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Electronic Components, Technology and Materials
Department of Microelectronics
  • TU Delft
  • EEMCS
  • Microelectronics
  • ECTM
  • Research

Next-generation chip assembly processes (X.AL)

Themes: Micro/Nano System Integration and Reliability

Developing technology for ultra-high throughput and sustainable chip assembly processes.

Project data

Researchers: Ahmed Abdelwahab, Henk van Zeijl, GuoQi Zhang, Massimo Mastrangeli
Starting date: September 2021
Closing date: August 2026
Partners: Nexperia
Contact: Massimo Mastrangeli

Electronic Components, Technology and Materials

TU Delft
Fac. EEMCS
Mekelweg 4
2628 CD Delft

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