour modelling of new concepts and materials based on the multi-physics/multi-scale is focused. The thermal impact in terms of the thermal resistance (Rth) between die to PCB in various materials must be studied. The correlation between the Rth to relevant failure mode, and the reliability/lifetime prediction model should be established and validated. And, as an essential input, the material characterisation activity is also planned. Integrating the knowledge of the thermal management concept/process development and reliability modelling of various materials, the design for interconnect reliability rules can be derived for the specified high temperature power applications.

Last updated: 1 Mar 2016

Huaiyu Ye

  • Left in 2014