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Electronic Components, Technology and Materials

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Electronic Components, Technology and Materials
Department of Microelectronics
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Dong Bin Cai

Dong Bin Cai graduated at the Section Electronic Components, Technology and Materials (ECTM) in November 2017. His/her next position was at ASML.

MSc thesis: Fabrication and characterization of High aspect ratio MEMS Electrochemical Sensor
Advisor(s): GuoQi Zhang

Program: MSc Microelectronics

Dong Bin Cai, MSc

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Electronic Components, Technology and Materials

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