theme description

Micro/Nano System Integration and Reliability

Contact: Kouchi Zhang

Heterogeneous Integration of a wide variety of micro/nano devices, components and technologies: the bridge between micro/nano technologies and macro-scale applications
The research addresses compact and complex system integration and reliability. The major research activities are 3D wafer level integration; advanced packaging level integration (SiP); control and interface engineering of complex systems; design for component, product and complex system reliability; fast reliability qualification and testing. As one of the leading research groups for Solid State Lighting (SSL), this group develops generic technologies for SSL and other micro/nanoelectronics systems, contributes to and participates in major EU funded research programmes and Dutch and Chinese national R&D programmes. The group has a strong international network and close cooperation with the worldwide leading industries and research institutions.

Projects under this theme

IoSense

Thermal management in 3d heterogeneous integration

2D materials-based Heat Waste Recovery of LED

Gallium nitride (GaN) on silicon system integration

LED Luminaire Colour Shift

Smart Optics

LED Power Supply Reliability

Multifuntional LED Integration and Miniaturization

History

Quick reliability assessment for mid-power white-light LED packages

3D System-in-package Design Using Stacked Silicon Submount Technology

3D Smart Wafer Level Package for LEDs

Material Degradation in Solid State Lightening Applications

Fast qualification of solder reliability in solid state lighting application

Solid State Lighting reliability for automotive application

The use of SiPs in all kinds of applications is only possible if its reliability can be qualified

Innovative Thermal Management Breakthrough Of Advanced Solid State Lighting Module