dr.ing. H.W. van Zeijl

Project Support
Electronic Components, Technology and Materials (ECTM), Department of Microelectronics

Themes: Flexible and Stretchable Electronics, MEMS Technology, Micro/Nano System Integration and Reliability

Biography

Dr. ing. H.W. van Zeijl was born in Wateringen, the Netherlands in 1958. He studied technical physics at the Technical College in Rijswijk where he received the engineer's diploma in 1981. In that year he joined the Interuniversity reactor institute in Delft where he worked in the field of neutron diffraction and instrumental neutron activation analysis.
In 1986 he joined the Delft Institute of Microelectronics and Submicron technology (DIMES). From 1989 till 1998 he was responsible for the mask fabrication and lithography in the DIMES IC process research sector. He developed several technology courses, a full week training for engineers from relevant fields in the industry and academia. These courses are held for more than forty times and are also given at Universities in China (Beijing, Shanghai, and Chengdu) and at companies (CNS, SHTP) in Vietnam (Ho Chi Minh city). Besides these educational activities he cooperated in different research project related to Lithography, MEMs, 3D integration, Packaging and Solid State Lighting integration.
In 2005 he received a PhD degree from Delft University of Technology, the Netherlands, based on research on bipolar transistors with self-aligned emitter-base metallization and back-wafer-aligned collector contacts. Since august 2017 Henk is a staff member at the laboratory of electonic components materials and technology (ECTM). He is a (co-) author of more than 80 technical papers and several patents.

ET4289 Integrated circuits and MEMS technology

introduction in the fabrication technologies used for Integrated Circuits and MEMS

ET4391 Advanced microelectronics packaging

Basics and state-of-the-art of semiconductor device packaging and system integration.

Next-generation chip assembly processes

Developing technology for ultra-high throughput and sustainable chip assembly processes.

Projects history

Internet of Things (IoT) security through machine learning and data sharing

High Performance Vehicle Computer and Communication System for Autonomous Driving

IoSense

Multifuntional LED Integration and Miniaturization

3D Smart Wafer Level Package for LEDs

Fast qualification of solder reliability in solid state lighting application

Solid State Lighting reliability for automotive application

The use of SiPs in all kinds of applications is only possible if its reliability can be qualified

  1. Transient thermal measurement on nano-metallic sintered die-attach joints using a thermal test chip
    R. Sattari; Dong Hu; Xu Liu; H. van Zeijl; S. Vollebregt; GuoQi Zhang;
    Applied Thermal Engineering,
    Volume 221, pp. 119503, 2023. DOI: 10.1016/j.applthermaleng.2022.119503

  2. Microfabricated albedo insensitive sun position sensor system in silicon carbide with integrated 3D optics and CMOS electronics
    Joost Romijn; Sten Vollebregt; Vincent G. de Bie; Luke M. Middelburg; Brahim El Mansouri; Henk W. van Zeijl; Alexander May; Tobias Erlbacher; Johan Leijtens; Guoqi Zhang; Pasqualina M. Sarro;
    Sensors and Actuators A: Physical,
    Volume 354, pp. 114268, 2023. DOI: 10.1016/j.sna.2023.114268

  3. Manufacturing of an In-Package Relative Humidity Sensor for Epoxy Molding Compound Packages
    Romina Sattari; Henk van Zeijl; GuoQi Zhang;
    In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2023. DOI: 10.1109/EuroSimE56861.2023.10100771

  4. Low Temperature Fine Pitch All-Copper Interconnects Combining Photopatternable Underfill Films
    Xinrui Ji; Henk Van Zeijl; Weiping Jiao; Shan He; Leiming Du; Guoqi Zhang;
    In Proc. of Electronic Components and Technology Conference (ECTC),
    2023.

  5. A Thin-Film Reconfigurable SiC Thermal Test Chip for Reliability Monitoring in Harsh Environments
    Romina Sattari; Henk van Zeijl; GuoQi Zhang;
    In Proc. of Electronic Components and Technology Conference (ECTC),
    2023.

  6. Design And Fabrication Of A Smart Vaporasing Liquid Microthruster For Cubesat Applications
    Georgios Spernovasilis; Henk W. van Zeijl; Pasqualina M. Sarro;
    In 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS 2023),
    2023.

  7. Silicon Carbide-on-Insulator Thermal-Piezoresistive Resonator for Harsh Environment Application
    Baoyun Sun; Jiarui Mo; Hemin Zhang; Henk W. van Zeijl; Willem D. van Driel; GuoQi Zhang;
    In IEEE 36th Intl. Conf. on Micro Electro Mechanical Systems (MEMS2023),
    2023. DOI: 10.1109/MEMS49605.2023.10052401

  8. Integrated Digital and Analog Circuit Blocks in a Scalable Silicon Carbide CMOS Technology
    Joost Romijn; Sten Vollebregt; Luke M. Middelburg; Brahim El Mansouri; Henk W. van Zeijl; Alexander May; Tobias Erlbacher; Guoqi Zhang; Pasqualina M. Sarro;
    IEEE Transactions on Electron Devices,
    Volume 69, Issue 1, pp. 4-10, 2022. DOI: 10.1109/TED.2021.3125279

  9. Integrated 64 pixel UV image sensor and readout in a silicon carbide CMOS technology
    Joost Romijn; Sten Vollebregt; Luke M. Middelburg; Brahim El Mansouri; Henk W. van Zeijl; Alexander May; Tobias Erlbacher; Johan Leijtens; Guoqi Zhang; Pasqualina M. Sarro;
    Nature Microsystems & Nanoengineering,
    Volume 8, pp. 114, 2022. DOI: 10.1038/s41378-022-00446-3

  10. Patterning of Fine-Features in Nanoporous Films Synthesized by Spark Ablation
    Xinrui Ji; Joost van Ginkel; Dong Hu; Andreas Schmidt-Ott; Henk van Zeijl; Sten Vollebregt; GuoQi Zhang;
    In Proc. IEEE Nano,
    pp. 238-241, 2022. DOI: 10.1109/NANO54668.2022.9928705

  11. Visible Blind Quadrant Sun Position Sensor in a Silicon Carbide Technology
    Joost Romijn; Sten Vollebregt; Alexander May; Tobias Erlbacher; Henk W. van Zeijl; Johan Leijtens; GuoQi Zhang; Pasqualina M. Sarro;
    In 35th Intl. Conf. on Micro Electro Mechanical Systems (MEMS 2022),
    2022. DOI: 10.1109/MEMS51670.2022.9699533

  12. In-situ reliability monitoring of power packages using a Thermal Test Chip
    H. A. Martin; R. Sattari; E. C. P. Smits; H. W. van Zeijl; W. D. van Driel; GuoQi Zhang;
    In 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2022. DOI: 10.1109/EuroSimE54907.2022.9758913

  13. Surface-micromachined Silicon Carbide Pirani Gauges for Harsh Environments
    Jiarui Mo; Luke Middelburg; Bruno Morana; H.W. Van Zeijl; Sten Vollebregt; GuoQi Zhang;
    IEEE Sensors Letters,
    Volume 21, Issue 2, pp. 1350-1358, 2021. DOI: 10.1109/JSEN.2020.3019711

  14. Monolithic Integration of a Smart Temperature Sensor on a Modular Silicon-based Organ-on-a-chip Device
    Ronaldo Martins da Ponte; Nikolas Gaio; Henk van Zeijl; Sten Vollebregt; Paul Dijkstra; Ronald Dekker; Wouter A. Serdijn; Vasiliki Giagka;
    Sensors and Actuators A: Physical,
    Volume 317, pp. 112439, 2021. DOI: 10.1016/j.sna.2020.112439
    document

  15. Towards a Scalable Sun Position Sensor with Monolithic Integration of the 3d Optics for Miniaturized Satellite Attitude Control
    J. Romijn; S. Vollebregt; H. W. van Zeijl; G. Zhang; J. Leijtens; P. M. Sarro;
    In 2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS),
    pp. 642-645, Jan 2021. DOI: 10.1109/MEMS51782.2021.9375434

  16. Resistive and PTAT Temperature Sensors in a Silicon Carbide CMOS Technology
    Joost Romijn; Luke M. Middelburg; Sten Vollebregt; Brahim El Mansouri; Henk W. van Zeijl; Alexander May; Tobias Erlbacher; Guoqi Zhang; and Pasqualina M. Sarro;
    In Proc. of IEEE Sensors,
    2021.

  17. Design and Fabrication of a Multi-Functional Programmable Thermal Test Chip
    R. Sattari; H. van Zeijl; GuoQi Zhang;
    In 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC),
    2021. DOI: 10.23919/EMPC53418.2021.9584984

  18. Toward a Self-Sensing Piezoresistive Pressure Sensor for all-SiC Monolithic Integration
    L.M. Middelburg; H.W. van Zeijl; S. Vollebregt; B. Morana; GuoQi Zhang;
    IEEE Sensors,
    Volume 20, Issue 19, pp. 11265-11274, 2020. DOI: 10.1109/JSEN.2020.2998915

  19. Wafer Scale Flexible Interconnect Transfer for Hetrogeneous Integration
    Pan Liu; Jian Li; Henk van Zeijl; GuoQi Zhang;
    In 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
    United States, IEEE, pp. 817--823, 06 2020. DOI: 10.1109/ECTC32862.2020.00133

  20. High-resolution MEMS inertial sensor combining large-displacement buckling behaviour with integrated capacitive readout
    Brahim El Mansouri; Luke M. Middelburg; Rene H. Poelma; GuoQi Zhang; Henk W. van Zeijl; Jia Wei; Hui Jiang; Johan G. Vogel; Willem D. van Driel;
    Microsystems & Nanoengineering,
    Volume 5, 2019.
    document

  21. MEMS Enabled Fast Time-Resolved X-Ray Diffraction Characterization Platform for Copper Nanoparticle Sintering in Heterogeneous Integration Applications
    Boyao Zhang; Jia Wei; Bottger, A. J.; van Zeijl, H. W.; Sarro, P. M.; GuoQi Zhang;
    In 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII): Proceedings. Danvers: IEEE,
    2019. DOI: 10.1109/TRANSDUCERS.2019.8808192

  22. Wafer-scale integration of CVD graphene on CMOS devices using a transfer-free approach
    Sten Vollebregt; Joost Romijn; Henk W. van Zeijl; Pasqualina M. Sarro;
    In Graphene Week,
    2019.

  23. A wafer-scale process for the monolithic integration of CVD graphene and CMOS logic for smart MEMS/NEMS sensors
    Joost Romijn; Sten Vollebregt; Henk W. van Zeijl; Pasqualina M. Sarro;
    In IEEE 32nd International Conference on Micro Electro Mechanical Systems (MEMS). Piscataway: IEEE,
    2019. DOI: 10.1109/MEMSYS.2019.8870741

  24. Carbon Nanotube Array: Scaffolding Material for Opto, Electro, Thermo, and Mechanical Systems
    Amir M. Gheytaghi; H. van Zeijl; S. Vollebregt; R.H. Poelma; C. Silvestri; R. Ishihara; G. Q. Zhang; P. M. Sarro;
    Innovative Materials,
    Volume 3, pp. 22-25, 2018.

  25. Wafer-Scale Integration for Semi-Flexible Neural Implant Miniaturization
    Marta Kluba; Bruno Morana; Angel Savov; Henk Van Zeijl; Gregory Pandraud; Ronald Dekker;
    In Proceedings Eurosensors,
    pp. 941, 2018. DOI: 10.3390/proceedings2130941

  26. Designing a 100 [aF/nm] capacitive transducer
    L. M. Middelburg; B. El Mansouri; R. H. Poelma; H. W. van Zeijl; Jia Wei; GuoQi Zhang; W. D. van Driel;
    In 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2018.

  27. Non-Linear Bulk Micromachined Accelerometer for High Sensitivity Applications
    Middelburg, L. M.; Mansouri, B. E.; Poelma, R.; GuoQi Zhang; Van Zeijl, H.; Wei, J.;
    In Proc. IEEE Sensors,
    2018. DOI: 10.1109/ICSENS.2018.8589630

  28. Three dimensional thermoacoustic device composed of nanoporous material and the method to fabricate such a device
    Poelma, R.; GuoQi Zhang, G. Q.; Yi, H.; van Zeijl, H.;
    Patent, NL 2017268, 2018. IPC No. H04R, Priority date 1 Aug 2016, Priority No. NL 2017268.

  29. Effect of droplet shrinking on surface acoustic wave response in microfluidic applications
    Thu Hang Bui; Van Nguyen; Sten Vollebregt; Bruno Morana; Henk van Zeijl; Trinh Chu Duc; P.M. Sarro;
    Applied Surface Science,
    Volume 426, pp. 253-261, 2017.
    document

  30. Silicon-based multi-functional wafer-level-package for LEDs in 7-mask BiCMOS process
    Zahra Kolahdouz; T Ma; H Abdy; M Kolahdouz; H van Zeijl; GuoQi Zhang;
    Sensors and Actuators A: Physical,
    Volume 263, pp. 622-632, 2017.

  31. Monolithically integrated light feedback control circuit for blue/UV LED smart package
    Zahra K Esfahani; M Tohidian; H van Zeijl; M Kolahdouz; GuoQi Zhang;
    IEEE Photonics Journal,
    Volume 9, Issue 2, pp. 1-13, 2017.

  32. High aspect ratio spiral resonators for process variation investigation and MEMS applications
    L. Middelburg; B. El Mansouri; H. van Zeijl; GuoQi Zhang; R. H. Poelma;
    In Proc. IEEE Sensors,
    2017.

  33. Smart Systems Integration in the era of Solid State Lighting
    GuoQi Zhang; H. van Zeijl; W.D. van Driel; R. Poelma; Z.K. Esfahani; M.R. Venkatesh; L. Middelburg; B. El Mansouri;
    In Smart System Integration conference (SSI),
    2017.

  34. Output blue light evaluation for phosphor based smart white LED wafer level packages
    Z. Kolahdouz; A. Rostamian; M. Kolahdouz; T. Ma; H. van Zeijl; GuoQi Zhang;
    Optics Express,
    Volume 24, Issue 4, pp. 174-177, 2016.

  35. Effects of Nanostructure and Coating on the Mechanics of Carbon Nanotube Arrays
    R. H. Poelma; X. J. Fan; Z. Y. Hu; G. van Tendeloo; H.W. van Zeijl; GuoQi Zhang;
    Advanced Functional Materials,
    Volume 26, Issue 8, pp. 1233-1242, 2016.

  36. A transfer-free wafer-scale CVD graphene fabrication process for MEMS/NEMS sensors
    S. Vollebregt; B. Alfano; F. Ricciardella; A.J.M. Giesbers; Y. Grachova; H.W. van Zeijl; T. Polichetti; P.M. Sarro;
    In Proc. of the 29th IEEE International Conference of Micro Electro Mechanical Systems,
    pp. 17-20, 2016.

  37. Design and fabrication of a foldable 3D silicon based package for solid state lighting applications
    R. Sokolovskij; Pan Liu; H.W. van Zeijl; B. Mimoun; GuoQi Zhang;
    Journal of Micromechanics and Microengineering,
    Volume 25, Issue 5, pp. 055017, 2015.

  38. Fabrication and application of temperature triggered MEMS switch for active cooling control in solid state lighting system
    Huaiyu Ye; Jai Wei; van Zeijl, HW; Sarro, PM; GuoQi Zhang;
    Microelectronics Reliability,
    Volume 54, Issue 6-7, pp. 1338-1343, 2014.

  39. Electrical-thermal-luminous-chromatic model of phosphor-converted white light-emitting diodes
    Huaiyu Ye; Sau Wee Koh; Cadmus Yuan; Henk van Zeijl; Alexander W.J. Gielen; Shi-Wei Ricky Lee; GuoQi Zhang;
    Applied Thermal Engineering,
    Volume 63, Issue 2, pp. 588-597, 2014.

  40. Self-healing thermally conductive adhesives
    Lafont, UL; Moreno Belle, C.; Zeijl, HW van; Zwaag, S van der;
    Journal of Intelligent Material Systems and Structures,
    Volume 25, Issue 1, pp. 67-74, 2014.

  41. Tailoring the Mechanical Properties of High-Aspect-Ratio Carbon Nanotube Arrays using Amorphous Silicon Carbide Coatings
    Poelma, RH; Morana, Bruno; Vollebregt, Sten; Schlangen, Erik; van Zeijl, HW; Fan, Xuejun; Zhang, GuoQi;
    Advanced Functional Materials,
    Volume 24, Issue 36, pp. 5737-5744, 2014.
    document

  42. A polymer based miniature loop heat pipe with silicon substrate and temperature sensors for high brightness light-emitting
    Huaiyu Ye; Sokolovskij, R; van Zeijl, HW; Gielen, AWJ; GuoQi Zhang;
    Microelectronics Reliability,
    Volume 54, Issue 6-7, pp. 1355-1362, 2014.

  43. Modeling and simulation of monolithic integration of rectifiers for solid state lighting applications
    Venkatesh, MR; Liu, P; van Zeijl, HW; GuoQi Zhang;
    In Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
    pp. 1-6, 2014.

  44. High aspect ratio lithography for litho-defined wire bonding
    Esfahani, ZK; van Zeijl, HW; GuoQi Zhang;
    In Proceedings - 64th Electronic Components and Technology Conference,
    pp. 1556-1561, 2014.

  45. Through-polymer via (TPV) and method to manufacture such a via
    H.W. van Zeijl; R.H. Poelma; GuoQi Zhang;
    Dutch patent, 2014.

  46. Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems
    F. Santagata; C. Farriciello; G. Fiorentino; H.W. van Zeijl; C. Silvestri; GuoQi Zhang; P.M. Sarro;
    Journal of Micromechanics and Microengineering,
    2013.

  47. An approach to ´┐ŻDesign for Reliability´┐Ż in solid state lighting systems at high temperatures
    S. Tarashioon; A. Baiano; H. van Zeijl; C. Guo; S.W. Koh; W.D. van Driel; GuoQi Zhang;
    Microelectronics Reliability,
    Volume 52, Issue 5, pp. 783-793, May 2012. DOI 10.1016/j.microrel.2011.06.029.

  48. High accuracy dual side overlay with wet anisotropic etching for HAR MEMS
    H.W. van Zeijl; K. Best; P.M. Sarro;
    In Technical Proceedings of the 2012 NSTI Nanotechnology Conference and Expo (NSTI-Nanotech 2012),
    pp. 180-183, 2012. ISBN 978-1-4665-6275-2.

  49. Single-mask fabrication of temperature triggered MEMS switch for cooling control in SSL system
    J. Wei; H. Ye; H.W. van Zeijl; P.M Sarro; GuoQi Zhang;
    In R. Walczak; J. Dziuban (Ed.), Proc. Eurosensors XXVI,
    Krakow, Poland, Procedia Engineering, pp. 849-852, Sep 2012. DOI 10.1016/j.proeng.2012.09.280.

  50. Simulation and qualification of a system-in-package (SiP) based solid state lighting (SSL) module
    D.M. Farley; F. Boschman; J.E. Bullema; A.W.J. Gielen; P. Hesen; J.P.H.M. Krugers; F. Swartjes; H.W. van Zeijl; GuoQi Zhang;
    In Proc. 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
    Cascais, Portugal, pp. 1-3, Apr 2012. ISBN 978-1-4673-1511-1; DOI 10.1109/ESimE.2012.6191780.

  51. Dynamic thermal simulation of high brightness LEDs with unsteady driver power output
    H. Ye; S. Koh; J. Wei; H.W. van Zeijl; GuoQi Zhang;
    In 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2012),
    Lisbon, Portugal, Apr. 2012. DOI 10.1109/ESimE.2012.6191768.

  52. Enhancing the wettability of high aspect-ratio through-silicon vias lined with LPCVD silicon nitride or PE-ALD titanium nitride for void-free bottom-up copper electroplating
    M. Saadaoui; H. van Zeijl; W.H.A. Wien; H.T.M. Pham; C. Kwakernaak; H.C.M. Knoops; W.M.M. Erwin Kessels; R.M.C.M. van de Sanden; F.C. Voogt; F. Roozeboom; P.M. Sarro;
    IEEE Transactions on Components, Packaging and Manufacturing Technology,
    Volume 1, Issue 11, pp. 1728-1738, 2011. DOI 10.1109/TCPMT.2011.2167969.

  53. Stretchable array of ISFET devices for applications in biomedical imagers.
    T. Zoumpoulidis; T. Prodomakis; K. Michelakis; H.W. van Zeijl; M. Bartek; C. Toumazou; R. Dekker;
    In S.C. Mukhopadhyay (Ed.), Proc. IEEE Sensors 2009 Conference,
    Christchurch, New Zealand, IEEE, pp. 7-12, 2009. ISBN 978-1-4244-5335-1).

  54. Alignment and Overlay Characterization for 3D Integration and Advanced Packaging
    H.W. van Zeijl; P.M. Sarro;
    In Proc. of 11th Electronic packaging and Technology conference 2009 (EPTC 2009),
    Singapore, IEEE, 2009. ISBN 978-1-4244-5100-5.

  55. Oxidized ALD-deposited titanium nitride films as a low-temperature alternative for enhancing the wettability of through-silicon vias
    M. Saadaoui; H.W. van Zeijl; H.T.M. Pham; H.C. Knoops; W.M.M. Kessels; M.C.M. van de Sanden; F. Roozeboom; Y. Lamy; K.B. Jinesh; W. Besling; P.M. Sarro;
    In MRS Proceedings Volume 1112, Materials and Technologies for 3-D Integration,
    Warrendale, PA, pp. 1-8, 2009.

  56. Through Silicon Interconnect Using grayscale Lithography for MEMS Applications.
    H.W. van Zeijl; D. Liu; P.M. Sarro;
    In J. Brugger; D. Briand (Ed.), Eurosensors XXIII,
    Lausanne, Switzerland, Elsevier, pp. 1543-1546, 2009.
    document

  57. Design and characterization of a novel icp plasma tool for high speed and high accuracy drie processing
    N. Launay; H. W. van Zeijl; P. M. Sarro;
    In Proc. IEEE MEMS 2008,
    Tucson, Arizona, USA, pp. 311-314, Jan. 2008.

  58. A dual-side fabrication method for silicon plate springs with high out-of plane stiffness
    S.L.Paalvast; H.W. van Zeijl; J.Su; P.M. Sarro; J. van Eijk;
    J. Micromech. and Microeng.,
    Volume 17, Issue 7, pp. 197-203, 2007.

  59. Fabrication and characterization of high aspect ratio silicon plate springs with high out-of plane stiffness
    H.W. van Zeijl; S.L. Paalvast; J. Su; J. van Eijk; P.M. Sarro;
    In G. Delapierre; R. Puers (Ed.), Proc. Transducers 2007 Conference,
    Lyon, France, IEEE, pp. 1605-1608, Jun. 2007.

  60. Oxide to oxide wafer bonding for three dimensional (3D) IC integration technologies
    M. Cannavo; H.W. van Zeijl; G. Pandraud; J. V. Driel; T. Alan; P.M. Sarro;
    In Proc SAFE & Prorisc 2004,
    Veldhoven, The Netherlands, STW, pp. 509-512, Nov. 2007.

  61. Improvement of wettability of silicon nitride in PECVD environment for copper electrodeposition in HAR vias
    M. Saadaoui; W. Wien; H. van Zeijl; A. van den Bogaard; P.M. Sarro;
    In Proc SAFE & Prorisc 2004,
    Veldhoven, The Netherlands, STW, pp. 543-546, Nov. 2007.

  62. A novel dual-side fabrication method for silicon plate springs with high out-of plane stiffness
    H.W. van Zeijl; J. Su; S.L. Paalvast; P.M. Sarro; J. van Eijk;
    In H. Morgan (Ed.), Proc. 17th MicroMechanics Europe (MME 2006),
    Southampton, UK, pp. 209-212, Sept. 2006.
    document

  63. Low-Temperature Solid-Phase Epitaxy of Defect-Free Aluminum p+-doped Silicon for Nanoscale Device Applications
    Y. Civale; L.K. Nanver; P. Hadley; H.W. van Zeijl; E.J.G. Goudena; H. Schellevis;
    In Material Research Society Symposium Proc.,
    San Francisco, CA, 2006.
    document

  64. Lithographic alignment offset compensation for substrate transfer processes
    H. W. van Zeijl; J. Su; J. Slabbekoorn; F. G. C Bijnen;
    In Proc. STW/SAFE,
    Veldhoven, The Netherlands, pp. 121-126, 2005.
    document

  65. Base-contact proximity effects in bipolar transistors with nitride-spacer technology
    H. W. van Zeijl; L. K. Nanver;
    In Proc. of the 35th European Solid-State Device Research Conference (ESSDERC),
    Grenoble, France, pp. 461-464, Sep. 2005.
    document

  66. 3D align overlay verification using glass wafers
    E. M. J. Smeets; F. G. C. Bijnen; J. Slabbekoorn; H. W. van Zeijl;
    In Proc. SPIE,
    pp. 152-162, 2005.

  67. Front-to back-side overlay optimization after wafer bonding for 3D integration
    L. Marinier; W. van Noort; R. Pellens; B. Sutedja; R. Dekker; H. W. van Zeijl;
    In Proc. 31st International Conference on Micro- and Nano-Engineering 2005,
    Vienna, Austria, Sep. 2005.
    document

  68. LPCVD silicon nitride-on-silicon spacer technology
    H. W. van Zeijl; L. K. Nanver;
    In Proc. 20th International Symposium on Microelectronics Technology and Devices,
    Florianapolis, Brazil, Sep. 2005.
    document

  69. Bipolar transistors with self-aligned emitter-base metallization and back-wafer-aligned collector contacts
    H.W. van Zeijl;
    PhD thesis, Delft University of Technology, Apr. 2005. ISBN 90-8559-045-0; Promotors: prof. L.K. Nanver, prof. J.W. Slotboom.

  70. A Back-Wafer Contacted Silicon-On-Glass Integrated Bipolar Process - Part I: The Conflict Electrical Versus Thermal Isolation
    L.K. Nanver; N. Nenadovic; V. d Alessandro; H. H. Schellevis; W. van Zeijl; R. Dekker; D.B. de Mooij; V. Zieren; J.W. Slotboom;
    IEEE Trans. on Electron Devices,
    Volume 51, Issue 1, pp. 42-50, Jan. 2004.

  71. Characterization Waferstepper and Process Related Front- to Backwafer Overlay Errors in Bulk Micro Machining using Electrical Overlay Test Structures
    H.W. van Zeijl; F.G.C. Bijnen; J. Slabekoorn;
    In Proc. SPIE, MEMS, MOEMS and Micromachining,
    pp. 398-406, Apr. 2004. ISBN 0-8194-5378-1.

  72. Characterization of front- to backwafer bulk micromachining using electrical overlay test structures
    H. W. van Zeijl; J. Slabbekoorn;
    J. Micromech. Microeng,
    Volume 13, Issue 4, pp. S108-S112, Jul. 2003. ISSN 0960-1317.

  73. Characterization of Front- to Backwafer Alignment and Bulk Micromachining Using Electrical Overlay Test Structures
    H.W. van Zeijl; J. Slabbekoorn;
    In Proc. SPIE, Smart Sensors, Actuators and MEMS,
    pp. 617-626, May 2003.

  74. Characterization of Front to Backwafer Bulk Micromachining using Electrical Overlay Test Structures
    H.W. van Zeijl; J. Slabbekoorn;
    In Proc. 13th Micromechanics Europe Workshop (MME 2002),
    Sinaia, Romania, pp. 343-346, Oct. 2002. ISBN 973-0-02472-3.

  75. Waferstepper Alignment for MEMS Applications using Diffraction Gratings
    H.W. van Zeijl; K. Simon; J. Slabbekoorn; W. van Buel; C.Q. Gui;
    In R.P. Manginell et al. (Ed.), MRS Symposium Proc,
    San Francisco, CA, pp. 235-240, Apr. 2002. ISBN 1-55899-665-6.

  76. Epitaxy and device behaviour of collector-up SiGe HBTs with a partial p-type collector
    L.C.M. van den Oever; L.K. Nanver; T.L.M. Scholtes; H.W. van Zeijl; W. van Noort; Q.W. Ren; J.W. Slotboom;
    Solid-State Electronics,
    Volume 45, Issue 11, pp. 1899-1904, 2001. ISBN: 0038-1101.

  77. Electrical Detection and Simulation of Stress in Silicon Nitride Spacer Technology
    H.W. van Zeijl; S. Mijalkovic; L.K. Nanver;
    Journal of Material Science: Materials Electronics,
    Volume 12, pp. 339-341, 2001. ISBN: 0957-4522.

  78. Shallow trench insulation for SiGe heterojunction bipolar transistors with 25 0e epitaxial base
    H.W. van Zeijl; L.K. Nanver;
    In Proceedings of SAFE 2001,
    Veldhoven, The Netherlands, pp. 224-228, 2001. ISBN: 90-73461-29-4.
    document

  79. Electrothermal characterization of NPNs fabricated in a backwafer contacted silicon-on-glass integrated bipolar process
    N. Nenadovic; L.K. Nanver; H. H. SchellevisW. van Zeijl; J.W. Slotboom;
    In Proceedings of SAFE 2001,
    Veldhoven, The Netherlands, pp. 123-131, 2001. ISBN: 90-73461-29-4.
    document

  80. Yield improvement in High-Frequency BJT with Self-Aligned Metallization
    H.W. van Zeijl; L.K. Nanver;
    In Proc. of SAFE 99,
    Mierlo, pp. 607-610, 2001. ISBN 90-73461-18-9.

  81. Varying Characteristics of Bipolar Transistors with Emitter Contact Window Width
    J. Fu; S. Mijalkovic; W.J. Eysenga; H.W. van Zeijl; W. Crans;
    In Proc. 2001 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 01),
    Athens, Sep. 2001. ISBN 3-211-83708-6.

  82. Front- to back-wafer overlay accuracy in substrate transfer technologies
    H.W. van Zeijl; J. Slabbekoorn;
    In M. Yang, The Electrochemical Society, Inc. (Ed.), Proc. 1st International Conference on Semiconductor Technology ISTC2001, Proc,
    Shanghai, China, pp. 356-367, 2001. ISBN: 1-56677-324-5..

  83. Thermal issues in a backwafer contacted silicon-on-glass integrated bipolar process
    N. Nenadovic; L.K. Nanver; H. H. SchellevisW. van Zeijl; J.W. Slotboom;
    In G.E. Ponchak (Ed.), 2001 Topical Meeting on Silicon Monolithic Integrated Circuits RF Systems,
    Ann Arbor, MI, USA, pp. 114-121, Sep. 2001. ISBN 0-7803-7129-1.
    document

  84. A low-cost BiCMOS process with metal gates
    H.W. van Zeijl; L.K. Nanver;
    In Proc. Spring 2000 MRS Meeting,
    San Francisco, California, pp. C7.2.1-C7.2.6, Apr. 2000. ISBN 1-55899-519-6.

  85. Front- to backwafer alignment, overlay and wafer distortion in substrate transfer technologies
    H.W. van Zeijl; J. Slabbekoorn; L.K. Nanver; P.W.L. van Dijk; T. Machielsen;
    In Proc. SAFE,
    Veldhoven, pp. 163-167, 2000.

  86. The Influence of Mechanical Stresses on the Characteristics of Bipolar Transistors
    J. Fu; S. Mijalkovic; W. Eijsenga; H.W. van Zeijl; W. Crans;
    In Proc. 3rd Workshop on Semiconductor Advances for Future Electronics,
    Veldhoven, pp. 79-85, 2000.

  87. Electrical detection and simulation of stress in silicon nitride spacer technology
    H.W. van Zeijl; S. Mijalkovic; L.K. Nanver;
    In Proc. 3rd Int. Conf. on Materials for Microelectronics,
    Dublin, Ireland, pp. 231-234, Oct. 2000. ISBN 1-86125-129-7.

  88. Potential use of laser annealing in semiconductor processing
    L.K. Nanver; Q.W. Ren; R. Mallee; J. Slabbekoorn; G.J. Bertens; E.J.G. Goudena; M.R. van den Berg; H. H. SchellevisW. van Zeijl; T.L.M. Scholtes; L.C.M. van den Oever;
    In G. Zweier (Ed.), Europ. Ion Implant User Seminar,
    Bad Aibling, Germany, Sept. 1999.

  89. Ultra-low-temperature low-ohmic contacts for SOA applications
    L.K. Nanver; H.W. van Zeijl; H. Schellevis; R.J.M. Mallee; J. Slabbekoorn; R. Dekker; J.W. Slotboom;
    In 1999 Bipolar/BiCMOS Circuits and Technology Meeting,
    Minneapolis, pp. 137-140, Sept. 1999. ISBN 0-7803-5712-4.

  90. Anisotropic etching of silicon in saturated TMAHW solutions for IC-compatible micromachining
    P.M. Sarro; S. Brida; C.M.A. Ashruf; W. van d. Vlist; H. van Zeijl;
    Sensors and Materials,
    Volume 10, Issue 4, pp. 201-212, 1998.

  91. An Anisotropic U-shape SF6 Based Plasma Silicon Trench Etching Investigation
    A. Burtsev; X.Y. Li; H.W. van Zeijl; C.I.M. Beenakker;
    Microelectronic Engineering,
    Volume 40, pp. 85-97, 1998. ISSN 0167-9317.

  92. Modelling and fabrication of Geiger mode avalanche photodiodes
    W.J. Kindt; H.W. van Zeijl;
    IEEE Transactions on Nuclear Science,
    Volume 45, Issue 3, pp. 715-719, 1998.

  93. Fabrication technology of Geiger mode avalanche photodiodes
    W.J. Kindt; H.W. van Zeijl;
    In Proc. Dutch Sensor Conf,
    Twente, pp. 143-146, Mar. 1998. ISBN 0-7923-5010-3.

  94. Optical crosstalk in Geiger mode avalanche photodiode arrays: modeling, prevention and measurement
    W.J. Kindt; H.W. van Zeijl; S. Middelhoek;
    In Proc. 28th ESSDERC,
    France, pp. 192-195, Sep. 1998.

  95. Silicon nitride as dielectric in low temperature SiGe HBT processing
    Q.W. Ren; L.K. Nanver; C.R. de Boer; H.W. van Zeijl;
    Microelectronic Engineering,
    Volume 36, Issue 1-4, pp. 179-182, Jun. 1997.

  96. A silicon avalanche photodiode for single optical photon counting in the geiger mode
    W.J. Kindt; N.H. Shahrjerdy; H.W. van Zeijl;
    Sensors and Actuators A,
    Volume 60, pp. 98-102, 1997.

  97. Self-aligned metallization of high-frequency BJTs with low-stress silicon-nitride spacers
    H.W. van Zeijl; L.K. Nanver;
    In Proceedings of the 27th ESSDERC,
    Stuttgart, Germany, pp. 248-251, 22-24 1997.

  98. Fabrication of Geiger mode Avalanche Photodiodes
    W.J. Kindt; H.W. van Zeijl;
    In Proc. of the Nuclear Methods and Physics 1997. Nuclear Methods and Physics 1997,
    Austin, Sep. 1997.

  99. Fabrication of Geiger mode Avalanche Photodiodes
    W.J. Kindt; H.W. van Zeijl;
    In 1997 IEEE Nuclear Science Symposium and Medical Imaging Conference,
    Albuquerque, New Mexico, USA, Nov. 1997.

  100. Suspended membrane inductors and capacitors for application in silicon MMICs
    Y. Sun; H.W. van Zeijl; J.L. Tauritz; R.G.F. Baets;
    In IEEE 1996 Microwave and Millimeter-wave Monolithic Circuits Symposium,
    San Francisco, pp. 99-102, Jun. 1996.

  101. Anisotropic etching of silicon in saturated TMAHW solutions for IC-compatible micromachining
    P.M. Sarro; S.Brida; C.M.A.Ashruf; W. van d.Vlist; H. van Zeijl;
    In Proc. ASDAM '96 Conf.,
    Smolenice, Slovakia, pp. 293-296, Oct. 1996.

  102. Optimisation of base-link in fully-implanted NPNs
    L.K. Nanver; E.J.G. Goudena; H.W. van Zeijl;
    Electronics Letters,
    Volume 29, Issue 16, pp. 1451-1452, Aug. 1993.

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