MSc Tim Hosman

PhD student
Electronic Components, Technology and Materials (ECTM), Department of Microelectronics

Themes: Organs-on-chip


Tim Hosman is a PhD student in a collaborative project between Electronic Components, Technology and Materials (ECTM) and Electronic Circuits and Architectures (ELCA) and is focussing on implementing dielectric spectroscopy as a novel sensing technique for organs-on-chip applications. Tim is passionate about electronics with a positive societal impact, particularly medical microsystems. He received his MSc degree in Microelectronics in 2020 at the TU Delft, specialising in bioelectronics.

Tim has previously worked as an electronics design engineer in the Electronic Instrumentation (EI) group at the TUDelft, where he co-developed prototypes for portable ultrasound imaging. Namely, the ULIMPIA smart body patch and a transcranial ultrasound probe for CUBE.

For his graduation project, conducted at Fraunhofer IZM in Berlin, he worked on a high-density interconnect technology optimised for flexible implantable devices. His work involved manufacturing challenges in flip-chip bonding, transfer processes and TPU lamination, as well as theoretical challenges such as routing optimisation.

Before his MSc, Tim voluntarily dedicated a year as a Chief Electrical Engineer to Project MARCH in 2016-2017. This project is a team run by 31 students of the TU Delft that built an exoskeleton for people with paraplegia within a year, achieving second place in the Cybathlon Experience competition in 2017. Tim was the lead engineer of 4 electrical engineers and was foremost responsible for the entire concept, design and realisation of the exoskeleton’s electrical system.


  1. Dielectric spectroscopy for non-invasive sensing of multi-layered organ-on-chip devices
    T. Hosman; M. Spirito; M. Mastrangeli;
    In XXXV Eurosensors Conference,

  2. Towards a Microfabricated Flexible Graphene-Based Active Implant for Tissue Monitoring During Optogenetic Spinal Cord Stimulation
    Andrada Iulia Velea; Sten Vollebregt; Tim Hosman; Anna Pak; Vasiliki Giagka;
    In Proc. IEEE NMDC,

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Last updated: 9 Nov 2022