MSc Varun Thukral
Electronic Components, Technology and Materials (ECTM), Department of Microelectronics Themes: Micro/Nano System Integration and Reliability
Varun Thukral received the M.Sc. degree from Chemnitz University of Technology, Germany in Micro and Nano systems, and is currently a PhD candidate in the ECTM group stationed at NXP Semiconductor, Nijmegen in cooperation with Delft University of Technology. He is a Principal Board Level Reliability Engineer at NXP Semiconductor. His current research interests include solder joint reliability under mechanical and thermo-mechanical loading. His research activities focus on developing futuristic reliability test methods to evaluate solder joint reliability under vibration, shock, drop, bend and temperature cycling test environments.
V. Thukral, J. J. M. Zaal, R. Roucou, J. Jalink and R. T. H. Rongen, "Understanding the Impact of PCB Changes in the Latest Published JEDEC Board Level Drop Test Method," 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), San Diego, CA, 2018, pp. 756-763, doi: 10.1109/ECTC.2018.00117.
V. Thukral, M. Cahu, J. J. M. Zaal, J. Jalink, R. Roucou and R. T. H. Rongen, "Assessment of Accelerometer Versus LASER for Board Level Vibration Measurements," 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, 2019, pp. 1339-1346, doi: 10.1109/ECTC.2019.00208.
V. Thukral, R. Roucou, S. Sauze, J. J. M. Zaal, J. Jalink and R. T. H. Rongen, "Considerations on a Smart Strategy for Simultaneously Testing Multiple PCB Assemblies in Board Level Vibration," 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2020, pp. 793-800, doi: 10.1109/ECTC32862.2020.00129.
Last updated: 6 Nov 2020