Electronic Components, Technology and Materials
Department of Microelectronics

ir. J.C. Meerwijk

PhD student
Electronic Components, Technology and Materials (ECTM), Department of Microelectronics

Themes: Micro/Nano System Integration and Reliability

Publications

  1. Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging
    Yang Liu; Joost Meerwijk; Liangliang Luo; Honglin Zhang; Fenglian Sun; Cadmus A. Yuan; GuoQi Zhang;
    Journal of Materials Science: Materials in Electronics,
    Volume 25, Issue 11, pp. 4954-4959, 2014.

BibTeX support

Last updated: 1 Mar 2016

Joost Meerwijk

Alumnus
  • Now: Ortec Finance