dr. Fengze Hou

PhD student
Electronic Components, Technology and Materials (ECTM), Department of Microelectronics

PhD thesis (Jun 2020): Fan-Out SiC MOSFET Power Module in an Organic Substrate
Promotor: Jan Abraham Ferreira, GuoQi Zhang

Expertise: Thermal Management/Reliability/System Integration and SiC Power Module Packaging

Themes: Micro/Nano System Integration and Reliability

Projects history

Advanced packaging technology of SiC power module

  1. Review of Packaging Schemes for Power Module
    Fengze Hou; W. Wang; L. Cao; M. Su; J. Li; GuoQi Zhang; J.A. Ferreira;
    IEEE Journal of Emerging and Selected Topics in Power Electronics,
    Volume 8, Issue 1, pp. 223-238, 2020.

  2. Fan-out Panel-level PCB Embedded SiC Power MOSFETs Packaging
    Fengze Hou; W. Wang; R. Ma; Y. Li; Z. Han; M. Su; J. Li; Z. Yu; Y. Song; Q. Wang; M. Chen; L. Cao; GuoQi Zhang; J.A. Ferreira;
    IEEE Journal of Emerging and Selected Topics in Power Electronics,
    Volume 8, Issue 1, pp. 367-380, 2020.

  3. Microchannel Thermal Management System with Two-Phase Flow for Power Electronics over 500 W/cm2 Heat Dissipation
    Fengze Hou; Hengyun Zhang; Dezhu Huang; Jiajie Fan; Fengman Liu; Tingyu Lin; Liqiang Cao; Xuejun Fan; Braham Ferreira; GuoQi Zhang;
    IEEE Transactions on Power Electronics,
    Volume 35, Issue 10, pp. 10592-10600, 2020. DOI: 10.1109/TPEL.2020.2985117

  4. Experimental evaluation of a compact two-phase cooling system for high heat flux electronic packages
    Fengze Hou; Wang, W.; Zhang, H.; Chen, C.; Chen, C.; Lin, T.; Cao, L.; GuoQi Zhang; Ferreira, J. A.;
    Applied Thermal Engineering,
    Volume 163, pp. 114338, 2019. DOI: https://doi.org/10.1016/j.applthermaleng.2019.1143

  5. Characterization of PCB Embedded Package Materials for SiC MOSFETs
    Fengze Hou; Wang, W.; Lin, T.; Cao, L.; GuoQi Zhang; Ferreira, J. A.;
    IEEE Transactions on Components, Packaging and Manufacturing Technology,
    Volume 9, Issue 6, pp. 1054-1061, 2019. DOI: https://doi.org/10.1109/TCPMT.2019.2904533

  6. High Power-Density 3D Integrated Power Supply Module Based on Panel-Level PCB Embedded Technology
    Fengze Hou; Xueping Guo; Qidong Wang; Wenbo Wang; Tingyu Lin; Liqiang Cao; GuoQi Zhang; J.A. Ferreira;
    In Proc. IEEE Electronic Components and Technol. Conf. (ECTC),
    pp. 1365- 1370, 2018.

  7. Compensation Method for Die Shift in Fan-Out Packaging
    Yue Sun; Fengze Hou; Chen, F.; Liu, H.; Zhang, H.; Sun, P.; Lin, T.; Cao, L.;
    In 19th International Conference on Electronic Packaging Technology, ICEPT 2018,
    2018. DOI: https://doi.org/10.1109/ICEPT.2018.8480551

  8. Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package
    Fengze Hou; T Lin; L Cao; F Liu; J Li; X Fan; GuoQi Zhang;
    IEEE Transactions on Components, Packaging and Manufacturing Technology,
    Volume 7, Issue 10, pp. 1721-1728, 2017.

BibTeX support

Last updated: 13 Jul 2020

Fengze Hou

Alumnus
  • Left in 2020