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Electronic Components, Technology and Materials

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Electronic Components, Technology and Materials
Department of Microelectronics
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GeneralProbe stations for wafer-scale and single die DC measurements Special (sensor) characterization setups Micro/Nano System Integration and ReliabilityReliability measurement setups

Probe stations for wafer-scale and single die DC measurements

Contact: Sten Vollebregt

Measurement infrastructure to perform electrical and electro-thermal characterisation of unpackaged dies and wafers using probe needles. Measurement equipment includes semiconductor parameter analyzers, precision LCR meters and other various equipment. The setups can be controlled through IC-CAP.

Items under this topic

Cascade Summit probe station (CAS33) w. B1500A and/or E4980A

Semi-automatic probe station with 6 probe needles connected to a HP4156C semiconductor parameter analyzer and/or HP4284A LCR meter

Lab infrastructure, Apr 2020

Cascade Summit probe station (CAS34) w. E5270B and/or HP4294A

Semi-automatic probe station with 6 probe needles connected to a E5270B precision IV analyzer w. 6 E5287A HRSMU cards and/or HP4294A precision impedance analyzer

Lab infrastructure, Apr 2020

Manual probe station w. HP4156C

Lab infrastructure, Apr 2020

Cascade Summit probe station (CAS31) w. B1500A

Semi-automatic probe station with 6 probe needles connected to a B1500A semiconductor parameter analyzer

Lab infrastructure, Apr 2020

Electronic Components, Technology and Materials

TU Delft
Fac. EEMCS
Mekelweg 4
2628 CD Delft

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