dr. V.A. Henneken

1. 25.8 Gb/s Submillimeter Optical Data Link Module for Smart Catheters
   Jian Li; Chenhui Li; Vincent Henneken; Marcus Louwerse; Jeannet Van Rens; Paul Dijkstra; Oded Raz; Ronald Dekker;
   Journal of Lightwave Technology,
   Volume 40, Issue 8, pp. 2456-2464, 2022. DOI: 10.1109/JLT.2021.3137981

2. Embedded High-Density Trench Capacitors for Smart Catheters
   Jian Li; Jeroen Naaborg; Marcus Louwerse; Vincent Henneken; Carlo Eugeni; Ronald Dekker;
   In 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),
   pp. 1-5, Sep. 2020. DOI: 10.1109/ESTC48849.2020.9229800

3. Pressure measurement of geometrically curved ultrasound transducer array for spatially specific stimulation of the vagus nerve
   Kawasaki, S.; Giagka, V.; de Haas, M.; Louwerse, M.; Henneken, V.; van Heesch, C.; Dekker, R.;
   In 9th International IEEE/EMBS Conference on Neural Engineering. IEEE,
   2019. DOI: 10.1109/NER.2019.8717064

4. Generic platform for the miniaturization of bioelectronic implants
   M. M. Kluba; J. W. Weekamp; M. Louwerse; V. Henneken; R. Dekker;
   In Design of Medical Devices Conference (DMD Europe),
   2017.

5. High Definition Flex-to-Rigid (HD F2R): an Interconnect Substrate Technology
   Ronald Stoute; Marcus C. Louwerse; Vincent A. Henneken; Ronald Dekker;
   In ICT.OPEN,
   2016.

6. Intravascular Ultrasound at the Tip of a Guidewire: Concept and First Assembly Steps
   Ronald Stoute; Marcus C. Louwerse; Vincent A. Henneken; Ronald Dekker;
   In Procedia Engineering: Proceedings of the 30th anniversary Eurosensors Conference,
   pp. 1563-1567, 2016.

7. Flexible/Stretchable Ultrasound Body Patches
   Shivani Joshi; Sourush Yazdi; Vincent Henneken; Rene Sanders; Ronald Dekker;
   In ICT.OPEN Conference,
   2016.

8. Origami assembly platform for smart medical instruments
   R. Stoute; M. C. Louwerse; V. A. Henneken; R. Dekker;
   In 28th Conference of the international Society for Medical Innovation and Technology (iSMIT) / 4th Design of Medical Devices Conference,
   2016.
   document

9. Conformable Body Patches for Ultrasound Applications
   S. Joshi; S. Yazadi; V. Henneken; R. Sanders; R. Dekker;
   In 17th IEEE Electronics Packaging Technology Conference,
   2015.

10. Miniaturized Optical Data Link Assembly for 360 �m Guidewires
    Stoute, Ronald; Louwerse, Marcus C.; van Rens, Jeannet; Henneken, Vincent A.; Dekker, Ronald;
    In ICT.OPEN Conference,
    pp. 46-51, 2015.
    document

11. A post processing approach for manufacturing high-density stretchable sensor arrays
    A. Savov; S. Khoshfetrat Pakazad; S. Joshi; V. Henneken; R. Dekker;
    In IEEE Sensors,
    pp. 1703-1705, 2014.

12. Residue-free plasma etching of polyimide coatings for small pitch vias with improved step coverage
    B. Mimoun; H.T.M. Pham; V. Henneken; R. Dekker;
    Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures,
    Volume 31, Issue 2, pp. 021201-021201-6, Mar. 2013. DOI 10.1116/1.4788795.

13. Flex-to-Rigid (F2R): A Generic Platform for the Fabrication and Assembly of Flexible Sensors for Minimally Invasive Instruments
    Benjamin Mimoun; Vincent Henneken; Arjen van der Horst; Ronald Dekker;
    IEEE Sensors Journal,
    Volume 13, Issue 10, 2013. DOI: 10.1109/JSEN.2013.2252613

14. Ultra-flexible devices for 360 _m diameter guidewires
    B. Mimoun; V. Henneken; P.M. Sarro; R. Dekker;
    In 25th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2012),
    Paris, France, IEEE, pp. 472-475, Jan. 2012. ISBN: 978-978-1-4673-0325-5, DOI 10.1109/MEMSYS.2012.6170227.

15. Living chips and Chips for the living
    R. Dekker; S. Braam; V. Henneken; A. van der Horst; S. Khoshfetrat Pakazad; M. Louwerse; B. van Meer; B. Mimoun; A. Savov; A. van de Stolpe;
    In Proc. of IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM 2012),
    Portland, Oregon, USA, pp. 1-9, Sep. 2012. DOI 10.1109/BCTM.2012.6352653.

16. Residue-free plasma etching of polyimide coatings
    B. Mimoun; H.T.M. Pham; V. Henneken; R. Dekker;
    In International Conference on Electronics Packaging 2012 (ICEP),
    Tokyo, Japan, pp. 265-269, Apr. 2012.

17. Ultra-flexible devices for smart invasive medical instruments
    B. Mimoun; V. Henneken; R. Dekker;
    In 3rd Flexible and Stretchable Electronics Workshop 2011,
    Berlin, Germany, Nov. 2011.

18. Flex-to-Rigid (F2R): A Novel Ultra-Flexible Technology for Smart Invasive Medical Instruments
    B. Mimoun; V. Henneken; R. Dekker;
    In Stretchable Electronics and Conformal Biointerfaces,
    Mater. Res. Soc. Symp. Proc. Volume 1271E, 2010.

19. Release and Mounting of Partially Flexible Devices Inside and Around Tubes for Smart Invasive Medical Applications
    B. Mimoun; V. Henneken; R. Dekker;
    In Proc. of 12th Electronic Packaging and Technology Conference 2010 (EPTC 2010),
    Singapore, IEEE, pp. 7-12, 2010. ISBN 978-1-4244-8561-1.

20. In-package MEMS-based thermal actuators for micro-assembly
    V. Henneken; M. Tichem; P.M.Sarro;
    J. Micromech and Microeng.,
    Volume 16, Issue 6, pp. 107-115, 2006.

21. In-package MEMS-based thermal actuators for micro-assembly
    V.A. Henneken; M. Tichem; P.M. Sarro;
    J. Micromech. Microeng.,
    Volume 16, pp. S107-S115, 2006.

22. Improved thermal U-beam actuators for micro-assembly
    V. Henneken; M. Tichem; P.M. Sarro;
    In P.Enoksson (Ed.), Proc. Eurosensors XX,
    Goteborg, Sweden, Sept. 2006.
    document

23. In-package MEMS-based thermal actuators for micro-assembly
    V. Henneken; M. Tichem; P.M. Sarro;
    In Proc. MME,
    2005.

24. Design of in-package MST-based actuators for micro-assembly
    V. Henneken; S. van der Bedem; M. Tichem; B. Karpuschewski; P.M. Sarro;
    In Proc SAFE & Prorisc 2004,
    Veldhoven, pp. 747-752, Nov. 2004. ISBN 90-73461-43X.

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