dr.ir. F. Santagata

1. Characterization of an Acetone Detector based on a Suspended WO3-Gate AlGaN/GaN HEMT Integrated with Micro-heater
   Jianwen Sun; Robert Sokolovskij; Elina Iervolino; Fabio Santagata; Zewen Liu; Pasqualina M. Sarro; GuoQi Zhang;
   IEEE Transactions on Electron Devices,
   2019. DOI: 10.1109/TED.2019.2936912
   document

2. Hydrogen sulfide detection properties of Pt-gated AlGaN/GaN HEMT-sensor
   Sokolovskij, R.; Zhang, J.; Iervolino, E.; Zhao, C.; Santagata, F.; Wang, F.; Yu, H.; Sarro, P. M.; GuoQi Zhang;
   Sensors and Actuators B: Chemical,
   2018. DOI: 10.1016/j.snb.2018.08.015

3. Integrated virtual impactor enabled PM 2.5 sensor
   Mingzhi Dong; E Iervolino; F Santagata; G Zhang; GuoQi Zhang;
   IEEE Sensors Journal,
   Volume 17, Issue 9, pp. 2814-2821, 2017.

4. Pt-AlGaN/GaN HEMT-Sensor for Hydrogen Sulfide (H2S) Detection
   R Sokolovskij; E Iervolino; C Zhao; F Santagata; F Wang; H Yu; PM Sarro; GuoQi Zhang;
   In Proceedings of Eurosensors,
   pp. 463, 2017.

5. Potential applications of electron emission membranes in medicine
   Yevgen Bilevych; Stefan E. Brunner; Hong Wah Chan; Edoardo Charbon; Harry van der Graaf; Cornelis W. Hagen; Gert Nützelf; Serge D. Pintof; Violeta Prodanović; Daan Rotman; Fabio Santagata; Lina Sarro; Dennis R. Schaar;
   Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment,
   Volume 809, pp. 171-174, 2016.

6. Silicon microfabrication based particulate matter sensor
   Mingzhi Dong; Elina Iervolino; Fabio Santagata; GuoQi Zhang;
   Sensors and Actuators A: Physical,
   Volume 247, pp. 115-124, 2016.

7. Thermal characterization of carbon nanotube foam using MEMS microhotplates and thermographic analysis
   Cinzia Silvestri; Michele Riccio; Rene Poelma; Bruno Morana; Sten Vollebregt; Fabio Santagata; Andrea Irace; GuoQi Zhang; Pasqualina M. Sarro;
   Nanoscale,
   Volume 8, pp. 8266-8275, 2016.
   document

8. Precision recess of AlGaN/GaN with controllable etching rate using ICP-RIE oxidation and wet etching
   R. Sokolovskij; J. Sun; F. Santagata; E. Iervolino; S. Li; G.Y. Zhang; P.M.Sarro; GuoQi Zhang;
   In Procedia Engineering: Proceedings of the 30th anniversary Eurosensors Conference,
   pp. 1094-1097, 2016.

9. 3D system-in-package design using stacked silicon submount technology
   Mingzhi Dong; Fabio Santagata; Robert Sokolovskij; Jia Wei; Cadmus Yuan; GuoQi Zhang;
   Microelectronics International,
   Volume 32, Issue 2, pp. 63-72, 2015.

10. Electro-thermal simulation and characterization of vertically aligned CNTs directly grown on a suspended microhoplate for thermal management applications
    C. Silvestri; P. Piacciafoco; B. Morana; F. Santagata; GuoQi Zhang; P.M. Sarro;
    In IEEE Sensors,
    pp. 827-830, 2014.
    document

11. Miniaturized particulate matter sensor for portable air quality monitoring devices
    Xueming Li; E Iervolino; F Santagata; Jia Wei; Cadmus Yuan; PM Sarro; GuoQi Zhang;
    In IEEE Sensors,
    pp. 2151-2154, 2014.

12. CNT bundles growth on microhotplates for direct measurement of their thermal properties
    C. Silvestri; B. Morana; G. Fiorentino; S. Vollebregt; G. Pandraud; F. Santagata; GuoQi Zhang; P.M. Sarro;
    In 27th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2014),
    San Francisco, USA, Jan. 2014.
    document

13. Novel system-in-package design and packaging solution for solid state lighting systems
    Mingzhi Dong; Santagata, F; Jia Wei; Yuan, C; GuoQi Zhang;
    In Proceedings - 64th Electronic Components and Technology Conference,
    pp. 1192-1197, 2014.

14. Resonance frequency of locally heated cantilever beams
    E. Iervolino; M. Riccio; F. Santagata; J. Wei; A.W. van Herwaarden; A. Irace; G. Breglio; P.M. Sarro;
    Sensors and Actuators A,
    Volume 190, pp. 6-12, Feb. 2013. DOI 10.1016/j.sna.2012.10.008.

15. Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems
    F. Santagata; C. Farriciello; G. Fiorentino; H.W. van Zeijl; C. Silvestri; GuoQi Zhang; P.M. Sarro;
    Journal of Micromechanics and Microengineering,
    2013.

16. Thermal Analysis for Silicon-based Integration of LED Systems
    Mingzhi Dong; Fabio Santagata; Jia Wei; Cadmus Yuan; GuoQi Zhang;
    In 10th China International Forum on Solid State Lighting,
    2013.

17. A CMOS-compatible metamaterial to enhance the front to back radiation ratio in terahertz antenna for sensing application
    Fiorentino, G; Syed, W; Santagata, F; Spirito, M; Pandraud, G; Neto, A; Sarro, PM; Adam, AJL;
    In Sensors, 2013 IEEE,
    IEEE, pp. 1--4, 2013.

18. Carbon Nanotube based heat-sink for solid state lighting
    F. Santagata; G. Almanno; S. Vollebregt; C Silvestri; GuoQi Zhang; P.M. Sarro;
    In 8th IEEE Int. Conf. Nano/Micro Engineered and Molecular Systems (NEMS),
    pp. 1214-1217, Apr 2013. DOI 10.1109/NEMS.2013.6559937.

19. A molybdenum MEMS microhotplate for high-temperature operation
    L. Mele; F. Santagata; E. Iervolino; M. Mihailovic; T. Rossi; A.T. Tran; H. Schellevis; J.F. Creemer; P.M. Sarro;
    Sensors and Actuators A,
    2012. DOI 10.1016/j.sna.2011.11.023.

20. Tube-shaped Pirani gauge for in situ hermeticity monitoring of SiN thin-film encapsulation
    F. Santagata; J.F. Creemer; E. Iervolino; P.M. Sarro;
    Journal of Micromechanics and Microengineering,
    Volume 22, Issue 10, Sep. 2012. DOI 10.1088/0960-1317/22/10/105025.

21. Mechanical design and characterization for MEMS thin-film packaging
    F. Santagata; J.J.M. Zaal; V.G. Huerta; L. Mele; J.F. Creemer; P.M. Sarro;
    Journal of Microelectromechanical Systems,
    Volume 21, Issue 1, pp. 100-109, Feb. 2012. DOI 10.1109/JMEMS.2011.2170817.

22. Stiction-driven sealing of surface micromachined channels
    B. Morana; G. Pandraud; F. Santagata; J.F. Creemer; P.M. Sarro;
    In 25th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2012),
    Paris, France, IEEE, pp. 329-332, Jan. 2012. ISBN 978-978-1-4673-0325-5; DOI 10.1109/MEMSYS.2012.6170202.

23. A novel approach for piezoresistivity characterization of silicon nanowires
    M. Nie; F. Santagata; T. Moh; Q.-A. Huang; P.M. Sarro;
    In Proc. 11th IEEE Sensors Conference,
    Taipei, Taiwan, pp. 1747-1750, Oct 2012.

24. Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems
    F. Santagata; G. Fiorentino; M. Nie; C. Farriciello; R. Poelma; GuoQi Zhang; P.M. Sarro;
    In Proc. 11th IEEE Sensors Conference,
    Taipei, Taiwan, pp. 668-671, Oct 2012.

25. An analytical model and verification for MEMS Pirani gauges
    F. Santagata; E. Iervolino; L. Mele; A.W. van Herwaarden; J.F. Creemer; P.M. Sarro;
    Journal of Micromechanics and Microengineering,
    Volume 21, Issue 11, pp. 1-7, 2011. DOI 10.1088/0960-1317/21/11/115007.

26. A tube-shaped buried Pirani gauge for low detection limit with small footprint
    F. Santagata; J.F. Creemer; E. Iervolino; L. Mele; A.W. van Herwaarden; P.M. Sarro;
    IEEE Journal of Microelectromechanical Systems,
    Volume 20, Issue 3, pp. 676-684, Jun. 2011. DOI 10.1109/JMEMS.2011.2127457.

27. Low temperature encapsulation of nanochannels with water inside
    C. Shen; V.R.S.S. Mokkapati; F. Santagata; A. Bossche; P.M. Sarro;
    In 16th International Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS 2011),
    Beijing, China, pp. 854-857, Jun. 2011. ISBN 978-1-4577-0157-3; DOI 10.1109/TRANSDUCERS.2011.5969464.

28. Sputtered molybdenum as conductive material for high-temperature microhotplates
    L. Mele; F. Santagata; E. Iervolino; M. Mihailovic; T. Rossi; A.T. Tran; H. Schellevis; J.F. Creemer; P.M. Sarro;
    In 16th International Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS 2011),
    Beijing, China, pp. 2690-2693, Jun. 2011. ISBN 978-1-4577-0157-3; DOI 10.1109/TRANSDUCERS.2011.5969500.

29. Self-cleaning mass calibration of a thermogravimetric device using a thin-film molybdenum
    E. Iervolino; L. Mele; F. Santagata; A.W. van Herwaarden; W. van der Vlist; J.F. Creemer; P.M. Sarro;
    In 16th International Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS 2011),
    Beijing, China, pp. 1038-1041, Jun. 2011. ISBN 978-1-4577-0157-3; DOI 10.1109/TRANSDUCERS.2011.5969167.

30. Electro-thermal analysis of MEMS microhotplates for the optimization of temperature uniformity
    L. Mele; T. Rossi; M. Riccio; E. Iervolino; F. Santagata; A. Irace; G. Breglio; J.F. Creemer; P.M. Sarro;
    In C. Tsamis; G. Kaltas (Ed.), Proc. Eurosensors XXV,
    Athens, Greece, Procedia Engineering, pp. 387-390, Sep. 2011. DOI 10.1016/j.proeng.2011.12.096.

31. An all-in-one nanoreactor for high-resolution microscopy on nanomaterials at high pressures
    J.F. Creemer; F. Santagata; B. Morana; L. Mele; T. Alan; E. Iervolino; G. Pandraud; P.M. Sarro;
    In Proc. 24th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2011),
    Cancun, Mexico, IEEE, pp. 1103-1106, Jan. 2011. ISBN 978-1-4244-9633-4; DOI 10.1109/MEMSYS.2011.5734622.

32. A silicon carbide MEMS microhotplate for nanomaterial characterization in TEM
    B. Morana; F. Santagata; L. Mele; M. Mihailovic; G. Pandraud; J.F. Creemer; P.M. Sarro;
    In 24th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2011),
    Cancun, Mexico, IEEE, pp. 380-383, Jan. 2011. ISBN 978-1-4244-9633-4; DOI 10.1109/MEMSYS.2011.5734441.

33. Co-design of wafer level thin film package assembly
    J.J.M. Zaal; F. Santagata; W.D. van Driel; GuoQi Zhang; J.F. Creemer; P.M. Sarro;
    In 12th Internat. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments Microelectronics and Microsystems (EuroSimE 2011),
    Linz, Austria, pp. 1-6, Apr. 2011. ISBN 978-1-4577-0106-1.
    document

34. Method of manufacturing a micro unit and micro unit for use in a microscope
    J.F. Creemer; G. Pandraud; F. Santagata;
    Patent No. WO2011019276, Feb. 2011.

35. Mechanical robustness and hermeticity monitoring for MEMS thin film encapsulation
    F. Santagata;
    PhD thesis, Delft University of Technology, Dec. 2011. ISBN 978-90-8570-759-2; Promotor: prof.dr. P.M. Sarro.

36. Wafer-level assembly and sealing of a MEMS nanoreactor for in situ microscopy
    L. Mele; F. Santagata; G. Pandraud; B. Morana; F. D. Tichelaar; J. F. Creemer; P. M. Sarro;
    J. Micromech. Microeng.,
    Volume 20, 2010.

37. A novel 3-D tube-shaped buried poly-Si Pirani gauge for extended dynamic range with small footprint
    Santagata; F.; E. Iervolino; Laros; J.M.W.; Groeneweg; J.; Creemer; J.F.; van Herwaarden; A.W.; P.M. Sarro and;
    In Y. Suzuki; Man Wong (Ed.), Proceedings of IEEE MEMS 2010 Conference,
    Wanchai, Hong Kong, IEEE, pp. 643-646), 2010.

38. LPCVD amorphous SiCx for freestanding electron transparent windows
    B. Morana; J.F. Creemer; F. Santagata; C.C. Fan; H.T.M. Pham; G. Pandraud; F.D. Tichelaar; P.M. Sarro;
    In Y. Suzuki; Man Wong (Ed.), Proceedings of IEEE MEMS 2010 Conference,
    Wanchai, Hong Kong, IEEE, pp. 572-575), 2010.

39. Wafer Level Encapsulation Techniques for a MEMS Microreactor with integrated Heat Exchanger
    F. Santagata; L. Mele; M. Mihailovic; B. Morana; J.F. Creemer; P.M. Sarro;
    In Proceedings of IEEE Sensors 2009 Conference,
    Christchurch, New Zealand, pp. 799-802, 2009.
    document

40. Thin-film encapsulation of a silicon field emission electron source
    F. Santagata; C.K. Yang; J.F. Creemer; P.M. Sarro;
    In s.n. (Ed.), Proceedings Eurosensors XXII,
    Dresden, Germany: Eurosensors XXII, pp. 625-628, 2008.
    document

41. Electrothermal Effects in Bipolar Differential Pairs
    L. La Spina; V. d'Alessandro; F. Santagata; N. Rinaldi; L. K. Nanver;
    In Proc. IEEE BCTM,
    Boston, USA, pp. 131-134, Oct. 2007.

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