Electronic Components, Technology and Materials
Department of Microelectronics

dr. M. Bartek

Assistant Professor
Electronic Components, Technology and Materials (ECTM), Department of Microelectronics

PhD thesis (Oct 1995): Selective Epitaxial Growth for Smart Silicon Sensor Applications
Promotor: S. Middelhoek

Biography

Marian Bartek was born in Trnava, Slovakia in 1965. He received his MSc degree in Microelectronics and Optoelectronics from the Slovak Technical University, Bratislava, Slovakia (1988) and a PhD degree in Electrical Engineering at the Delft University of Technology, the Netherlands (1995). From 1996 to 1999, he was a post-doctoral fellow in the Electronic Instrumentation Laboratory, Delft University of Technology, dealing with research on technological aspects of integrated silicon sensor systems. Since 2000, he is with the Electronic Components, Materials and Technology Laboratory (ECTM), and since 2004 with Laboratory of High-Frequency Technology and Components (HiTeC), Delft University of Technology as an assistant professor. He is a project leader in the research area of Wafer-level packaging and Microsystem interfacing.

Publications

  1. A review of visible-range Fabry�Perot microspectrometers in silicon for the industry
    J.P. Carmoa; R.P. Rocha; M. Bartek; G. de Graaf; R.F. Wolffenbuttel; J.H. Correia;
    Optics & Laser Technology,
    Volume 44, Issue 7, pp. 2312-2320, Oct. 2012. DOI 10.1016/j.optlastec.2012.03.036.

  2. An Inspiring BSc-EE Curriculum for Science and Engineering
    N.P. van der Meijs; M. Bartek; P. Bauer; A.J. van Genderen; G.J.M. Janssen;
    In Proc. 42th International European Microwave Conference (EuMC-2012),
    Amsterdam, pp. 494-497, Oct. 2012. ISBN 978-2-87487-027-9.

  3. Flexible multipolar cuff microelectrode for FES of sacral nerve roots
    F. Rodrigues; B. Mimoun; M. Bartek; P.M. Mendes; R. Dekker;
    In Proc. 17th Annual International FES Society Conference (IFESS 2012),
    Banff, Alberta, Canada, pp. 1-4, Sept. 2012.

  4. A steering electrode array for selective stimulation of sacral nerve roots
    F.O. Rodrigues; P.M. Mendes; M. Bartek; B. Mimoun;
    In Proc. ICT.OPEN: Micro technology and micro devices (SAFE 2011),
    Veldhoven, The Netherlands, pp. 88-91, Nov. 2011.

  5. High-aspect-ratio through-wafer parylene beams for stretchable silicon electronics.
    T. Zoumpoulidis; M. Bartek; P. de Graaf; R. Dekker;
    Sensors and actuators a-physical,
    Volume 156, Issue 1, pp. 257-264, 2009. ISSN 0924-4247.

  6. Stretchable array of ISFET devices for applications in biomedical imagers.
    T. Zoumpoulidis; T. Prodomakis; K. Michelakis; H.W. van Zeijl; M. Bartek; C. Toumazou; R. Dekker;
    In S.C. Mukhopadhyay (Ed.), Proc. IEEE Sensors 2009 Conference,
    Christchurch, New Zealand, IEEE, pp. 7-12, 2009. ISBN 978-1-4244-5335-1).

  7. Parylene-embedded metal interconnects for stretchable silicon electronics.
    T. Zoumpoulidis; M. Bartek; R. Dekker;
    In Proc. International Conference on Electronics Packaging (ICEP 2009),
    Kyoto, Japan, JIEP, IEEE, pp. 611-615, 2009.

  8. A general purpose reconfigurable MEMS-based attenuator for radio frequency and microwave applications
    J. Iannacci; F. Giacomozzi; S. Colpo; B. Margesin; M. Bartek;
    In Proc. IEEE Region 8 EUROCON 2009 Conference,
    Saint Petersburg, Russia: IEEE, pp. 1201-1209, 2009.

  9. Stretchable silicon electronics
    M. Bartek; T. Zoumpoulidis; S. Sosin;
    In Proc. IWLPC 2009,
    Santa Clara, CA: SMTA, pp. 45-50, 2009.

  10. Large-area silicon electronics using stretchable metal interconnect
    S. Sosin; T. Zoumpoulidis; M. Bartek; R. Dekker;
    In Proc. 59th Electronic Components & Technology Conference (ECTC 2009),
    San Diego, CA, pp. 1059-1064, 2009.

  11. Integrated 5.7 GHz Chip-Size Antenna for Wireless Sensor Networks
    P.M. Mendes; A. Polyakov; M. Bartek; J.N. Burghartz; J.H. Correia;
    In Transducers,
    Boston, Massachuesetts, USA, pp. 49-52, Jun. 2003. ISBN 0-7803-7731-1.

  12. Low-Cost Microfilter for Red Blood Cell Membrane Stiffness Measurement Using Photosensitive BCB
    P. Turmezei; A. Polyakov; J.R. Mollinger; M. Bartek; A. Bossche; J.N. Burghartz;
    In Transducers,
    Boston, Massachuesetts, USA, pp. 107-110, Jun. 2003. ISBN 0-7803-7731-1.
    document

  13. Analysis and Optimization of Via-Connected Spiral Inductors in RF Silicon Technology
    S.M. Sinaga; M. Bartek; J.N. Burghartz;
    In Proc. SAFE 2003,
    Veldhoven, The Netherlands, pp. 757-760, Nov. 2003. ISBN 90-73461-39-1.
    document

  14. Folded-Patch Chip-Size Antennas for Wireless Microsystems using Wafer-Level Chip-Scale Packaging
    P.M. Mendes; A. Polyakov; M. Bartek; J.N. Burghartz; J.H. Correia;
    In Proc. MME 2003,
    Delft, The Netherlands, pp. 77-80, Nov. 2003. ISBN 90-808266-1-8.
    document

  15. Efficiency Improvement of a Chip-Size Antenna for Wireless Microsystems
    P.M. Mendes; D.A. Duraes; M. Bartek; J.H. Correia;
    In Proc. Eurosensors XVII,
    University of Minho, Guimaraes, Portugal, pp. 725-726, Sep. 2003.

  16. Microfluidic device constructed from photosensitive BCB for erythrocyte membrane deformability measurement
    P. Turmezei; A. Polyakov; J.R. Mollinger; M. Bartek; A. Bossche; J.N. Burghartz;
    In Proc. Eurosensors XVII,
    University of Minho, Guimaraes, Portugal, pp. 193-196, Sep. 2003.

  17. Processability and Electrical Characteristics of Glass Substrates for RF Wafer-Level Chip-Scale Packages
    A. Polyakov; P.M. Mendes; S.M. Sinaga; M. Bartek; B. Rejaei; J.H. Correia; J.N. Burghartz;
    In Proc. 53rd Electronic Components and Technology Conference,
    New Orleans, Louisiana, USA, pp. 875-880, May 2003. ISBN 0-7803-7430-4.
    document

  18. Design and Analysis of a 6 GHz Chip Antenna on Glass Substrates for Integration with RF/Wireless Microsystems
    P.M. Mendes; J. H. Correia; M. Bartek; J.N. Burghartz;
    In Proc. 2003 IEEE AP-S,
    Columbus, Ohio, USA, pp. 667-670, Jun. 2003. ISBN 0-7803-7846-6.
    document

  19. Area-Selective Adhesive Bonding Using Photosensitive BCB for WLCSP Applications
    A. Polyakov; M. Bartek; J.N. Burghartz;
    In Polytronic 2003, 3rd International IEEE Conference on Polymers and Adhesives Microelectronics and Photonics,
    Montreux, Switzerland, Lab. TIMA, France, Oct. 2003. ISBN 2-84813-023.
    document

  20. On-Chip Isolation in Wafer-Level Chip-Scale Packages: Substrate Thinning and Circuit Partitioning by Trenches
    S.M. Sinaga; A. Polyakov; M. Bartek; J.N. Burghartz;
    In IMAPS 2003,
    Boston, USA, IMAPS, pp. 768-773, Nov. 2003. ISBN 0-930815-71-8.

  21. Design of a Folded-Patch Chip-Size Antenna for Short-Range Communications
    P.M. Mendes; A. Polyakov; M. Bartek; J.N. Burghartz; J. H. Correia;
    In European microwave conference 2003,
    Munich, Germany, pp. 723-726, Oct. 2003. ISBN 1-58053-839-8.

  22. Extraction of Glass-Wafers Electrical Properties Based on S-Parameters Measurements of Coplanar Waveguides
    P.M. Mendes; A. Polyakov; M. Bartek; J.N. Burghartz; J. H. Correia;
    In ConfTele 2003,
    Aveiro, Portugal, Instituto de Telecom, pp. 51-54, Jun. 2003. ISBN 972-98368-2-5.

  23. Design and Tolerance Analysis of a 5.7 GHz Chip-Size Microstrip Antenna on High Resistivity Silicon
    P.M. Mendes; J. H. Correia; M. Bartek; J.N. Burghartz;
    In 2003 IEEE AP-S,
    Columbus, Ohio, USA, Jun. 2003.

  24. Integrated Chip-Size Antenna for Wireless Microsystems: Fabrication and Design Considerations
    P.M. Mendes; A. Polyakov; M. Bartek; J.N. Burghartz; J.H. Correia;
    In Proc. Eurosensors XVII,
    University of Minho, Guimaraes, Portugal, pp. 438-439, Sep. 2003. ISBN 90-73461-39-1.

  25. Mechanical Reliability of Silicon Wafers with Through-Wafer Vias for Wafer-Level Packaging
    A. Polyakov; M. Bartek; J.N. Burghartz;
    Microelectronics Reliability,
    Volume 42, Issue 9-11, pp. 1783-1788, 2002. ISSN 0026-2714.

  26. A Single-Chip CMOS Optical Microspectrometer with Light-to-Frequency Converter and Bus Interface
    J.H. Correia; G. de Graaf; M. Bartek; R.F. Wolffenbuttel;
    IEEE Journal of Solid-State Circuits,
    Volume 37, Issue 10, pp. 1344-1347, Oct. 2002. ISSN 0018-9200.

  27. Substrate Options and Add-On Process Modules for Monolithic RF Silicon Technology
    J.N. Burghartz; M. Bartek; B. Rejaei; P.M. Sarro; A. Polyakov; N.P. Pham; E. Boullaard; K.T. Ng;
    In Proc. 2002 Bipolar/BiCMOS Circuits and Technology Meeting (BCTM 2002),
    Monterey, CA, pp. 17-23, Sept. 2002. ISBN 0-7803-7562-9.

  28. Wafer-Level Chip-Scale Packaging for RF Applications
    A. Polyakov; M. Bartek; J.N. Burghartz;
    In Proc. SAFE 2002,
    Veldhoven, The Netherlands, STW, pp. 87-90, Nov. 2002. ISBN 90-73461-33-2.

  29. Analysis of Chip-Size Antennas on Lossy Substrates for Short-Range Wireless Micro Systems
    P. Mendes; J.H. Correia; M. Bartek; J.N. Burghartz;
    In Proc. SAFE 2002,
    Veldhoven, The Netherlands, STW, pp. 51-54, Nov. 2002. ISBN 90-73461-33-2.

  30. Modeling and Analysis of Substrate Coupling in Silicon Integrated Circuits
    S.M. Sinaga; M. Bartek; J.N. Burghartz;
    In Proc. SAFE 2002,
    Veldhoven, The Netherlands, STW, pp. 704-707, Nov. 2002. ISBN 90-73461-33-2.

  31. Mechanical Reliability of Silicon Wafers with Through-Wafer Vias for Wafer-Level Packaging
    A. Polyakov; M. Bartek; J.N. Burghartz;
    In F. Fantini; M. Vanzi (Ed.), Proc. 13th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis,
    Bellaria (Rimini), Italy, Oct. 2002. ISBN 0-08-044181-5.

  32. Mechanical Reliability of Micromachined Silicon Wafers with Deep Rectangular Recesses and Via-Hole Fences
    A. Polyakov; M. Bartek; J.N. Burghartz;
    In Eurosensors XVI - Part 2,
    Prague, Czech Republic, Czech Technical University, pp. 255-256, Sep. 2002. ISBN 80-01-02576-4.

  33. A CMOS optical microspectrometer with light-to-frequency converter, bus interface, and stray-light compensation
    J.H. Correia; G. de Graaf; M. Bartek; R.F. Wolffenbuttel;
    IEEE Trans. on Instrumentation and Measurement,
    Volume 50, Issue 6, pp. 1530-1537, Dec. 2001.

  34. Bulk micromachined electrostatic RMS-to-DC converter
    G. de Graaf; M. Bartek; Z. Xiao; C.J. van Mullem; R.F. Wolffenbuttel;
    IEEE Trans. on Instrumentation and Measurement,
    Volume 50, Issue 6, pp. 1508-1512, Dec. 2001.

  35. Integrated silicon microspectrometers
    S.-H. Kong; J.H. Correia; G. de Graaf; M. Bartek; R.F. Wolffenbuttel;
    IEEE Instrumentation & Measurement Magazine,
    Volume 4, Issue 3, pp. 34-38, Sept. 2001.

  36. An Investigation into Mechanical Strength of Silicon Wafers with Bulk-Micromachined Structures
    A. Polyakov; M. Bartek; J.N. Burghartz;
    In Proc. SAFE 2001,
    Veldhoven, The Netherlands, pp. 163-166, Nov. 2001. ISBN 90-73461-29-4.
    document

  37. Mechanical stability and handling-induced failure of micromachined wafers for RF applications
    A. Polyakov; M. Bartek; J.N. Burghartz;
    In 2001 Topical Meeting on Silicon Monolithic Integrated Circuits RF Systems, Digest of Papers,
    Ann Arbor, Michigan, USA, pp. 102-109, Sep. 2001. ISBN 0-7803-7129-1.

  38. Spectral analysis through electromechanical coupling
    E. Cretu; M. Bartek; R.F. Wolffenbuttel;
    Sensors and Actuators A,
    Volume 85, Issue 1-3, pp. 23-32, 2000. ISSN 0924-4247.

  39. Single-chip CMOS optical microspectrometer
    J.H. Correia; G. de Graaf; S.H. Kong; M. Bartek; R.F. Wolffenbuttel;
    Sensors and Actuators A,
    Volume 82, Issue 1-3, pp. 191-197, 2000. ISSN 0924-4247.

  40. Ultraviolet-selective avalanche photodiode
    A. Pauchard; P.-A. Besse; M. Bartek; R.F. Wolffenbuttel; R.S. Popovic;
    Sensors and Actuators A,
    Volume 82, Issue 1-3, pp. 128-134, 2000. ISSN 0924-4247.

  41. High-selectivity single-chip spectrometer in silicon for operation in visible part of the spectrum
    J.H. Correia; M. Bartek; R.F. Wolffenbuttel;
    IEEE Trans. on Electron Devices,
    Volume 47, Issue 3, pp. 553-559, Mar. 2000. ISSN 0018-9383.

  42. A Micromachining Post-Process Module for RF Silicon Technology
    N.P. Pham; K.T. Ng; M. Bartek; P. M. Sarro; B. Rejaei; J.N. Burghartz;
    In Proc. IEDM 2000,
    San Francisco, USA, pp. 481-484, Dec. 2000. ISBN 0-7803-6438-4.

  43. Bulk-micromachined electrostatic RMS-to-DC converter: Design and fabrication
    M. Bartek; Z. Xiao; C. van Mullem; R.F. Wolffenbuttel;
    In Proc. MME 2000,
    Uppsala, Sweden, Oct., 2000 2000.

  44. Infrared Micro-Spectrometer Based on a Diffraction Grating
    S.H. Kong; D.D.L. Wijngaards; M. Bartek; R.F. Wolffenbuttel;
    In R. de Reus; S. Bouwstra (Ed.), Proc. Eurosensors XIV,
    Copenhagen, Denmark, pp. 321-324, Aug., 2000 2000. ISBN 87-89935-50-0.

  45. Mechanical integrity failure of bulk-micromachined Si wafers: Influence of structure geometry and wafer handling
    M. Bartek;
    In Proc. ASDAM 2000,
    Smolenice Castle, Slovakia, pp. 227-230, Oct. 2000. ISBN 0-7803-5939-9.

  46. A neutron detector based on the Micro Gap Counter
    F.D. van den Berg; V.R. Bom; C.W.E. van Eijk; R.W. Hollander; M. Bartek; P.M. Sarro; H. Schellevis; M.W. Johnson; N.J. Rhodes;
    In C.W.E. van Eijk (Ed.), Proc. Neudess 98,
    Delft, The Netherlands, Oct. 1998. ISBN 90-73861-42.

  47. Technology characterization and application of adaptive mirrors fabricated with IC-compatible micromachining
    G. Vdovin; S. Middelhoek; M. Bartek; P.M. Sarro; D. Solomatine;
    In Proc. SPIE,
    San Diego, CA, USA, pp. 116-129, Jun. 1995.

BibTeX support

Last updated: 25 Apr 2023

Marian Bartek

Alumnus