dr. J. Wei

PhD student
Electronic Components, Technology and Materials (ECTM), Department of Microelectronics

PhD thesis (Jul 2010): Silicon MEMS for Detection of Liquid and Solid Fronts
Promotor: Lina Sarro

Themes: Micro/Nano System Integration and Reliability


Jia Wei received his Ph.D. Degree in 2010 in microelectronics from Delft University of Technology in Netherlands, and the M.Sc. degree in microelectronics from Tsinghua University in China. He has a broad interests in the filed of micro-electro-mechanical systems (MEMS), especially on micro-machined sensors and actuators. His research topics in the past few years includes 3D micro-fabrication, integration of capacitive and piezoresistive sensors, polymer-based actuators and small signal detection. He has many publications in top conferences and journals in the MEMS and micro-fabrication field.

Recently he joins the solid-state-lighting (SSL) group in DIMES/ECTM division of Delft University of Technology as a post-doc researcher. His current research topic is cost-effective smart optics system for lighting application. By applying his knowledge in the micro-system and micro-fabrication, he is developing micro lens and mirrors to fulfill the requirement of dynamic light control in SSL application. He is also responsible for the development of wafer-level packaging technique for SSL. Meanwhile, he serves as reviewer for several international journals.

Projects history

Smart Optics

3D System-in-package Design Using Stacked Silicon Submount Technology

  1. Rectification in Ionic Field Effect Transistors Based on Single Crystal Silicon Nanopore
    Hao Hong; Xin Lei; Jiangtao Wei; Yang Zhang; Yulong Zhang; Jianwen Sun; Guoqi Zhang; Pasqualina M. Sarro; Zewen Liu;
    Advanced Electronic Materials,
    pp. 2300782, 2024. DOI: 10.1002/aelm.202300782

  2. Study on the controllability of the fabrication of single-crystal silicon nanopores/nanoslits with a fast-stop ionic current-monitored TSWE method
    Hao Hong; Jiangtao Wei; Xin Lei; Haiyun Chen; Pasqualina M. Sarro; Guoqi Zhang; Zewen Liu;
    Microsystems & Nanoengineering,
    Volume 9, pp. 63, 2023. DOI: 10.1038/s41378-023-00532-0

  3. A Review of Modification Methods of Solid Electrolytes for All-Solid-State Sodium-Ion Batteries
    Dai, Hanqing; Chen, Yuanyuan; Xu, Wenqian; Hu, Zhe; Gu, Jing; Wei, Xian; Xie, Fengxian; Zhang, Wanlu; Wei, Wei; Guo, Ruiqian; Zhang, Guoqi;
    Energy Technology,
    Volume 9, Issue 1, pp. 2000682, 2021. DOI: 10.1002/ente.202000682

  4. Low Leakage and High Forward Current Density Quasi-Vertical GaN Schottky Barrier Diode With Post-Mesa Nitridation
    X. Kang; Y. Sun; Y. Zheng; K. Wei; H. Wu; Y. Zhao; Xu Liu; GuoQi Zhang;
    IEEE Transactions on Electron Devices,
    Volume 68, Issue 3, pp. 1369-1373, 2021. DOI: 10.1109/TED.2021.3050739

  5. Investigating the Electrochemical Performance of Smart Self-Powered Bionic Skin Fragment Based on Bioelectricity Generation
    Dai, H.; Chen, Y.; Dai, W.; Hu, Z.; Xie, F.; Xu, W.; Cui, Z.; Wei, X.; Chen, Z.; Yang, B.; Zhang, W.; Wei, W.; Guo, R.; Zhang, GuoQi;
    Advanced Materials Technologies,
    Volume 6, Issue 3, 2021. DOI: 10.1002/admt.202000848

  6. An effective optics-electrochemistry approach to random packing density of non-equiaxed ellipsoids
    Hanqing Dai; Wenqian Xu; Zhe Hu; Yuanyuan Chen; Bobo Yang; Zhiyong Xiong; Danlu Su; Xian Wei; Shiliang Mei; Zhihao Chen; Min Li; Wanlu Zhang; Fengxian Xie; Wei Wei; Ruiqian Guo; GuoQi Zhang;
    Volume 12, pp. 100750, 2020. DOI: 10.1016/j.mtla.2020.100750

  7. Effective Approaches of Improving the Performance of Chalcogenide Solid Electrolytes for All-Solid-State Sodium-Ion Batteries
    Dai, Hanqing; Xu, Wenqian; Hu, Zhe; Chen, Yuanyuan; Wei, Xian; Yang, Bobo; Chen, Zhihao; Gu, Jing; Yang, Dan; Xie, Fengxian; Zhang, Wanlu; Guo, Ruiqian; Zhang, Guoqi; Wei, Wei;
    Frontiers in Energy Research,
    Volume 8, pp. 97, 2020. DOI: 10.3389/fenrg.2020.00097

  8. Entropy generation methodology for defect analysis of electronic and mechanical components-A review
    Miao Cai; Peng Cui; Yikang Qin; Daoshuang Geng; Qiqin Wei; Xiyou Wang; Daoguo Yang; Guoqi Zhang;
    Entropy: international and interdisciplinary journal of entropy and information studies,
    Volume 22, Issue 2, February 2020. DOI: 10.3390/e22020254

  9. Optimization of Mesa Etch for a Quasi-Vertical GaN Schottky Barrier Diode (SBD) by Inductively Coupled Plasma (ICP) and Device Characteristics
    Yue Sun; Xuanwu Kang; Yingkui Zheng; Ke Wei; Pengfei Li; Wenbo Wang; Xinyu Liu; GuoQi Zhang;
    Volume 10, Issue 4, pp. 657, Apr 2020. DOI: 10.3390/nano10040657

  10. A Low-Power MEMS IDE Capacitor with Integrated Microhotplate: Application as Methanol Sensor using a Metal-Organic Framework Coating as Affinity Layer
    Venkatesh, M.R.; Sachdeva, S.; El Mansouri, B.; Wei, J.; Bossche, A.; Bosma, D.; de Smet; L. C. P. M.; Sudhölter, E. J. R.; GuoQi Zhang;
    Sensors (Basel, Switzerland),
    2019. DOI: 10.3390/s19040888

  11. High-resolution MEMS inertial sensor combining large-displacement buckling behaviour with integrated capacitive readout
    Brahim El Mansouri; Luke M. Middelburg; Rene H. Poelma; GuoQi Zhang; Henk W. van Zeijl; Jia Wei; Hui Jiang; Johan G. Vogel; Willem D. van Driel;
    Microsystems & Nanoengineering,
    Volume 5, 2019.

  12. Review of the recent progress on GaN-based vertical power Schottky barrier diodes (SBDs)
    Yue Sun; Kang, X.; Zheng, Y.; Lu, J.; Tian, X.; Wei, K.; Wu, H.; Wang, W.; Liu, X. an GuoQi Zhang;
    Electronics (Switzerland),
    2019. DOI: 10.3390/electronics8050575

  13. MEMS Enabled Fast Time-Resolved X-Ray Diffraction Characterization Platform for Copper Nanoparticle Sintering in Heterogeneous Integration Applications
    Boyao Zhang; Jia Wei; Bottger, A. J.; van Zeijl, H. W.; Sarro, P. M.; GuoQi Zhang;
    In 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII): Proceedings. Danvers: IEEE,
    2019. DOI: 10.1109/TRANSDUCERS.2019.8808192

  14. Designing a 100 [aF/nm] capacitive transducer
    L. M. Middelburg; B. El Mansouri; R. H. Poelma; H. W. van Zeijl; Jia Wei; GuoQi Zhang; W. D. van Driel;
    In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),

  15. A tunable THz wave modulator based on graphene
    Feng Zhang; Xian-Ping Chen; Qi-qin Wei; Li-Bo Yuan; Miao Cai; Huai-Yu Ye; GuoQi Zhang Jing Xiao;
    In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018,

  16. Non-Linear Bulk Micromachined Accelerometer for High Sensitivity Applications
    Middelburg, L. M.; Mansouri, B. E.; Poelma, R.; GuoQi Zhang; Van Zeijl, H.; Wei, J.;
    In Proc. IEEE Sensors,
    2018. DOI: 10.1109/ICSENS.2018.8589630

  17. Sensitive and Reversible Detection of Methanol and Water Vapor by In Situ Electrochemically Grown CuBTC MOFs on Interdigitated Electrodes
    Sumit Sachdeva; Manjunath R. Venkatesh; Brahim El Mansouri; Jia Wei; Andre Bossche; Freek Kapteijn; GuoQi Zhang; Jorge Gascon; Louis C. P. M. de Smet; Ernst J. R. Sudhölter;
    Volume 13, Issue 29, pp. 1604150, 2017.

  18. Hybrid plasmonics slot THz waveguide for subwavelength field confinement and crosstalk between two waveguides
    J Xiao; QQ Wei; DG Yang; P Zhang; N He; GuoQi Zhang; XP Chen;
    IEEE Journal of Selected Topics in Quantum Electronics,
    Volume 23, Issue 4, 2017.

  19. A CMOS-Compatible Hybrid Plasmonic Slot Waveguide With Enhanced Field Confinement
    Jing Xiao; Qi-Qin Wei; Dao-Guo Yang; Ping Zhang; Ning He; GuoQi Zhang;
    IEEE Electron Device Letters,
    Volume 37, Issue 4, 2016.

  20. Stretchable Binary Fresnel Lens for Focus Tuning
    Xueming Li; Lei Wei; Ren� H. Poelma; Sten Vollebregt; Jia Wei; Hendrik Paul Urbach; Pasqualina M. Sarro; GuoQi Zhang;
    Scientific Reports,
    Volume 6, pp. 25348, 2016.

  21. Effect of the interruption of the propagation path on the response of surface acoustic wave transducers
    Thu Hang Bui; An Tran; Bruno Morana; Jia Wei; Trinh Chu Duc; P.M. Sarro;
    In Proceedings of the IEEE Sensors conference,

  22. 3D system-in-package design using stacked silicon submount technology
    Mingzhi Dong; Fabio Santagata; Robert Sokolovskij; Jia Wei; Cadmus Yuan; GuoQi Zhang;
    Microelectronics International,
    Volume 32, Issue 2, pp. 63-72, 2015.

  23. Tunable binary fresnel lens based on stretchable PDMS/CNT compsite
    Xueming Li; L. Wei; S. Vollebregt; R. Poelma; Y. Shen; Jia Wei; P. Urbach; P.M. Sarro; GuoQi Zhang;
    In Transducers,
    pp. 2041-2044, 2015.

  24. Fabrication and application of temperature triggered MEMS switch for active cooling control in solid state lighting system
    Huaiyu Ye; Jai Wei; van Zeijl, HW; Sarro, PM; GuoQi Zhang;
    Microelectronics Reliability,
    Volume 54, Issue 6-7, pp. 1338-1343, 2014.

  25. Flow-Through Cell Electroporation Microchip Integrating Dielectrophoretic Viable Cell Sorting
    Zewen Wei; Xueming Li; Deyao Zhao; Hao Yan; Zhiyuan Hu; Zicai Liang; Zhihong Li;
    Analytical chemistry,
    Volume 86, Issue 20, pp. 10215-10222, 2014.

  26. Stiction-Induced Sealing of Surface Micromachined Channels
    B Morana; RH Poelma; G Fiorentino; J Wei; JF Creemer; PM Sarro;
    Journal of Microelectromechanical Systems,
    Volume 23, Issue 2, pp. 459-470, 2014.

  27. Numerical modeling of flexible actuator for dynamic lighting
    Teng Ma; Xueming Li; Jia Wei; GuoQi Zhang; P. M. Sarro;
    In 15th International Conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems,

  28. Miniaturized particulate matter sensor for portable air quality monitoring devices
    Xueming Li; E Iervolino; F Santagata; Jia Wei; Cadmus Yuan; PM Sarro; GuoQi Zhang;
    In IEEE Sensors,
    pp. 2151-2154, 2014.

  29. Investigation of color shift of LEDs-based lighting products
    Koh, SW; Huaiyu Ye; Maryam Yazdan Mehr; Jia Wei; van Driel, WD; Zhao, LB; GuoQi Zhang;
    In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
    pp. 1-5, 2014.

  30. Novel system-in-package design and packaging solution for solid state lighting systems
    Mingzhi Dong; Santagata, F; Jia Wei; Yuan, C; GuoQi Zhang;
    In Proceedings - 64th Electronic Components and Technology Conference,
    pp. 1192-1197, 2014.

  31. Thermal Analysis of Remote Phosphor in LED Modules
    Mingzhi Dong; Jia Wei; Huaiyu Ye; Cadmus Yuan; GuoQi Zhang;
    Journal of Semiconductors,
    Volume 34, Issue 5, pp. 053007-1-3, 2013.

  32. Resonance frequency of locally heated cantilever beams
    E. Iervolino; M. Riccio; F. Santagata; J. Wei; A.W. van Herwaarden; A. Irace; G. Breglio; P.M. Sarro;
    Sensors and Actuators A,
    Volume 190, pp. 6-12, Feb. 2013. DOI 10.1016/j.sna.2012.10.008.

  33. Thermal Analysis for Silicon-based Integration of LED Systems
    Mingzhi Dong; Fabio Santagata; Jia Wei; Cadmus Yuan; GuoQi Zhang;
    In 10th China International Forum on Solid State Lighting,

  34. 6 DOF force and torque sensor for micro-manipulation applications
    P. Estevez; J.M. Bank; M. Porta; J. Wei; P.M. Sarro; M. Tichem; U. Staufer;
    Sensors and Actuators A,
    Volume 186, pp. 86-93, Oct. 2012. DOI 10.1016/j.sna.2012.02.037.

  35. Suspended submicron silicon-beam for high sensitivity piezoresistive force sensing cantilevers
    J. Wei; S. Magnani; P.M. Sarro;
    Sensors and Actuators A,
    Volume 186, pp. 80-85, Oct. 2012. DOI 10.1016/j.sna.2012.02.021.

  36. Linear and rotational thermal micro-stepper motors
    A. Khiat; J.W. Spronck; J. van Schieveen; S. Milosavljevic; J. Wei; P. Estevez; P.M. Sarro; U. Staufer;
    Microelectronic Engineering,
    Volume 98, pp. 497-501, Oct. 2012. DOI 10.1016/j.mee.2012.07.086.

  37. Silicon-polymer electro-thermal bimorph actuators with SiC bottom-layer for large out-of-plane motion and improved power efficiency
    M. Aarts; J. Wei; P.M. Sarro;
    In 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS 2012),
    Kyoto, Japan, pp. 253-256, Mar. 2012. ISBN: 978-1-4673-1124-3; DOI 10.1109/NEMS.2012.6196768.

  38. Single-mask fabrication of temperature triggered MEMS switch for cooling control in SSL system
    J. Wei; H. Ye; H.W. van Zeijl; P.M Sarro; GuoQi Zhang;
    In R. Walczak; J. Dziuban (Ed.), Proc. Eurosensors XXVI,
    Krakow, Poland, Procedia Engineering, pp. 849-852, Sep 2012. DOI 10.1016/j.proeng.2012.09.280.

  39. Monitoring of meniscus motion at nozzle orifice with capacitive sensor for inkjet applications
    J. Wei; C. Yue; GuoQi Zhang; J.F. Dijksman; P.M. Sarro;
    In Proc. 11th IEEE Sensors Conference,
    Taipei, Taiwan, pp. 2172-2175, Oct 2012.

  40. Dynamic thermal simulation of high brightness LEDs with unsteady driver power output
    H. Ye; S. Koh; J. Wei; H.W. van Zeijl; GuoQi Zhang;
    In 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
    Lisbon, Portugal, Apr. 2012. DOI 10.1109/ESimE.2012.6191768.

  41. Layer-by-layer deposition of colloidal semiconductor nanocrystals for integration of infrared photon-detectors on 3D topography
    J. Wei; Y. Gao; A.J. Houtepen; G. Pandraud; P.M. Sarro;
    In 16th International Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS 2011),
    Beijing, China, pp. 1749-1752, Jun. 2011. ISBN 978-1-4577-0157-3; DOI 10.1109/TRANSDUCERS.2011.5969819.

  42. 6 DOF force and torque sensor for micro-manipulation applications
    P. Estevez; J.M. Bank; M. Porta; J. Wei; P.M. Sarro; M. Tichem; U. Staufer;
    In C. Tsamis; G. Kaltas (Ed.), Proc. Eurosensors XXV,
    Athens, Greece, Procedia Engineering, pp. 39-42, Sep. 2011. DOI 10.1016/j.proeng.2011.12.010.

  43. Suspended submicron silicon-beam for high sensitivity piezoresistive sensing
    J. Wei; S. Magnani; P.M. Sarro;
    In C. Tsamis; G. Kaltas (Ed.), Proc. Eurosensors XXV,
    Athens, Greece, Procedia Engineering, pp. 1437-1440, Sep. 2011. DOI 10.1016/j.proeng.2011.12.355.

  44. Linear and rotation thermal micro-stepper
    A. Khiat; J. Spronck; J. van Schieveen; S. Milosavljevic; J. Wei; P. Estevez; P.M. Sarro; U. Staufer;
    In 37th International Conference on Micro and Nano Engineering (MNE 2011,
    Berlin, Germany, pp. 1, Sep. 2011.

  45. Design, fabrication and characterization of a femto-farad capacitive sensor for pico-liter liquid monitoring
    J. Wei; C. Yue; M. van der Velden; Z.L. Chen; Z.W. Liu; K.A.A. Makinwa; P.M. Sarro;
    Sensors and Actuators A,
    Volume 162, Issue 2, pp. 406-417, 2010.

  46. A silicon MEMS structure for characterization of femto-farad-level capacitive sensors with lock-in architecture
    J. Wei; C. Yue; Z.L. Chen; Z.W. Liu; P.M. Sarro;
    Journal of Micromechanics and Microengineering,
    Volume 20, Issue 6, 2010.

  47. A piezoresistive sensor for pressure monitoring at inkjet nozzle
    J. Wei; P.M. Sarro; T. Chu Duc;
    In Proc. IEEE Sensors,
    pp. 2093-2096, 2010.

  48. A position and force-distribution sensor-array for monitoring the contact condition of objects in microhandling
    J. Wei; M. M. Porta. Tichem; U. Staufer; P.M. Sarro;
    In Proc. the 23th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2010),
    pp. 623-626, 2010.

  49. Silicon MEMS for detection of liquid and solid fronts
    J. Wei;
    PhD thesis, Delft University of Technology, Jul. 2010. ISBN 978-90-8570-584-0; Promotor: prof. P.M. Sarro.

  50. Pattern transfer on a vertical cavity sidewall using SU8
    T. Verhaar; J. Wei; P.M. Sarro;
    Journal of micromechanics and microengineering,
    Volume 19, 2009.

  51. Vertical Contact Position Detection and Grasping Force Monitoring for Micro-Gripper Applications
    M. Porta; J. Wei; M. Tichem; P.M. Sarro; U. Staufer;
    In Proc. IEEE Sensors 2009 Conference,
    Christchurch, New Zealand, pp. 967-970, 2009.

  52. Characterization of Femto-Farad-Level Capacitive MEMS Sensors using Lock-in Architecture
    C. Yue; J. Wei; Z.L. Chen; Z.W. Liu; P.M. Sarro;
    In P. Pons (Ed.), Proceedings of 20th Micromechanics Europe Workshop (MME),
    Toulouse, France, LAAS-CNRS, pp. 1-4, 2009.

  53. Implementation and Characterization of a femto-Farad Capacitive Sensor for pico-Liter Liquid Monitoring.
    J. Wei; C. Yue; Z.L. Chen; Z.W. Liu; K.A.A. Makinwa; P.M. Sarro;
    In J. Brugger; D. Briand (Ed.), Eurosensors XXIII,
    Lausanne, Switzerland, Elsevier, pp. 120-123), 2009.

  54. A contact position detection and interaction force monitoring sensor for micro-assembly applications.
    J. Wei; M. Porta; M. Tichem; P.M. Sarro;
    In K Najafi & M Schmidt (Eds.), Proceedings of the 15th International Conference on Solid State Sensors, Actuators and Microsystems (Transducers 2009),
    Denver, USA, IEEE, pp. 2385-2388), 2009. ISBN 978-1-4244-4193-8.

  55. Analysis and characterization of an electrothermal silicon-polymer
    J. Wei; P.M. Sarro;
    In Proc. the 2008 annual workshop on semiconductor advances for future electronics and sensors (SAFE 2008),
    pp. 436-439, 2008.

  56. A novel semi SOI fabrication process for integrated 3D micromachining
    J. Wei; T. Chu Duc; P.M. Sarro;
    In Proc. IEEE NEMS 2008,
    pp. 717-720, 2008.

  57. An electro-thermal silicon-polymer micro-gripper for simultaneous in-plane and out-of-plane motions
    J. Wei; T. Chu Duc; P.M. Sarro;
    pp. 1466-1469, 2008.

  58. 3D Microstructuring of silicon and SU8 polymer for microsystems applications
    P.M. Sarro; J. Wei; T. Chu Duc;
    In Proc. 19th Micromechanics Europe (MME 2008),
    pp. 237-241, 2008.

  59. Highly uniform coating of vertical sidewall for 3D pattern definition
    T. Verhaar; J. Wei; P.M. Sarro;
    In Proc. 19th Micromechanics Europe (MME 2008),
    pp. 141-145, 2008.

  60. Fabrication of vertical electrodes on channel sidewall for picoliter liquid measurements
    Jia Wei; M. van der Velden; P.M. Sarro;
    In G. Delapierre; R. Puers (Ed.), Proc. Transducers 2007 Conference,
    Lyon, France, IEEE, pp. 1613-1616, Jun. 2007.

  61. Characterization of a Nozzle-Integrated Capacitive Sensor for Microfluidic Jet Systems
    M. van der Velden; J.W. Spronck; R.H. Munnig Schmidt; J. Wei; P.M. Sarro;
    In B.Mizaikoff; P.J. French (Ed.), Proc. IEEE Sensors 2007 Conf,
    Atlanta, Georgia, USA, IEEE, pp. 1241-1244, Oct. 2007.

  62. Silicon-polymer laterally stacked bimorph micro-gripper
    T. Chu Duc; G.K. Lau; J. Wei; P.M. Sarro;
    In H. Morgan (Ed.), Proc. 17th MicroMechanics Europe (MME 2006),
    Southampton, UK, pp. 197-200, Sept. 2006.

  63. Integrated Silicon-Polymer Laterally Stacked Bender for Sensing Microgrippers
    T. Chu Duc; J. Wei; P. M. Sarro; G. K. Lau;
    Daegu, Korea, Oct. 2006.

BibTeX support

Last updated: 9 Mar 2019

Jia Wei


MSc students